DE69304911T2 - Verfahren, vorrichtung und produkt für lötverbindungen bei oberflächenmontage. - Google Patents

Verfahren, vorrichtung und produkt für lötverbindungen bei oberflächenmontage.

Info

Publication number
DE69304911T2
DE69304911T2 DE69304911T DE69304911T DE69304911T2 DE 69304911 T2 DE69304911 T2 DE 69304911T2 DE 69304911 T DE69304911 T DE 69304911T DE 69304911 T DE69304911 T DE 69304911T DE 69304911 T2 DE69304911 T2 DE 69304911T2
Authority
DE
Germany
Prior art keywords
product
surface mounting
soldered connections
soldered
connections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69304911T
Other languages
English (en)
Other versions
DE69304911D1 (de
Inventor
Damian Holzmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mask Technology Inc
Original Assignee
Mask Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/881,872 external-priority patent/US5310574A/en
Application filed by Mask Technology Inc filed Critical Mask Technology Inc
Application granted granted Critical
Publication of DE69304911D1 publication Critical patent/DE69304911D1/de
Publication of DE69304911T2 publication Critical patent/DE69304911T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0002—Soldering by means of dipping in a fused salt bath
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0568—Resist used for applying paste, ink or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12389—All metal or with adjacent metals having variation in thickness
    • Y10T428/12396—Discontinuous surface component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12993—Surface feature [e.g., rough, mirror]
DE69304911T 1992-05-12 1993-05-03 Verfahren, vorrichtung und produkt für lötverbindungen bei oberflächenmontage. Expired - Fee Related DE69304911T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US07/881,872 US5310574A (en) 1992-05-12 1992-05-12 Method for surface mount solder joints
US08/042,202 US5403671A (en) 1992-05-12 1993-04-02 Product for surface mount solder joints
PCT/US1993/004168 WO1993023981A1 (en) 1992-05-12 1993-05-03 Method, apparatus and product for surface mount solder joints

Publications (2)

Publication Number Publication Date
DE69304911D1 DE69304911D1 (de) 1996-10-24
DE69304911T2 true DE69304911T2 (de) 1997-05-15

Family

ID=26718981

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69304911T Expired - Fee Related DE69304911T2 (de) 1992-05-12 1993-05-03 Verfahren, vorrichtung und produkt für lötverbindungen bei oberflächenmontage.

Country Status (7)

Country Link
US (2) US5403671A (de)
EP (1) EP0640271B1 (de)
JP (1) JPH0821770B2 (de)
AU (1) AU4369693A (de)
DE (1) DE69304911T2 (de)
HK (1) HK124797A (de)
WO (1) WO1993023981A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3668284A1 (de) 2018-12-13 2020-06-17 Endress+Hauser SE+Co. KG Verfahren zur herstellung einer leiterplatte und leiterplatte

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4310930A1 (de) * 1993-04-02 1994-10-06 Siemens Ag Leiterplattenanordnung und Verfahren zur Herstellung einer bestückten Leiterplatte
US5831828A (en) * 1993-06-03 1998-11-03 International Business Machines Corporation Flexible circuit board and common heat spreader assembly
CA2113752C (en) * 1994-01-19 1999-03-02 Stephen Michael Rooks Inspection system for cross-sectional imaging
CA2135508C (en) * 1994-11-09 1998-11-03 Robert J. Lyn Method for forming solder balls on a semiconductor substrate
FR2724526B1 (fr) * 1994-09-14 1996-12-13 Peugeot Procede de formation de plots de brasure sur des portions conductrices d'un circuit imprime
US5738269A (en) * 1996-04-19 1998-04-14 Motorola, Inc. Method for forming a solder bump
DE19640285C2 (de) * 1996-09-30 1998-11-12 Siemens Nixdorf Inf Syst Vorrichtung zum Auftragen von Lötpaste auf die Kontaktelemente von Ball Grid Array-Bauteilen
US5796590A (en) * 1996-11-05 1998-08-18 Micron Electronics, Inc. Assembly aid for mounting packaged integrated circuit devices to printed circuit boards
US5936846A (en) * 1997-01-16 1999-08-10 Ford Global Technologies Optimized solder joints and lifter pads for improving the solder joint life of surface mount chips
US7007833B2 (en) * 1997-05-27 2006-03-07 Mackay John Forming solder balls on substrates
US5988487A (en) * 1997-05-27 1999-11-23 Fujitsu Limited Captured-cell solder printing and reflow methods
US7819301B2 (en) * 1997-05-27 2010-10-26 Wstp, Llc Bumping electronic components using transfer substrates
US7842599B2 (en) * 1997-05-27 2010-11-30 Wstp, Llc Bumping electronic components using transfer substrates
US6609652B2 (en) 1997-05-27 2003-08-26 Spheretek, Llc Ball bumping substrates, particuarly wafers
US7654432B2 (en) 1997-05-27 2010-02-02 Wstp, Llc Forming solder balls on substrates
US6293456B1 (en) 1997-05-27 2001-09-25 Spheretek, Llc Methods for forming solder balls on substrates
US7288471B2 (en) * 1997-05-27 2007-10-30 Mackay John Bumping electronic components using transfer substrates
US5984166A (en) * 1997-07-09 1999-11-16 Mask Technology, Inc. Process for creating fine and coarse pitch solder deposits on printed ciruit boards
US6372624B1 (en) 1997-08-04 2002-04-16 Micron Technology, Inc. Method for fabricating solder bumps by wave soldering
US6016746A (en) * 1997-08-19 2000-01-25 Micron Communications, Inc. Flip chip screen printing method
US6048744A (en) 1997-09-15 2000-04-11 Micron Technology, Inc. Integrated circuit package alignment feature
US6087596A (en) * 1997-12-04 2000-07-11 Ford Motor Company Solder joints for printed circuit boards having intermediate metallic member
US6138562A (en) * 1998-01-20 2000-10-31 Hertz; Allen D. Vibrational energy waves for assist in the print release process for screen printing
US6026564A (en) * 1998-04-10 2000-02-22 Ang Technologies Inc. Method of making a high density multilayer wiring board
US6059170A (en) * 1998-06-24 2000-05-09 International Business Machines Corporation Method and apparatus for insulating moisture sensitive PBGA's
US6145735A (en) * 1998-09-10 2000-11-14 Lockheed Martin Corporation Thin film solder paste deposition method and tools
US6062135A (en) * 1998-12-07 2000-05-16 International Business Machines Corporation Screening apparatus including a dual reservoir dispensing assembly
US6253675B1 (en) 1999-06-29 2001-07-03 Carl P. Mayer Solder paste stenciling apparatus and method of use for rework
US20010052536A1 (en) * 1999-12-06 2001-12-20 Scherdorf Ronald Drost Method and apparatus for making an electrical device
JP3471690B2 (ja) * 1999-12-16 2003-12-02 沖電気工業株式会社 半導体素子の実装方法
US6550662B2 (en) * 2001-04-03 2003-04-22 Kyocera Wireless Corporation Chip rework solder tool
US6991960B2 (en) 2001-08-30 2006-01-31 Micron Technology, Inc. Method of semiconductor device package alignment and method of testing
US6491205B1 (en) * 2001-09-21 2002-12-10 International Business Machines Corporation Assembly of multi-chip modules using eutectic solders
US6945447B2 (en) * 2002-06-05 2005-09-20 Northrop Grumman Corporation Thermal solder writing eutectic bonding process and apparatus
ITMO20050017A1 (it) * 2005-01-28 2006-07-29 Windinglab S R L Apparato e metodo per realizzare un antenna per un dispositivo di identificazione a radiofrequenza.
US20070126445A1 (en) * 2005-11-30 2007-06-07 Micron Technology, Inc. Integrated circuit package testing devices and methods of making and using same
DE102007054710B3 (de) * 2007-11-16 2009-07-09 Semikron Elektronik Gmbh & Co. Kg Verfahren zur Herstellung einer Halbleiterbaugruppe
CN104246996B (zh) * 2012-04-17 2017-09-29 株式会社谷黑组 焊料凸块及其形成方法、以及具备有焊料凸块的基板及其制造方法
US20140097003A1 (en) * 2012-10-05 2014-04-10 Tyco Electronics Amp Gmbh Electrical components and methods and systems of manufacturing electrical components
CN103940831B (zh) * 2014-03-12 2016-02-17 工业和信息化部电子第五研究所 叠层封装器件焊点质量检验方法
CN105307393B (zh) * 2015-11-13 2017-12-19 惠州市金百泽电路科技有限公司 一种提升导电碳油印制电路板阻值精度的制作工艺
CN112563174B (zh) * 2020-12-28 2024-04-19 苏州至辰物联科技有限公司 一种激光驱动ic控制芯片引脚处理系统
TWI795734B (zh) * 2021-02-26 2023-03-11 志聖工業股份有限公司 壓膜機
CN114178639B (zh) * 2022-02-17 2022-05-17 太原理工大学 一种用于铍窗和不锈钢基座的脉冲激光钎焊封接方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3167490A (en) * 1957-07-17 1965-01-26 Friedman Abraham Printed circuit
US3226608A (en) * 1959-06-24 1965-12-28 Gen Electric Liquid metal electrical connection
NL264072A (de) * 1960-11-21 1900-01-01
US3214564A (en) * 1963-05-27 1965-10-26 Gen Motors Corp Method of joining metals
US3452149A (en) * 1967-10-30 1969-06-24 Fred J Rinaldi Flexible electrical connector
US3515593A (en) * 1968-02-19 1970-06-02 United Aircraft Corp Fuel cell with electrically conductive bonding means
US4295151A (en) * 1980-01-14 1981-10-13 Rca Corporation Method of bonding two parts together and article produced thereby
US4678531A (en) * 1986-03-24 1987-07-07 General Motors Corporation Method and apparatus for screen printing solder paste onto a substrate with device premounted thereon
US4729306A (en) * 1986-05-16 1988-03-08 American Screen Printing Equipment Company Screen seal system
US4789096A (en) * 1987-05-04 1988-12-06 Unisys Corporation Method of soldering joints by moving them through a target area on which a stream of hot gas is focused
DE3810653C1 (de) * 1988-03-29 1989-05-18 Dieter Dr.-Ing. Friedrich
US5310574A (en) * 1992-05-12 1994-05-10 Mask Technology, Inc. Method for surface mount solder joints

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3668284A1 (de) 2018-12-13 2020-06-17 Endress+Hauser SE+Co. KG Verfahren zur herstellung einer leiterplatte und leiterplatte
DE102018132056A1 (de) 2018-12-13 2020-06-18 Endress+Hauser SE+Co. KG Verfahren zur Herstellung einer Leiterplatte und Leiterplatte

Also Published As

Publication number Publication date
EP0640271A1 (de) 1995-03-01
WO1993023981A1 (en) 1993-11-25
JPH07506934A (ja) 1995-07-27
US5395040A (en) 1995-03-07
EP0640271B1 (de) 1996-09-18
US5403671A (en) 1995-04-04
JPH0821770B2 (ja) 1996-03-04
HK124797A (en) 1997-09-12
AU4369693A (en) 1993-12-13
DE69304911D1 (de) 1996-10-24

Similar Documents

Publication Publication Date Title
DE69304911D1 (de) Verfahren, vorrichtung und produkt für lötverbindungen bei oberflächenmontage.
DE69612930D1 (de) Verfahren und Vorrichtung für die Reinigung von Werkstücken
DE69015511T2 (de) Verfahren und Vorrichtung zum Verbinden von Halbleitersubstraten.
DE69114121D1 (de) Vorrichtung und verfahren für die gaschromatographie.
DE69109422D1 (de) Verbessertes Verfahren und Vorrichtung für Sauerstoffanreicherung.
DE69021955T2 (de) Verfahren und Vorrichtung zur gegenseitigen Verbindung von Rohren.
DE69203130T2 (de) Verfahren und Vorrichtung zur Verbindung von Rohren.
DE69115037T2 (de) Verfahren und vorrichtung zur ausgabe von artikeln.
DE69002726T3 (de) Verfahren und Vorrichtung zum Granulieren und Überziehen.
DE59607859D1 (de) Verfahren und Vorrichtung zum Verbinden von zwei metallischen Werkstücken
DE69115091D1 (de) Verfahren und Vorrichtung für Bauelementenmontage.
DE59200979D1 (de) Verfahren und vorrichtung zum feststellen der krümmungsmittelachse.
DE69101946T2 (de) Verfahren und Vorrichtung zum Biegen von Rohren.
DE69106344D1 (de) Verfahren und vorrichtung zum palettisieren.
DE69002860T2 (de) Verfahren und Vorrichtung zum Verbinden von Futterrohren.
DE69101545T2 (de) Verfahren und vorrichtung zum positionieren von bestandteilen.
DE69007363T2 (de) Verfahren und Vorrichtung zum Löten von Gegenständen.
DE59007450D1 (de) Verfahren und vorrichtung zum abfragen von steuergeräte-daten.
DE59606451D1 (de) Verfahren und Vorrichtung zum Verbinden von zwei Werkstücken
DE69133270D1 (de) Vorrichtung und Verfahren zum Erneuern des Lagerbestandsverzeichnisses
DE69103084T2 (de) Vorrichtung und Verfahren zum Fördern.
DE68910406T2 (de) Vorrichtung und Verfahren zum Verbinden/Lösen der Verbindung einer integrierten Schaltung.
DE29621477U1 (de) Vorrichtung zum Verfahren von Traversen für den Transport von Werkstücken
DE59005303D1 (de) Verfahren und Vorrichtung zum Reinigen von Metallteilen.
DE19681208T1 (de) Verfahren und Vorrichtung zum Fördern von Gegenständen

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee