DE60320847D1 - Untersuchungsverfahren und untersuchungsgerät - Google Patents
Untersuchungsverfahren und untersuchungsgerätInfo
- Publication number
- DE60320847D1 DE60320847D1 DE60320847T DE60320847T DE60320847D1 DE 60320847 D1 DE60320847 D1 DE 60320847D1 DE 60320847 T DE60320847 T DE 60320847T DE 60320847 T DE60320847 T DE 60320847T DE 60320847 D1 DE60320847 D1 DE 60320847D1
- Authority
- DE
- Germany
- Prior art keywords
- investigator
- investigation procedure
- investigation
- procedure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000011835 investigation Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2898—Sample preparation, e.g. removing encapsulation, etching
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/316—Testing of analog circuits
- G01R31/3161—Marginal testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/319—Tester hardware, i.e. output processing circuits
- G01R31/31917—Stimuli generation or application of test patterns to the device under test [DUT]
- G01R31/31926—Routing signals to or from the device under test [DUT], e.g. switch matrix, pin multiplexing
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Networks & Wireless Communication (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002360148A JP4456325B2 (ja) | 2002-12-12 | 2002-12-12 | 検査方法及び検査装置 |
PCT/JP2003/015722 WO2004053508A1 (ja) | 2002-12-12 | 2003-12-09 | 検査方法及び検査装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60320847D1 true DE60320847D1 (de) | 2008-06-19 |
Family
ID=32500976
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60320847T Expired - Lifetime DE60320847D1 (de) | 2002-12-12 | 2003-12-09 | Untersuchungsverfahren und untersuchungsgerät |
Country Status (7)
Country | Link |
---|---|
US (1) | US7301357B2 (de) |
EP (1) | EP1574866B1 (de) |
JP (1) | JP4456325B2 (de) |
KR (2) | KR100842784B1 (de) |
CN (1) | CN100432687C (de) |
DE (1) | DE60320847D1 (de) |
WO (1) | WO2004053508A1 (de) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4387125B2 (ja) * | 2003-06-09 | 2009-12-16 | 東京エレクトロン株式会社 | 検査方法及び検査装置 |
JP2005091065A (ja) * | 2003-09-16 | 2005-04-07 | Oki Electric Ind Co Ltd | 半導体装置への動作電圧供給装置及び動作電圧供給方法 |
DE102004035556B3 (de) * | 2004-07-22 | 2005-12-08 | Infineon Technologies Ag | Verfahren und Einrichtung, insbesondere probecard, zum Kalibrieren eines Halbleiter-Baulement-Test-Systems, insbesondere eines Halbleiter-Bauelement-Testgeräts |
US7609080B2 (en) * | 2005-03-22 | 2009-10-27 | Formfactor, Inc. | Voltage fault detection and protection |
US20090128171A1 (en) * | 2005-03-31 | 2009-05-21 | Katsuya Okumura | Microstructure Probe Card, and Microstructure Inspecting Device, Method, and Computer Program |
JP4573794B2 (ja) * | 2005-03-31 | 2010-11-04 | 東京エレクトロン株式会社 | プローブカードおよび微小構造体の検査装置 |
KR100666176B1 (ko) | 2005-08-04 | 2007-01-09 | 삼성전자주식회사 | 반도체 장치의 탐침정렬 확인회로 및 탐침정렬 확인방법 |
KR100734290B1 (ko) | 2005-11-28 | 2007-07-02 | 삼성전자주식회사 | 출력 채널이 공유되는 테스트 패드를 구비하는 필름형반도체 패키지 및 필름형 반도체 패키지의 테스트 방법,테스트 채널이 공유되는 패턴을 구비하는 테스트 장치 및반도체 장치 그리고 반도체 장치에서의 테스트 방법 |
JP5108238B2 (ja) * | 2006-02-24 | 2012-12-26 | 東京エレクトロン株式会社 | 検査方法、検査装置及び制御プログラム |
US20090039908A1 (en) * | 2006-04-26 | 2009-02-12 | Tokyo Electron Limited | Microstructure inspecting apparatus and microstructure inspecting method |
US7557592B2 (en) * | 2006-06-06 | 2009-07-07 | Formfactor, Inc. | Method of expanding tester drive and measurement capability |
US7649366B2 (en) * | 2006-09-01 | 2010-01-19 | Formfactor, Inc. | Method and apparatus for switching tester resources |
JP4918339B2 (ja) * | 2006-11-30 | 2012-04-18 | 日本電産リード株式会社 | 基板検査装置 |
JP2008157818A (ja) | 2006-12-25 | 2008-07-10 | Tokyo Electron Ltd | 検査方法、検査装置及びプログラムを記憶したコンピュータ読み取り可能な記憶媒体 |
JP5020261B2 (ja) * | 2006-12-27 | 2012-09-05 | 東京エレクトロン株式会社 | 検査方法、検査装置及びプログラムを記憶したコンピュータ読み取り可能な記憶媒体 |
US7768278B2 (en) * | 2007-02-14 | 2010-08-03 | Verigy (Singapore) Pte. Ltd. | High impedance, high parallelism, high temperature memory test system architecture |
JP4664334B2 (ja) * | 2007-07-20 | 2011-04-06 | 東京エレクトロン株式会社 | 検査方法 |
US20090085596A1 (en) * | 2007-09-28 | 2009-04-02 | Qimonda Ag | System and method for testing semiconductor devices |
US7924035B2 (en) * | 2008-07-15 | 2011-04-12 | Formfactor, Inc. | Probe card assembly for electronic device testing with DC test resource sharing |
DE102009050279B4 (de) * | 2009-10-21 | 2017-12-14 | Metrawatt International Gmbh | Vorrichtung und Verfahren zur Überprüfung des Widerstandes elektrischer Erdungsverbindungen |
JP6155725B2 (ja) * | 2013-03-19 | 2017-07-05 | 富士電機株式会社 | 半導体装置の検査方法及びその方法を用いた半導体装置の製造方法 |
US20230104095A1 (en) * | 2021-10-04 | 2023-04-06 | Nanya Technology Corporation | Testing device and method for testing devices under test |
CN114839405B (zh) * | 2022-07-04 | 2022-09-09 | 苏州锴威特半导体股份有限公司 | 单引脚烧录装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5057772A (en) * | 1990-05-29 | 1991-10-15 | Electro Scientific Industries, Inc. | Method and system for concurrent electronic component testing and lead verification |
US5070297A (en) * | 1990-06-04 | 1991-12-03 | Texas Instruments Incorporated | Full wafer integrated circuit testing device |
KR100212169B1 (ko) * | 1996-02-13 | 1999-08-02 | 오쿠보 마사오 | 프로브, 프로브의 제조, 그리고 프로브를 사용한 수직동작형 프로브 카드 어셈블리 |
JPH1010200A (ja) * | 1996-06-26 | 1998-01-16 | Hitachi Ltd | 半導体装置の試験方法及び半導体試験装置 |
JP3642456B2 (ja) * | 1998-02-24 | 2005-04-27 | 株式会社村田製作所 | 電子部品の検査方法および装置 |
JPH11344510A (ja) * | 1998-06-02 | 1999-12-14 | Advantest Corp | プローブカード、プローブ及び半導体試験装置 |
JP2001281296A (ja) * | 2000-03-30 | 2001-10-10 | Nec Corp | 挟み込み型の半導体ソケットおよびデュアル−トランスミッション−ライン構成の半導体測定装置 |
JP2001296335A (ja) * | 2000-04-14 | 2001-10-26 | Nec Corp | 半導体装置の検査方法及び検査装置 |
JP4841737B2 (ja) * | 2000-08-21 | 2011-12-21 | 東京エレクトロン株式会社 | 検査方法及び検査装置 |
US6897666B2 (en) * | 2002-12-31 | 2005-05-24 | Intel Corporation | Embedded voltage regulator and active transient control device in probe head for improved power delivery and method |
-
2002
- 2002-12-12 JP JP2002360148A patent/JP4456325B2/ja not_active Expired - Fee Related
-
2003
- 2003-12-09 EP EP03777392A patent/EP1574866B1/de not_active Expired - Fee Related
- 2003-12-09 CN CNB200380106057XA patent/CN100432687C/zh not_active Expired - Fee Related
- 2003-12-09 WO PCT/JP2003/015722 patent/WO2004053508A1/ja active IP Right Grant
- 2003-12-09 KR KR1020077008712A patent/KR100842784B1/ko not_active IP Right Cessation
- 2003-12-09 US US10/538,785 patent/US7301357B2/en not_active Expired - Fee Related
- 2003-12-09 DE DE60320847T patent/DE60320847D1/de not_active Expired - Lifetime
- 2003-12-09 KR KR1020057010719A patent/KR20050085594A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
KR20050085594A (ko) | 2005-08-29 |
KR20070056147A (ko) | 2007-05-31 |
JP4456325B2 (ja) | 2010-04-28 |
EP1574866A1 (de) | 2005-09-14 |
CN1726398A (zh) | 2006-01-25 |
US20060061374A1 (en) | 2006-03-23 |
KR100842784B1 (ko) | 2008-07-02 |
JP2004191208A (ja) | 2004-07-08 |
CN100432687C (zh) | 2008-11-12 |
EP1574866B1 (de) | 2008-05-07 |
US7301357B2 (en) | 2007-11-27 |
EP1574866A4 (de) | 2005-12-21 |
WO2004053508A1 (ja) | 2004-06-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |