DE60206641T2 - Eingebettete elektrische leiter und verfahren zur herstellung - Google Patents

Eingebettete elektrische leiter und verfahren zur herstellung Download PDF

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Publication number
DE60206641T2
DE60206641T2 DE60206641T DE60206641T DE60206641T2 DE 60206641 T2 DE60206641 T2 DE 60206641T2 DE 60206641 T DE60206641 T DE 60206641T DE 60206641 T DE60206641 T DE 60206641T DE 60206641 T2 DE60206641 T2 DE 60206641T2
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DE
Germany
Prior art keywords
substrate
grooves
particles
groove
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60206641T
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German (de)
English (en)
Other versions
DE60206641D1 (de
Inventor
C. David KOSKENMAKI
N. Michael MILLER
Naiyong Jing
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Application granted granted Critical
Publication of DE60206641D1 publication Critical patent/DE60206641D1/de
Publication of DE60206641T2 publication Critical patent/DE60206641T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
    • H05B3/86—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields the heating conductors being embedded in the transparent or reflecting material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H05B3/286—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an organic material, e.g. plastic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1343—Electrodes
    • G02F1/13439—Electrodes characterised by their electrical, optical, physical properties; materials therefor; method of making
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/15—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on an electrochromic effect
    • G02F1/153—Constructional details
    • G02F1/155—Electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE60206641T 2001-08-28 2002-06-27 Eingebettete elektrische leiter und verfahren zur herstellung Expired - Lifetime DE60206641T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US941058 2001-08-28
US09/941,058 US6591496B2 (en) 2001-08-28 2001-08-28 Method for making embedded electrical traces
PCT/US2002/020480 WO2003028417A1 (en) 2001-08-28 2002-06-27 Embedded electrical traces and method for making

Publications (2)

Publication Number Publication Date
DE60206641D1 DE60206641D1 (de) 2006-02-23
DE60206641T2 true DE60206641T2 (de) 2006-06-22

Family

ID=25475859

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60206641T Expired - Lifetime DE60206641T2 (de) 2001-08-28 2002-06-27 Eingebettete elektrische leiter und verfahren zur herstellung

Country Status (6)

Country Link
US (2) US6591496B2 (enExample)
EP (1) EP1421835B1 (enExample)
JP (1) JP4243541B2 (enExample)
AT (1) ATE306804T1 (enExample)
DE (1) DE60206641T2 (enExample)
WO (1) WO2003028417A1 (enExample)

Cited By (1)

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DE102014107480A1 (de) * 2014-05-27 2015-12-03 Webasto SE Kunststoffheckscheibe mit Heckscheibenheizung und Verfahren zur Herstellung derselben

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US6816125B2 (en) * 2003-03-01 2004-11-09 3M Innovative Properties Company Forming electromagnetic communication circuit components using densified metal powder
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DE20310834U1 (de) * 2003-07-14 2003-12-24 Klopp, Hans Transparentes Gehäuse mit Versorgungsleitungen für einen elektrischen Verbraucher
US7160583B2 (en) * 2004-12-03 2007-01-09 3M Innovative Properties Company Microfabrication using patterned topography and self-assembled monolayers
JP2006261322A (ja) * 2005-03-16 2006-09-28 Jsr Corp 電磁波シールドフィルムおよびその製造方法
JP2006278617A (ja) * 2005-03-29 2006-10-12 Jsr Corp 電磁波シールドフィルム
KR100608533B1 (ko) * 2005-05-13 2006-08-08 쓰리엠 이노베이티브 프로퍼티즈 캄파니 전기 전도성이 우수한 고분자 수지 및 그 제조방법
KR20080023303A (ko) * 2005-05-18 2008-03-13 프레지던트 앤드 펠로우즈 오브 하바드 칼리지 마이크로유체 그물구조 내 전도성 경로, 마이크로회로 및마이크로구조물의 제작
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US8354160B2 (en) 2006-06-23 2013-01-15 3M Innovative Properties Company Articles having durable hydrophobic surfaces
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KR20080004021A (ko) * 2006-07-04 2008-01-09 쓰리엠 이노베이티브 프로퍼티즈 캄파니 양면의 접착력이 서로 다른 전도성 점착 테이프 및 그제조방법
US7412765B2 (en) * 2006-07-14 2008-08-19 Auden Techno Corp. Method of manufacturing a sticker type antenna
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US20080143519A1 (en) * 2006-12-19 2008-06-19 3M Innovative Properties Company Tamper-indicating radio frequency identification tag and methods of indicating tampering of a radio frequency identification tag
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KR20090054198A (ko) * 2007-11-26 2009-05-29 쓰리엠 이노베이티브 프로퍼티즈 캄파니 점착 시트의 제조방법 및 이에 의한 점착 시트
JP5739083B2 (ja) * 2008-05-08 2015-06-24 帝人株式会社 樹脂成形体及びその成形方法
KR20100090493A (ko) * 2009-02-06 2010-08-16 삼성전자주식회사 비휘발성 메모리 장치 및 그 제조 방법
GB0914961D0 (en) * 2009-08-27 2009-09-30 Appleton Steve Electrically heated window
US8813324B2 (en) 2010-03-24 2014-08-26 Western Digital (Fremont), Llc Method for providing a piezoelectric multilayer
SG184986A1 (en) 2010-04-28 2012-11-29 3M Innovative Properties Co Silicone-based material
SG185084A1 (en) 2010-04-28 2012-12-28 3M Innovative Properties Co Articles including nanosilica-based primers for polymer coatings and methods
WO2012047749A1 (en) 2010-10-06 2012-04-12 3M Innovative Properties Company Anti-reflective articles with nanosilica-based coatings and barrier layer
US20120086649A1 (en) * 2010-10-12 2012-04-12 Innovation & Infinity Global Corp. Conductive circuits for a touch panel and the manufacturing method thereof
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US9386712B2 (en) 2013-11-06 2016-07-05 Hamilton Sundstrand Corporation High-temperature environment electronic chassis
GB2520817B (en) * 2013-11-06 2017-10-04 Hamilton Sundstrand Corp High-temperature environment electronic chassis
EP2955789A1 (en) * 2014-06-12 2015-12-16 BAE Systems PLC Electro-optic windows
EP3155691B1 (en) * 2014-06-12 2021-04-07 BAE Systems PLC Electro-optic windows
KR102302150B1 (ko) * 2015-02-16 2021-09-16 한국전자통신연구원 자기장 차폐 시트 및 그 제조 방법
US10563292B2 (en) * 2015-04-09 2020-02-18 Electronics And Telecommunications Research Institute Metal material for 3-dimensional printing, method for manufacturing the same, and method for 3-dimensional printing using the same
CA3006179A1 (en) * 2015-11-17 2017-05-26 Dai Nippon Printing Co., Ltd. Heating electrode device, electrical heating glass, heat-generating plate, vehicle, window for building, sheet with conductor, conductive pattern sheet, conductive heat-generating body, laminated glass, and manufacturing method for conductive heat-generating body
FR3048659B1 (fr) * 2016-03-10 2018-04-13 Valeo Systemes D'essuyage Systeme de detection optique pour vehicule automobile
GB201613051D0 (en) 2016-07-28 2016-09-14 Landa Labs (2012) Ltd Applying an electrical conductor to a substrate
DE102017208075A1 (de) 2017-05-12 2018-11-15 Magna Powertrain Bad Homburg GmbH Bauteil mit EMV Schutz für elektronische Platine
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DE102014107480A1 (de) * 2014-05-27 2015-12-03 Webasto SE Kunststoffheckscheibe mit Heckscheibenheizung und Verfahren zur Herstellung derselben
DE102014107480B4 (de) * 2014-05-27 2016-02-04 Webasto SE Kunststoffheckscheibe mit Heckscheibenheizung und Verfahren zur Herstellung derselben
US10397985B2 (en) 2014-05-27 2019-08-27 Webasto SE Plastics rear window having a rear window heater and method for producing the same

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US6929849B2 (en) 2005-08-16
US20030042045A1 (en) 2003-03-06
US20030196830A1 (en) 2003-10-23
JP4243541B2 (ja) 2009-03-25
WO2003028417A1 (en) 2003-04-03
EP1421835A1 (en) 2004-05-26
ATE306804T1 (de) 2005-10-15
JP2005503942A (ja) 2005-02-10
EP1421835B1 (en) 2005-10-12
US6591496B2 (en) 2003-07-15
DE60206641D1 (de) 2006-02-23

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