AU2001248586A1 - Process for forming electrical/mechanical connections - Google Patents
Process for forming electrical/mechanical connectionsInfo
- Publication number
- AU2001248586A1 AU2001248586A1 AU2001248586A AU4858601A AU2001248586A1 AU 2001248586 A1 AU2001248586 A1 AU 2001248586A1 AU 2001248586 A AU2001248586 A AU 2001248586A AU 4858601 A AU4858601 A AU 4858601A AU 2001248586 A1 AU2001248586 A1 AU 2001248586A1
- Authority
- AU
- Australia
- Prior art keywords
- mechanical connections
- forming electrical
- mass
- pin
- electronic carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/1026—Compound semiconductors
- H01L2924/1032—III-V
- H01L2924/10329—Gallium arsenide [GaAs]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49174—Assembling terminal to elongated conductor
- Y10T29/49181—Assembling terminal to elongated conductor by deforming
Abstract
A method of making a connection to a surface of an electronic carrier, the method comprising the steps of: providing a mass of malleable material on the surface of the electronic carrier; connecting the mass to said surface; and extruding the mass into a bore of a tool in order to elongate the mass so as to create a pin, or pin-like, structure having an end to which a further connection may be made.
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0009839.2 | 2000-04-20 | ||
GB0009839A GB2362504A (en) | 2000-04-20 | 2000-04-20 | Pin contacts |
GB0028595.7 | 2000-11-23 | ||
GB0028595A GB2362035B (en) | 2000-04-20 | 2000-11-23 | Forming electrical/mechincal connections |
GB0108418A GB2362036A (en) | 2000-04-20 | 2001-04-03 | Forming pin contacts to electronic devices |
GB0108418.5 | 2001-04-03 | ||
PCT/GB2001/001737 WO2001082362A2 (en) | 2000-04-20 | 2001-04-17 | Process for forming electrical/mechanical connections |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001248586A1 true AU2001248586A1 (en) | 2001-11-07 |
Family
ID=27255686
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001248586A Abandoned AU2001248586A1 (en) | 2000-04-20 | 2001-04-17 | Process for forming electrical/mechanical connections |
Country Status (6)
Country | Link |
---|---|
US (1) | US7137547B2 (en) |
EP (1) | EP1275143B1 (en) |
AT (1) | ATE371265T1 (en) |
AU (1) | AU2001248586A1 (en) |
DE (1) | DE60130111D1 (en) |
WO (1) | WO2001082362A2 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050085016A1 (en) * | 2003-09-26 | 2005-04-21 | Tessera, Inc. | Structure and method of making capped chips using sacrificial layer |
US7249702B2 (en) * | 2003-12-04 | 2007-07-31 | Kulicke And Soffa Industries, Inc. | Multi-part capillary |
US20060183270A1 (en) * | 2005-02-14 | 2006-08-17 | Tessera, Inc. | Tools and methods for forming conductive bumps on microelectronic elements |
US8143095B2 (en) | 2005-03-22 | 2012-03-27 | Tessera, Inc. | Sequential fabrication of vertical conductive interconnects in capped chips |
US7936062B2 (en) | 2006-01-23 | 2011-05-03 | Tessera Technologies Ireland Limited | Wafer level chip packaging |
US8604605B2 (en) | 2007-01-05 | 2013-12-10 | Invensas Corp. | Microelectronic assembly with multi-layer support structure |
JP4595018B2 (en) * | 2009-02-23 | 2010-12-08 | 株式会社新川 | Semiconductor device manufacturing method and bonding apparatus |
US8540136B1 (en) | 2012-09-06 | 2013-09-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods for stud bump formation and apparatus for performing the same |
US9093515B2 (en) * | 2013-07-17 | 2015-07-28 | Freescale Semiconductor, Inc. | Wire bonding capillary with working tip protrusion |
DE102014204205A1 (en) * | 2014-03-07 | 2015-09-10 | Dr. Johannes Heidenhain Gmbh | Device for measuring the oscillation amplitude of a capillary of a wire bonder |
US9165904B1 (en) * | 2014-06-17 | 2015-10-20 | Freescale Semiconductor, Inc. | Insulated wire bonding with EFO before second bond |
JP6543579B2 (en) * | 2016-01-28 | 2019-07-10 | 株式会社沖データ | Optical head, image forming apparatus, and image reading apparatus |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3373481A (en) * | 1965-06-22 | 1968-03-19 | Sperry Rand Corp | Method of electrically interconnecting conductors |
NL184184C (en) | 1981-03-20 | 1989-05-01 | Philips Nv | METHOD FOR APPLYING CONTACT INCREASES TO CONTACT PLACES OF AN ELECTRONIC MICROCKETES |
US5195237A (en) * | 1987-05-21 | 1993-03-23 | Cray Computer Corporation | Flying leads for integrated circuits |
EP0376924A3 (en) | 1987-05-21 | 1990-08-22 | RAYCHEM CORPORATION (a Delaware corporation) | Gold compression bonding |
US5037023A (en) * | 1988-11-28 | 1991-08-06 | Hitachi, Ltd. | Method and apparatus for wire bonding |
US5192015A (en) * | 1991-11-20 | 1993-03-09 | Santa Barbara Research Center | Method for wire bonding |
US5311404A (en) * | 1992-06-30 | 1994-05-10 | Hughes Aircraft Company | Electrical interconnection substrate with both wire bond and solder contacts |
JP3041812B2 (en) * | 1993-09-21 | 2000-05-15 | 株式会社新川 | Wire bonding equipment |
US5558270A (en) * | 1995-01-06 | 1996-09-24 | Kulicke And Soffa Investments, Inc | Fine pitch capillary/wedge bonding tool |
JP3086158B2 (en) * | 1995-07-26 | 2000-09-11 | 株式会社日立製作所 | Ultrasonic bonding method |
JP3333399B2 (en) * | 1996-08-21 | 2002-10-15 | 株式会社新川 | Capillary for wire bonding equipment |
DE69737621T2 (en) * | 1996-10-01 | 2007-12-20 | Matsushita Electric Industrial Co., Ltd., Kadoma | Semiconductor element with a bump electrode |
US5938105A (en) * | 1997-01-15 | 1999-08-17 | National Semiconductor Corporation | Encapsulated ball bonding apparatus and method |
US5871141A (en) * | 1997-05-22 | 1999-02-16 | Kulicke And Soffa, Investments, Inc. | Fine pitch bonding tool for constrained bonding |
EP0995235B1 (en) | 1997-07-16 | 2002-04-03 | Fraunhofer-Gesellschaft Zur Förderung Der Angewandten Forschung E.V. | Contact for very small liaison contacts and method for producing a contact |
-
2001
- 2001-04-17 AU AU2001248586A patent/AU2001248586A1/en not_active Abandoned
- 2001-04-17 DE DE60130111T patent/DE60130111D1/en not_active Expired - Lifetime
- 2001-04-17 US US10/257,842 patent/US7137547B2/en not_active Expired - Fee Related
- 2001-04-17 AT AT01921615T patent/ATE371265T1/en not_active IP Right Cessation
- 2001-04-17 EP EP01921615A patent/EP1275143B1/en not_active Expired - Lifetime
- 2001-04-17 WO PCT/GB2001/001737 patent/WO2001082362A2/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
US20030159276A1 (en) | 2003-08-28 |
WO2001082362A8 (en) | 2004-04-15 |
ATE371265T1 (en) | 2007-09-15 |
EP1275143B1 (en) | 2007-08-22 |
WO2001082362A2 (en) | 2001-11-01 |
WO2001082362B1 (en) | 2002-07-25 |
WO2001082362A3 (en) | 2002-06-20 |
DE60130111D1 (en) | 2007-10-04 |
EP1275143A2 (en) | 2003-01-15 |
US7137547B2 (en) | 2006-11-21 |
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