DE60205810D1 - Hermetisch versiegeltes Gehäuse für optische Halbleiteranordnung und dessen Verwendung in einem optischen Halbleitermodul - Google Patents

Hermetisch versiegeltes Gehäuse für optische Halbleiteranordnung und dessen Verwendung in einem optischen Halbleitermodul

Info

Publication number
DE60205810D1
DE60205810D1 DE60205810T DE60205810T DE60205810D1 DE 60205810 D1 DE60205810 D1 DE 60205810D1 DE 60205810 T DE60205810 T DE 60205810T DE 60205810 T DE60205810 T DE 60205810T DE 60205810 D1 DE60205810 D1 DE 60205810D1
Authority
DE
Germany
Prior art keywords
optical semiconductor
hermetically sealed
sealed package
semiconductor device
semiconductor module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60205810T
Other languages
English (en)
Other versions
DE60205810T2 (de
Inventor
N Tatoh
K Shibata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Publication of DE60205810D1 publication Critical patent/DE60205810D1/de
Application granted granted Critical
Publication of DE60205810T2 publication Critical patent/DE60205810T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4207—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms with optical elements reducing the sensitivity to optical feedback
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4216—Packages, e.g. shape, construction, internal or external details incorporating polarisation-maintaining fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
DE60205810T 2001-05-30 2002-03-19 Hermetisch versiegeltes Gehäuse für optische Halbleiteranordnung und dessen Verwendung in einem optischen Halbleitermodul Expired - Fee Related DE60205810T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001162393 2001-05-30
JP2001162393A JP3703737B2 (ja) 2001-05-30 2001-05-30 光半導体気密封止容器及び光半導体モジュール

Publications (2)

Publication Number Publication Date
DE60205810D1 true DE60205810D1 (de) 2005-10-06
DE60205810T2 DE60205810T2 (de) 2006-06-08

Family

ID=19005526

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60205810T Expired - Fee Related DE60205810T2 (de) 2001-05-30 2002-03-19 Hermetisch versiegeltes Gehäuse für optische Halbleiteranordnung und dessen Verwendung in einem optischen Halbleitermodul

Country Status (7)

Country Link
US (1) US6674143B2 (de)
EP (1) EP1263054B1 (de)
JP (1) JP3703737B2 (de)
KR (1) KR20020091762A (de)
CN (1) CN1169005C (de)
CA (1) CA2376907C (de)
DE (1) DE60205810T2 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004361757A (ja) * 2003-06-06 2004-12-24 Nec Tokin Corp 光アイソレータ
JP2008097014A (ja) * 2003-08-05 2008-04-24 Sumitomo Electric Ind Ltd 液晶パネル用透明基板
JP2006273679A (ja) * 2005-03-30 2006-10-12 Sumitomo Electric Ind Ltd スピネル焼結体、光透過窓および光透過レンズ
US7905385B2 (en) * 2006-03-17 2011-03-15 Smith & Nephew, Inc. Joining ceramics to metal
US7702226B1 (en) * 2006-07-20 2010-04-20 Siimpel Corporation Board mounted hermetically sealed optical device enclosure and manufacturing methods therefor
JP2012527620A (ja) * 2009-05-21 2012-11-08 シュルンベルジェ ホールディングス リミテッド 放射線検出器のための高強度光学窓
DK2687501T3 (da) * 2011-03-16 2019-10-14 Shinetsu Chemical Co Magneto-optisk keramisk materiale og fremgangsmåde til at udvælge dette
JP2014011442A (ja) * 2012-07-03 2014-01-20 Alps Electric Co Ltd 鏡筒付き透光窓および光モジュール
WO2015010061A2 (en) * 2013-07-19 2015-01-22 Materion Corporation A metal cap assembly for optical communications
US9624136B2 (en) 2014-07-01 2017-04-18 Corning Incorporated Transparent spinel article and tape cast methods for making
US9843394B2 (en) 2014-10-06 2017-12-12 Alliance Fiber Optic Products, Inc. Optical transceiver module having unibody structure
CN105982633B (zh) * 2015-01-28 2018-01-30 中国科学院宁波材料技术与工程研究所 内窥镜用不锈钢管与石英片的封装方法
JP7009950B2 (ja) 2017-11-21 2022-01-26 日本電気硝子株式会社 光素子用窓部品
CN114488431B (zh) * 2021-12-16 2023-08-18 中国电子科技集团公司第二十九研究所 一种小型化高可靠外调制光源封装结构及封装方法
CN115079347B (zh) * 2022-08-16 2023-04-07 武汉乾希科技有限公司 光发射接收组件和用于光发射接收组件的光路耦合方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4355321A (en) 1981-02-02 1982-10-19 Varian Associates, Inc. Optoelectronic assembly including light transmissive single crystal semiconductor window
CA2019074C (en) 1989-06-19 1993-06-01 Takayuki Masuko Photo-semiconductor module
JP3067151B2 (ja) * 1990-03-13 2000-07-17 日本電気株式会社 光電気変換素子サブキャリア
JP3129553B2 (ja) 1992-11-12 2001-01-31 新光電気工業株式会社 光透過用ウィンドを備えたパッケージ
DE4422322C1 (de) 1994-06-27 1995-09-14 Ant Nachrichtentech Lasermodul
JPH08148594A (ja) 1994-11-25 1996-06-07 Kyocera Corp 光半導体素子収納用パッケージ
JP3297617B2 (ja) 1996-12-12 2002-07-02 京セラ株式会社 光半導体素子収納用パッケージ
JPH10316466A (ja) 1997-05-19 1998-12-02 Toshiba Ceramics Co Ltd 透光性アルミナセラミックス
JP2993472B2 (ja) 1997-07-30 1999-12-20 住友電気工業株式会社 光半導体用気密封止容器及び光半導体モジュール
US6697399B2 (en) * 2000-05-26 2004-02-24 The Furukawa Electric Co., Ltd. Semiconductor laser module with peltier module for regulating a temperature of a semiconductor laser chip

Also Published As

Publication number Publication date
KR20020091762A (ko) 2002-12-06
EP1263054A3 (de) 2003-05-07
JP2002353355A (ja) 2002-12-06
CN1388398A (zh) 2003-01-01
US6674143B2 (en) 2004-01-06
EP1263054A2 (de) 2002-12-04
CA2376907A1 (en) 2002-11-30
JP3703737B2 (ja) 2005-10-05
EP1263054B1 (de) 2005-08-31
DE60205810T2 (de) 2006-06-08
CA2376907C (en) 2005-08-16
CN1169005C (zh) 2004-09-29
US20020179989A1 (en) 2002-12-05

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee