ATE306804T1 - Eingebettete elektrische leiter und verfahren zur herstellung - Google Patents

Eingebettete elektrische leiter und verfahren zur herstellung

Info

Publication number
ATE306804T1
ATE306804T1 AT02746740T AT02746740T ATE306804T1 AT E306804 T1 ATE306804 T1 AT E306804T1 AT 02746740 T AT02746740 T AT 02746740T AT 02746740 T AT02746740 T AT 02746740T AT E306804 T1 ATE306804 T1 AT E306804T1
Authority
AT
Austria
Prior art keywords
substrate
grooves
conductive powder
line
pressure
Prior art date
Application number
AT02746740T
Other languages
German (de)
English (en)
Inventor
David C Koskenmaki
Michael N Miller
Naiyong Jing
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Application granted granted Critical
Publication of ATE306804T1 publication Critical patent/ATE306804T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
    • H05B3/86—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields the heating conductors being embedded in the transparent or reflecting material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H05B3/28—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H05B3/286—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an organic material, e.g. plastic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1343—Electrodes
    • G02F1/13439—Electrodes characterised by their electrical, optical, physical properties; materials therefor; method of making
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/15—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on an electrochromic effect
    • G02F1/153—Constructional details
    • G02F1/155—Electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Conductive Materials (AREA)
AT02746740T 2001-08-28 2002-06-27 Eingebettete elektrische leiter und verfahren zur herstellung ATE306804T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/941,058 US6591496B2 (en) 2001-08-28 2001-08-28 Method for making embedded electrical traces
PCT/US2002/020480 WO2003028417A1 (en) 2001-08-28 2002-06-27 Embedded electrical traces and method for making

Publications (1)

Publication Number Publication Date
ATE306804T1 true ATE306804T1 (de) 2005-10-15

Family

ID=25475859

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02746740T ATE306804T1 (de) 2001-08-28 2002-06-27 Eingebettete elektrische leiter und verfahren zur herstellung

Country Status (6)

Country Link
US (2) US6591496B2 (enExample)
EP (1) EP1421835B1 (enExample)
JP (1) JP4243541B2 (enExample)
AT (1) ATE306804T1 (enExample)
DE (1) DE60206641T2 (enExample)
WO (1) WO2003028417A1 (enExample)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7102522B2 (en) * 2002-12-24 2006-09-05 3M Innovative Properties Company Tamper-indicating radio frequency identification antenna and sticker, a radio frequency identification antenna, and methods of using the same
US6816125B2 (en) * 2003-03-01 2004-11-09 3M Innovative Properties Company Forming electromagnetic communication circuit components using densified metal powder
US7371452B2 (en) * 2003-04-28 2008-05-13 Eastman Kodak Company Conductive patterned sheet utilizing multi-layered conductive conduit channels
US20060110580A1 (en) * 2003-04-28 2006-05-25 Aylward Peter T Article comprising conductive conduit channels
US7138170B2 (en) * 2003-04-28 2006-11-21 Eastman Kodak Company Terminated conductive patterned sheet utilizing conductive conduits
US8062734B2 (en) * 2003-04-28 2011-11-22 Eastman Kodak Company Article comprising conductive conduit channels
US7001658B2 (en) * 2003-04-28 2006-02-21 Eastman Kodak Company Heat selective electrically conductive polymer sheet
TWI220523B (en) * 2003-05-26 2004-08-21 Ritek Corp Write once recording medium
DE10331714B4 (de) * 2003-07-11 2006-05-24 Micronas Gmbh Verfahren zur Strukturierung der Oberfläche eines Substrats
DE20310834U1 (de) * 2003-07-14 2003-12-24 Klopp, Hans Transparentes Gehäuse mit Versorgungsleitungen für einen elektrischen Verbraucher
US7160583B2 (en) * 2004-12-03 2007-01-09 3M Innovative Properties Company Microfabrication using patterned topography and self-assembled monolayers
JP2006261322A (ja) * 2005-03-16 2006-09-28 Jsr Corp 電磁波シールドフィルムおよびその製造方法
JP2006278617A (ja) * 2005-03-29 2006-10-12 Jsr Corp 電磁波シールドフィルム
KR100608533B1 (ko) 2005-05-13 2006-08-08 쓰리엠 이노베이티브 프로퍼티즈 캄파니 전기 전도성이 우수한 고분자 수지 및 그 제조방법
WO2007061448A2 (en) * 2005-05-18 2007-05-31 President And Fellows Of Harvard College Fabrication of conductive pathways, microcircuits and microstructures in microfluidic networks
US20070218258A1 (en) * 2006-03-20 2007-09-20 3M Innovative Properties Company Articles and methods including patterned substrates formed from densified, adhered metal powders
US8354160B2 (en) 2006-06-23 2013-01-15 3M Innovative Properties Company Articles having durable hydrophobic surfaces
KR20080004021A (ko) * 2006-07-04 2008-01-09 쓰리엠 이노베이티브 프로퍼티즈 캄파니 양면의 접착력이 서로 다른 전도성 점착 테이프 및 그제조방법
KR101269741B1 (ko) * 2006-07-04 2013-05-30 쓰리엠 이노베이티브 프로퍼티즈 캄파니 탄성 및 접착성을 갖는 전자기파 차단용 가스켓
US7412765B2 (en) * 2006-07-14 2008-08-19 Auden Techno Corp. Method of manufacturing a sticker type antenna
US8017308B2 (en) * 2006-08-11 2011-09-13 Battelle Memorial Institute Patterning non-planar surfaces
US20080143519A1 (en) * 2006-12-19 2008-06-19 3M Innovative Properties Company Tamper-indicating radio frequency identification tag and methods of indicating tampering of a radio frequency identification tag
DE102007020656B4 (de) 2007-04-30 2009-05-07 Infineon Technologies Ag Werkstück mit Halbleiterchips, Halbleiterbauteil und Verfahren zur Herstellung eines Werkstücks mit Halbleiterchips
KR20090054198A (ko) * 2007-11-26 2009-05-29 쓰리엠 이노베이티브 프로퍼티즈 캄파니 점착 시트의 제조방법 및 이에 의한 점착 시트
JP5739083B2 (ja) * 2008-05-08 2015-06-24 帝人株式会社 樹脂成形体及びその成形方法
KR20100090493A (ko) * 2009-02-06 2010-08-16 삼성전자주식회사 비휘발성 메모리 장치 및 그 제조 방법
GB0914961D0 (en) 2009-08-27 2009-09-30 Appleton Steve Electrically heated window
US8813324B2 (en) 2010-03-24 2014-08-26 Western Digital (Fremont), Llc Method for providing a piezoelectric multilayer
US10066109B2 (en) 2010-04-28 2018-09-04 3M Innovative Properties Company Articles including nanosilica-based primers for polymer coatings and methods
WO2011139573A2 (en) 2010-04-28 2011-11-10 3M Innovative Properties Company Silicone-based material
BR112013006753A2 (pt) 2010-10-06 2016-06-21 3M Innovative Properties Co artigos antirreflexivos com revestimentos à base de nanossílica e camada de barreira
US20120086649A1 (en) * 2010-10-12 2012-04-12 Innovation & Infinity Global Corp. Conductive circuits for a touch panel and the manufacturing method thereof
EP2445321A1 (en) * 2010-10-13 2012-04-25 Innovation & Infinity Global Corp. Conductive circuits for a touch panel and the manufacturing method thereof
GB2520817B (en) * 2013-11-06 2017-10-04 Hamilton Sundstrand Corp High-temperature environment electronic chassis
US9386712B2 (en) 2013-11-06 2016-07-05 Hamilton Sundstrand Corporation High-temperature environment electronic chassis
DE102014107480B4 (de) * 2014-05-27 2016-02-04 Webasto SE Kunststoffheckscheibe mit Heckscheibenheizung und Verfahren zur Herstellung derselben
WO2015189553A1 (en) * 2014-06-12 2015-12-17 Bae Systems Plc Electro-optic windows
EP2955789A1 (en) * 2014-06-12 2015-12-16 BAE Systems PLC Electro-optic windows
KR102302150B1 (ko) * 2015-02-16 2021-09-16 한국전자통신연구원 자기장 차폐 시트 및 그 제조 방법
US10563292B2 (en) * 2015-04-09 2020-02-18 Electronics And Telecommunications Research Institute Metal material for 3-dimensional printing, method for manufacturing the same, and method for 3-dimensional printing using the same
WO2017086381A1 (ja) * 2015-11-17 2017-05-26 大日本印刷株式会社 加熱電極装置、通電加熱ガラス、発熱板、乗り物、建築物用窓、導電体付きシート、導電性パターンシート、導電性発熱体、合わせガラスおよび導電性発熱体の製造方法
FR3048659B1 (fr) * 2016-03-10 2018-04-13 Valeo Systemes D'essuyage Systeme de detection optique pour vehicule automobile
GB201613051D0 (en) * 2016-07-28 2016-09-14 Landa Labs (2012) Ltd Applying an electrical conductor to a substrate
DE102017208075A1 (de) * 2017-05-12 2018-11-15 Magna Powertrain Bad Homburg GmbH Bauteil mit EMV Schutz für elektronische Platine
CN109085710A (zh) * 2018-10-17 2018-12-25 吴江友鑫新材料科技有限公司 一种具有电磁屏蔽效果的调色玻璃及其制备方法
DE102019201348A1 (de) 2019-02-01 2020-08-06 Lpkf Laser & Electronics Ag Metallisierte Mikrostrukturen in Glasträgern
KR102786212B1 (ko) 2019-05-06 2025-03-24 쓰리엠 이노베이티브 프로퍼티즈 컴파니 전기 전도성 요소를 포함하는 패턴화된 물품
EP4165959A4 (en) 2020-06-16 2024-07-31 3M Innovative Properties Company PATTERNED ITEM INCLUDING METAL BODIES
CN114442395B (zh) * 2022-01-26 2023-05-16 福耀玻璃工业集团股份有限公司 电致变色器件及其电极结构和制备方法、玻璃总成和车辆

Family Cites Families (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2961746A (en) * 1956-06-18 1960-11-29 Aladdin Ind Inc Printed circuits
US2963748A (en) 1957-05-27 1960-12-13 Young Lawrence John Printed circuits
US3075280A (en) 1959-10-19 1963-01-29 Bell Telephone Labor Inc Method of making printed wiring assemblies
GB993984A (en) 1962-08-24 1965-06-02 Standard Telephones Cables Ltd Improvements in or relating to electrical circuits
US3247579A (en) 1964-05-18 1966-04-26 Microwave Electronics Corp Circuit fabrication method
US3434939A (en) * 1965-10-07 1969-03-25 Fabri Tek Inc Process for making printed circuits
US3851382A (en) * 1968-12-02 1974-12-03 Telefunken Patent Method of producing a semiconductor or thick film device
US3800020A (en) 1972-03-23 1974-03-26 Cramer P Co Method of making a circuit board
CH591570A5 (enExample) 1972-11-28 1977-09-30 Buser Ag Maschf Fritz
US3932927A (en) 1973-03-05 1976-01-20 Motorola, Inc. Scannable light emitting diode array and method
US3952152A (en) 1974-10-29 1976-04-20 Teletype Corporation CRT shield
CH585611A5 (en) 1975-04-09 1977-03-15 Boccadoro Ferdinando Diamond grain surface grinding wheel mfr. - with thread cut in wheel and part filled with grain before rolling flat
US4179797A (en) 1978-03-23 1979-12-25 Xerox Corporation Method of making a resistor array
FR2430847A1 (fr) 1978-07-13 1980-02-08 Saint Gobain Vitrage chauffant et/ou d'alarme
GB2033667A (en) 1978-11-06 1980-05-21 Powers C D Improvements in circuit boards
US4381421A (en) 1980-07-01 1983-04-26 Tektronix, Inc. Electromagnetic shield for electronic equipment
NL8100601A (nl) 1981-02-09 1982-09-01 Philips Nv Ruit voorzien van elektrische draad en draad.
US4412255A (en) 1981-02-23 1983-10-25 Optical Coating Laboratory, Inc. Transparent electromagnetic shield and method of manufacturing
US4510347A (en) 1982-12-06 1985-04-09 Fine Particles Technology Corporation Formation of narrow conductive paths on a substrate
KR840009026A (ko) 1983-03-02 1984-12-20 아아르 미첼(외2) 데니스 전기 전도체를 절연 기판에 접착하는 방법
US4604678A (en) * 1983-07-18 1986-08-05 Frederick Parker Circuit board with high density electrical tracers
US5061438A (en) 1983-09-21 1991-10-29 Allied-Signal Inc. Method of making a printed circuit board
WO1985001231A1 (en) 1983-09-21 1985-03-28 Allied Corporation Method of making a printed circuit board
US5094811A (en) 1983-09-21 1992-03-10 Allied-Signal Method of making a printed circuit board
AU570309B2 (en) 1984-03-26 1988-03-10 Unisearch Limited Buried contact solar cell
US4693783A (en) 1984-12-31 1987-09-15 Gte Laboratories Incorporated Method of producing interconnections in a semiconductor integrated circuit structure
US4614837A (en) 1985-04-03 1986-09-30 Allied Corporation Method for placing electrically conductive paths on a substrate
US4759965A (en) * 1985-08-06 1988-07-26 Canon Kabushiki Kaisha Ceramic, preparation thereof and electronic circuit substrate by use thereof
US4755415A (en) 1985-10-03 1988-07-05 Fuji Photo Film Co., Ltd. Optical shutter array and method for making
US4997674A (en) 1987-06-30 1991-03-05 Akzo America Inc. Conductive metallization of substrates via developing agents
US5059485A (en) 1988-06-08 1991-10-22 Akzo America Inc. Conductive metallization of substances without developing agents
US4985601A (en) 1989-05-02 1991-01-15 Hagner George R Circuit boards with recessed traces
US5055637A (en) 1989-05-02 1991-10-08 Hagner George R Circuit boards with recessed traces
JPH033292A (ja) 1989-05-30 1991-01-09 Matsushita Electric Ind Co Ltd 回路基板及びそれを用いたイメージセンサ
US5169488A (en) 1990-10-25 1992-12-08 International Business Machines Corporation Method of forming planarized, reusable calibration grids
JP3361556B2 (ja) 1992-09-25 2003-01-07 日本メクトロン株式会社 回路配線パタ−ンの形成法
US5462624A (en) 1992-12-22 1995-10-31 Vlsi Technology, Inc. Embedded inter-connect frame
FR2708170B1 (fr) 1993-07-19 1995-09-08 Innovation Dev Cie Gle Circuits électroniques à très haute conductibilité et de grande finesse, leurs procédés de fabrication, et dispositifs les comprenant.
US5481400A (en) 1993-11-09 1996-01-02 Hughes Aircraft Company Survivable window grids
US5595943A (en) 1994-06-30 1997-01-21 Hitachi, Ltd. Method for formation of conductor using electroless plating
CA2223166A1 (en) 1995-06-06 1996-12-12 Paul L. Braun Method of producing micro-electrical conduits
US5731086A (en) * 1995-06-07 1998-03-24 Gebhardt; William F. Debossable films
US5928767A (en) * 1995-06-07 1999-07-27 Dexter Corporation Conductive film composite
US5761801A (en) * 1995-06-07 1998-06-09 The Dexter Corporation Method for making a conductive film composite
US5745989A (en) 1995-08-04 1998-05-05 Exotic Materials, Inc. Method of preparation of an optically transparent article with an embedded mesh
JPH09115334A (ja) 1995-10-23 1997-05-02 Mitsubishi Materiais Corp 透明導電膜および膜形成用組成物
JP3585244B2 (ja) 1997-02-20 2004-11-04 パレレック，インコーポレイテッド 導電体製造のための低温方法および組成物
US6103640A (en) 1997-09-12 2000-08-15 Bridgestone Corporation Electromagnetic-wave shielding and light transmitting plate
US6103033A (en) 1998-03-04 2000-08-15 Therasense, Inc. Process for producing an electrochemical biosensor
US6117781A (en) * 1999-04-22 2000-09-12 Advanced Micro Devices, Inc. Optimized trench/via profile for damascene processing
US6663786B2 (en) * 2001-06-14 2003-12-16 International Business Machines Corporation Structure having embedded flush circuitry features and method of fabricating

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EP1421835B1 (en) 2005-10-12
US20030196830A1 (en) 2003-10-23
US6591496B2 (en) 2003-07-15
US20030042045A1 (en) 2003-03-06
JP2005503942A (ja) 2005-02-10
EP1421835A1 (en) 2004-05-26
US6929849B2 (en) 2005-08-16
WO2003028417A1 (en) 2003-04-03
DE60206641D1 (de) 2006-02-23
DE60206641T2 (de) 2006-06-22
JP4243541B2 (ja) 2009-03-25

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