HK124797A - Method apparatus and product for surface mount solder joints - Google Patents
Method apparatus and product for surface mount solder jointsInfo
- Publication number
- HK124797A HK124797A HK124797A HK124797A HK124797A HK 124797 A HK124797 A HK 124797A HK 124797 A HK124797 A HK 124797A HK 124797 A HK124797 A HK 124797A HK 124797 A HK124797 A HK 124797A
- Authority
- HK
- Hong Kong
- Prior art keywords
- product
- surface mount
- solder joints
- method apparatus
- mount solder
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0002—Soldering by means of dipping in a fused salt bath
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/029—Woven fibrous reinforcement or textile
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0568—Resist used for applying paste, ink or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12389—All metal or with adjacent metals having variation in thickness
- Y10T428/12396—Discontinuous surface component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12993—Surface feature [e.g., rough, mirror]
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/881,872 US5310574A (en) | 1992-05-12 | 1992-05-12 | Method for surface mount solder joints |
US08/042,202 US5403671A (en) | 1992-05-12 | 1993-04-02 | Product for surface mount solder joints |
PCT/US1993/004168 WO1993023981A1 (en) | 1992-05-12 | 1993-05-03 | Method, apparatus and product for surface mount solder joints |
Publications (1)
Publication Number | Publication Date |
---|---|
HK124797A true HK124797A (en) | 1997-09-12 |
Family
ID=26718981
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK124797A HK124797A (en) | 1992-05-12 | 1997-06-26 | Method apparatus and product for surface mount solder joints |
Country Status (7)
Country | Link |
---|---|
US (2) | US5403671A (de) |
EP (1) | EP0640271B1 (de) |
JP (1) | JPH0821770B2 (de) |
AU (1) | AU4369693A (de) |
DE (1) | DE69304911T2 (de) |
HK (1) | HK124797A (de) |
WO (1) | WO1993023981A1 (de) |
Families Citing this family (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4310930A1 (de) * | 1993-04-02 | 1994-10-06 | Siemens Ag | Leiterplattenanordnung und Verfahren zur Herstellung einer bestückten Leiterplatte |
US5831828A (en) * | 1993-06-03 | 1998-11-03 | International Business Machines Corporation | Flexible circuit board and common heat spreader assembly |
CA2113752C (en) * | 1994-01-19 | 1999-03-02 | Stephen Michael Rooks | Inspection system for cross-sectional imaging |
CA2135508C (en) * | 1994-11-09 | 1998-11-03 | Robert J. Lyn | Method for forming solder balls on a semiconductor substrate |
FR2724526B1 (fr) * | 1994-09-14 | 1996-12-13 | Peugeot | Procede de formation de plots de brasure sur des portions conductrices d'un circuit imprime |
US5738269A (en) * | 1996-04-19 | 1998-04-14 | Motorola, Inc. | Method for forming a solder bump |
DE19640285C2 (de) * | 1996-09-30 | 1998-11-12 | Siemens Nixdorf Inf Syst | Vorrichtung zum Auftragen von Lötpaste auf die Kontaktelemente von Ball Grid Array-Bauteilen |
US5796590A (en) * | 1996-11-05 | 1998-08-18 | Micron Electronics, Inc. | Assembly aid for mounting packaged integrated circuit devices to printed circuit boards |
US5936846A (en) * | 1997-01-16 | 1999-08-10 | Ford Global Technologies | Optimized solder joints and lifter pads for improving the solder joint life of surface mount chips |
US7007833B2 (en) | 1997-05-27 | 2006-03-07 | Mackay John | Forming solder balls on substrates |
US7288471B2 (en) * | 1997-05-27 | 2007-10-30 | Mackay John | Bumping electronic components using transfer substrates |
US7819301B2 (en) * | 1997-05-27 | 2010-10-26 | Wstp, Llc | Bumping electronic components using transfer substrates |
US7842599B2 (en) * | 1997-05-27 | 2010-11-30 | Wstp, Llc | Bumping electronic components using transfer substrates |
US7654432B2 (en) | 1997-05-27 | 2010-02-02 | Wstp, Llc | Forming solder balls on substrates |
US6609652B2 (en) | 1997-05-27 | 2003-08-26 | Spheretek, Llc | Ball bumping substrates, particuarly wafers |
US5988487A (en) * | 1997-05-27 | 1999-11-23 | Fujitsu Limited | Captured-cell solder printing and reflow methods |
US6293456B1 (en) | 1997-05-27 | 2001-09-25 | Spheretek, Llc | Methods for forming solder balls on substrates |
US5984166A (en) * | 1997-07-09 | 1999-11-16 | Mask Technology, Inc. | Process for creating fine and coarse pitch solder deposits on printed ciruit boards |
US6372624B1 (en) | 1997-08-04 | 2002-04-16 | Micron Technology, Inc. | Method for fabricating solder bumps by wave soldering |
US6016746A (en) * | 1997-08-19 | 2000-01-25 | Micron Communications, Inc. | Flip chip screen printing method |
US6048744A (en) | 1997-09-15 | 2000-04-11 | Micron Technology, Inc. | Integrated circuit package alignment feature |
US6087596A (en) * | 1997-12-04 | 2000-07-11 | Ford Motor Company | Solder joints for printed circuit boards having intermediate metallic member |
US6138562A (en) * | 1998-01-20 | 2000-10-31 | Hertz; Allen D. | Vibrational energy waves for assist in the print release process for screen printing |
US6026564A (en) * | 1998-04-10 | 2000-02-22 | Ang Technologies Inc. | Method of making a high density multilayer wiring board |
US6059170A (en) * | 1998-06-24 | 2000-05-09 | International Business Machines Corporation | Method and apparatus for insulating moisture sensitive PBGA's |
US6145735A (en) * | 1998-09-10 | 2000-11-14 | Lockheed Martin Corporation | Thin film solder paste deposition method and tools |
US6062135A (en) * | 1998-12-07 | 2000-05-16 | International Business Machines Corporation | Screening apparatus including a dual reservoir dispensing assembly |
US6253675B1 (en) | 1999-06-29 | 2001-07-03 | Carl P. Mayer | Solder paste stenciling apparatus and method of use for rework |
WO2001043269A2 (en) * | 1999-12-06 | 2001-06-14 | L'air Liquide Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Method and apparatus for making an electrical device |
JP3471690B2 (ja) * | 1999-12-16 | 2003-12-02 | 沖電気工業株式会社 | 半導体素子の実装方法 |
US6550662B2 (en) * | 2001-04-03 | 2003-04-22 | Kyocera Wireless Corporation | Chip rework solder tool |
US6991960B2 (en) | 2001-08-30 | 2006-01-31 | Micron Technology, Inc. | Method of semiconductor device package alignment and method of testing |
US6491205B1 (en) * | 2001-09-21 | 2002-12-10 | International Business Machines Corporation | Assembly of multi-chip modules using eutectic solders |
US6945447B2 (en) * | 2002-06-05 | 2005-09-20 | Northrop Grumman Corporation | Thermal solder writing eutectic bonding process and apparatus |
ITMO20050017A1 (it) * | 2005-01-28 | 2006-07-29 | Windinglab S R L | Apparato e metodo per realizzare un antenna per un dispositivo di identificazione a radiofrequenza. |
US20070126445A1 (en) * | 2005-11-30 | 2007-06-07 | Micron Technology, Inc. | Integrated circuit package testing devices and methods of making and using same |
DE102007054710B3 (de) * | 2007-11-16 | 2009-07-09 | Semikron Elektronik Gmbh & Co. Kg | Verfahren zur Herstellung einer Halbleiterbaugruppe |
KR101686312B1 (ko) * | 2012-04-17 | 2016-12-13 | 가부시키가이샤 다니구로구미 | 땜납 범프 및 그 형성방법과 땜납 범프를 구비한 기판 및 그 제조방법 |
US20140097003A1 (en) * | 2012-10-05 | 2014-04-10 | Tyco Electronics Amp Gmbh | Electrical components and methods and systems of manufacturing electrical components |
CN103940831B (zh) * | 2014-03-12 | 2016-02-17 | 工业和信息化部电子第五研究所 | 叠层封装器件焊点质量检验方法 |
CN105307393B (zh) * | 2015-11-13 | 2017-12-19 | 惠州市金百泽电路科技有限公司 | 一种提升导电碳油印制电路板阻值精度的制作工艺 |
DE102018132056A1 (de) | 2018-12-13 | 2020-06-18 | Endress+Hauser SE+Co. KG | Verfahren zur Herstellung einer Leiterplatte und Leiterplatte |
CN112563174B (zh) * | 2020-12-28 | 2024-04-19 | 苏州至辰物联科技有限公司 | 一种激光驱动ic控制芯片引脚处理系统 |
TWI795734B (zh) * | 2021-02-26 | 2023-03-11 | 志聖工業股份有限公司 | 壓膜機 |
CN114178639B (zh) * | 2022-02-17 | 2022-05-17 | 太原理工大学 | 一种用于铍窗和不锈钢基座的脉冲激光钎焊封接方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3167490A (en) * | 1957-07-17 | 1965-01-26 | Friedman Abraham | Printed circuit |
US3226608A (en) * | 1959-06-24 | 1965-12-28 | Gen Electric | Liquid metal electrical connection |
NL264072A (de) * | 1960-11-21 | 1900-01-01 | ||
US3214564A (en) * | 1963-05-27 | 1965-10-26 | Gen Motors Corp | Method of joining metals |
US3452149A (en) * | 1967-10-30 | 1969-06-24 | Fred J Rinaldi | Flexible electrical connector |
US3515593A (en) * | 1968-02-19 | 1970-06-02 | United Aircraft Corp | Fuel cell with electrically conductive bonding means |
US4295151A (en) * | 1980-01-14 | 1981-10-13 | Rca Corporation | Method of bonding two parts together and article produced thereby |
US4678531A (en) * | 1986-03-24 | 1987-07-07 | General Motors Corporation | Method and apparatus for screen printing solder paste onto a substrate with device premounted thereon |
US4729306A (en) * | 1986-05-16 | 1988-03-08 | American Screen Printing Equipment Company | Screen seal system |
US4789096A (en) * | 1987-05-04 | 1988-12-06 | Unisys Corporation | Method of soldering joints by moving them through a target area on which a stream of hot gas is focused |
DE3810653C1 (de) * | 1988-03-29 | 1989-05-18 | Dieter Dr.-Ing. Friedrich | |
US5310574A (en) * | 1992-05-12 | 1994-05-10 | Mask Technology, Inc. | Method for surface mount solder joints |
-
1993
- 1993-04-02 US US08/042,202 patent/US5403671A/en not_active Expired - Fee Related
- 1993-05-03 DE DE69304911T patent/DE69304911T2/de not_active Expired - Fee Related
- 1993-05-03 JP JP5520277A patent/JPH0821770B2/ja not_active Expired - Fee Related
- 1993-05-03 EP EP93913796A patent/EP0640271B1/de not_active Expired - Lifetime
- 1993-05-03 AU AU43696/93A patent/AU4369693A/en not_active Abandoned
- 1993-05-03 WO PCT/US1993/004168 patent/WO1993023981A1/en active IP Right Grant
-
1994
- 1994-01-26 US US08/186,741 patent/US5395040A/en not_active Expired - Fee Related
-
1997
- 1997-06-26 HK HK124797A patent/HK124797A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US5395040A (en) | 1995-03-07 |
AU4369693A (en) | 1993-12-13 |
US5403671A (en) | 1995-04-04 |
JPH07506934A (ja) | 1995-07-27 |
DE69304911D1 (de) | 1996-10-24 |
WO1993023981A1 (en) | 1993-11-25 |
JPH0821770B2 (ja) | 1996-03-04 |
EP0640271A1 (de) | 1995-03-01 |
DE69304911T2 (de) | 1997-05-15 |
EP0640271B1 (de) | 1996-09-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |