DE60237159D1 - Verfahren zur ausbildung einer lichtabsorbierenden schicht - Google Patents
Verfahren zur ausbildung einer lichtabsorbierenden schichtInfo
- Publication number
- DE60237159D1 DE60237159D1 DE60237159T DE60237159T DE60237159D1 DE 60237159 D1 DE60237159 D1 DE 60237159D1 DE 60237159 T DE60237159 T DE 60237159T DE 60237159 T DE60237159 T DE 60237159T DE 60237159 D1 DE60237159 D1 DE 60237159D1
- Authority
- DE
- Germany
- Prior art keywords
- forming
- absorbing layer
- light absorbing
- light
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3464—Sputtering using more than one target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0623—Sulfides, selenides or tellurides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/032—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312
- H01L31/0322—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312 comprising only AIBIIICVI chalcopyrite compounds, e.g. Cu In Se2, Cu Ga Se2, Cu In Ga Se2
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/541—CuInSe2 material PV cells
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001244973 | 2001-07-06 | ||
JP2001348084 | 2001-10-10 | ||
PCT/JP2002/005730 WO2003005456A1 (en) | 2001-07-06 | 2002-06-10 | Method for forming light-absorbing layer |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60237159D1 true DE60237159D1 (de) | 2010-09-09 |
Family
ID=26620446
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60237159T Expired - Lifetime DE60237159D1 (de) | 2001-07-06 | 2002-06-10 | Verfahren zur ausbildung einer lichtabsorbierenden schicht |
Country Status (5)
Country | Link |
---|---|
US (1) | US20050006221A1 (de) |
EP (1) | EP1424735B1 (de) |
JP (1) | JP3811825B2 (de) |
DE (1) | DE60237159D1 (de) |
WO (1) | WO2003005456A1 (de) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005098968A1 (ja) * | 2004-04-09 | 2005-10-20 | Honda Motor Co., Ltd. | カルコパイライト型薄膜太陽電池用光吸収層の製造方法 |
US7833821B2 (en) * | 2005-10-24 | 2010-11-16 | Solopower, Inc. | Method and apparatus for thin film solar cell manufacturing |
AU2008297944A1 (en) * | 2007-09-11 | 2009-03-19 | Centrotherm Photovoltaics Ag | Method and apparatus for thermally converting metallic precursor layers into semiconducting layers, and also solar module |
US8779283B2 (en) * | 2007-11-29 | 2014-07-15 | General Electric Company | Absorber layer for thin film photovoltaics and a solar cell made therefrom |
JP4620105B2 (ja) * | 2007-11-30 | 2011-01-26 | 昭和シェル石油株式会社 | Cis系薄膜太陽電池の光吸収層の製造方法 |
US7842534B2 (en) * | 2008-04-02 | 2010-11-30 | Sunlight Photonics Inc. | Method for forming a compound semi-conductor thin-film |
CN101807620B (zh) * | 2009-02-17 | 2015-05-13 | 通用电气公司 | 用于薄膜光伏的吸收层及由其制成的太阳能电池 |
AU2009200640B2 (en) * | 2009-02-18 | 2015-02-05 | General Electric Company | Absorber layer for thin film photovoltaics and a solar cell made therefrom |
JP2010192690A (ja) * | 2009-02-18 | 2010-09-02 | Tdk Corp | 太陽電池の製造方法 |
JP2010232608A (ja) * | 2009-03-30 | 2010-10-14 | Honda Motor Co Ltd | カルコパイライト型太陽電池の製造方法 |
US20110023750A1 (en) * | 2009-07-28 | 2011-02-03 | Kuan-Che Wang | Ink composition for forming absorbers of thin film cells and producing method thereof |
KR101271753B1 (ko) * | 2009-11-20 | 2013-06-05 | 한국전자통신연구원 | 박막형 광 흡수층의 제조 방법, 이를 이용한 박막 태양전지 제조 방법 및 박막 태양전지 |
DE102009047483A1 (de) * | 2009-12-04 | 2011-06-09 | Sulfurcell Solartechnik Gmbh | Vorrichtung und Verfahren zur Erzeugung von Chalkopyrit-Absorberschichten in Solarzellen |
CN101814553B (zh) * | 2010-03-05 | 2011-10-05 | 中国科学院上海硅酸盐研究所 | 光辅助方法制备铜铟镓硒薄膜太阳电池光吸收层 |
EP2548218A1 (de) | 2010-03-17 | 2013-01-23 | Dow Global Technologies LLC | Auf chalcogenid basierende materialien und verbesserte verfahren zur herstellung derartiger materialien |
CN102024870B (zh) * | 2010-04-19 | 2013-07-24 | 福建欧德生光电科技有限公司 | 半导体薄膜太阳能电池的制造系统和方法 |
KR20110128580A (ko) | 2010-05-24 | 2011-11-30 | 삼성전자주식회사 | 태양 전지 제조 방법 |
TWI508179B (zh) * | 2010-07-23 | 2015-11-11 | Sunshine Pv Corp | 薄膜太陽能電池的退火裝置 |
US20120034764A1 (en) * | 2010-08-05 | 2012-02-09 | Aventa Technologies Llc | System and method for fabricating thin-film photovoltaic devices |
US20120034733A1 (en) * | 2010-08-05 | 2012-02-09 | Aventa Technologies Llc | System and method for fabricating thin-film photovoltaic devices |
JP2012079997A (ja) * | 2010-10-05 | 2012-04-19 | Kobe Steel Ltd | 化合物半導体薄膜太陽電池用光吸収層の製造方法、およびIn−Cu合金スパッタリングターゲット |
EP2487722A1 (de) | 2011-01-19 | 2012-08-15 | Hitachi, Ltd. | Lichtabsorptionsschicht |
EA020377B1 (ru) * | 2011-05-12 | 2014-10-30 | Общество С Ограниченной Ответственностью "Изовак" | Способ формирования тонких пленок cigs для солнечных батарей и устройство для его реализации |
CN102214735A (zh) * | 2011-06-11 | 2011-10-12 | 蚌埠玻璃工业设计研究院 | 一种铜铟镓硒/硫太阳电池吸收层的制备方法 |
US8642884B2 (en) * | 2011-09-09 | 2014-02-04 | International Business Machines Corporation | Heat treatment process and photovoltaic device based on said process |
US9082619B2 (en) * | 2012-07-09 | 2015-07-14 | International Solar Electric Technology, Inc. | Methods and apparatuses for forming semiconductor films |
KR101521450B1 (ko) * | 2013-01-28 | 2015-05-21 | 조선대학교산학협력단 | CuSe2를 타겟으로 하는 비셀렌화 스퍼터링 공정을 이용한 CIGS 박막 제조방법 |
US10840400B2 (en) * | 2013-08-29 | 2020-11-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Photovoltaic device with back reflector |
CN104393111A (zh) * | 2014-10-31 | 2015-03-04 | 徐东 | 一种cigs太阳能电池吸收层的制备方法 |
CN104300014A (zh) * | 2014-10-31 | 2015-01-21 | 徐东 | 一种cigs太阳能电池吸收层的制备设备及其制备方法 |
CN104538492A (zh) * | 2014-12-11 | 2015-04-22 | 兰州空间技术物理研究所 | 一种铜铟镓硒薄膜太阳电池光吸收层薄膜的制备方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4798660A (en) * | 1985-07-16 | 1989-01-17 | Atlantic Richfield Company | Method for forming Cu In Se2 films |
US5439575A (en) * | 1988-06-30 | 1995-08-08 | Board Of Trustees Of The University Of Illinois | Hybrid method for depositing semi-conductive materials |
US4915745A (en) * | 1988-09-22 | 1990-04-10 | Atlantic Richfield Company | Thin film solar cell and method of making |
JPH02217467A (ja) * | 1989-02-17 | 1990-08-30 | Pioneer Electron Corp | 対向ターゲット型スパッタリング装置 |
US4990229A (en) * | 1989-06-13 | 1991-02-05 | Plasma & Materials Technologies, Inc. | High density plasma deposition and etching apparatus |
JPH03268335A (ja) * | 1990-03-16 | 1991-11-29 | Fuji Electric Corp Res & Dev Ltd | カルコパイライト系化合物膜の生成方法 |
JPH0539562A (ja) * | 1991-08-06 | 1993-02-19 | Fuji Electric Corp Res & Dev Ltd | CuInSe2 薄膜の形成方法 |
JPH05166726A (ja) * | 1991-12-19 | 1993-07-02 | Matsushita Electric Ind Co Ltd | 化合物薄膜の製造方法 |
JPH05182911A (ja) * | 1991-12-27 | 1993-07-23 | Hitachi Ltd | スパッタ装置 |
US5667650A (en) * | 1995-02-14 | 1997-09-16 | E. I. Du Pont De Nemours And Company | High flow gas manifold for high rate, off-axis sputter deposition |
JP3249408B2 (ja) * | 1996-10-25 | 2002-01-21 | 昭和シェル石油株式会社 | 薄膜太陽電池の薄膜光吸収層の製造方法及び製造装置 |
JP3886209B2 (ja) * | 1997-06-02 | 2007-02-28 | 貞夫 門倉 | 対向ターゲット式スパッタ装置 |
US6323417B1 (en) * | 1998-09-29 | 2001-11-27 | Lockheed Martin Corporation | Method of making I-III-VI semiconductor materials for use in photovoltaic cells |
JP4389076B2 (ja) * | 1999-04-16 | 2009-12-24 | 本田技研工業株式会社 | 化合物成膜方法および装置 |
JP2001035861A (ja) * | 1999-07-23 | 2001-02-09 | Matsushita Electric Ind Co Ltd | 薄膜の製造方法および製造装置 |
JP3831592B2 (ja) * | 2000-09-06 | 2006-10-11 | 松下電器産業株式会社 | 化合物半導体薄膜の製造方法 |
-
2002
- 2002-06-10 US US10/482,750 patent/US20050006221A1/en not_active Abandoned
- 2002-06-10 JP JP2003511320A patent/JP3811825B2/ja not_active Expired - Fee Related
- 2002-06-10 EP EP02733434A patent/EP1424735B1/de not_active Expired - Fee Related
- 2002-06-10 WO PCT/JP2002/005730 patent/WO2003005456A1/ja active Application Filing
- 2002-06-10 DE DE60237159T patent/DE60237159D1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1424735A4 (de) | 2008-08-20 |
WO2003005456A1 (en) | 2003-01-16 |
JPWO2003005456A1 (ja) | 2004-10-28 |
EP1424735A1 (de) | 2004-06-02 |
EP1424735A8 (de) | 2005-04-13 |
US20050006221A1 (en) | 2005-01-13 |
JP3811825B2 (ja) | 2006-08-23 |
EP1424735B1 (de) | 2010-07-28 |
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