DE602008006059D1 - Barriereschicht und herstellungsverfahren dafür - Google Patents

Barriereschicht und herstellungsverfahren dafür

Info

Publication number
DE602008006059D1
DE602008006059D1 DE602008006059T DE602008006059T DE602008006059D1 DE 602008006059 D1 DE602008006059 D1 DE 602008006059D1 DE 602008006059 T DE602008006059 T DE 602008006059T DE 602008006059 T DE602008006059 T DE 602008006059T DE 602008006059 D1 DE602008006059 D1 DE 602008006059D1
Authority
DE
Germany
Prior art keywords
metalloid
manufacturing
barrier layer
method therefor
metallic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602008006059T
Other languages
English (en)
Inventor
Mol Antonius Maria Bernardus Van
Harmannus Franciscus Maria Schoo
Petrus Marinus Martinus Cornelus Bressers
Erkel Joost Van
Marinus Marc Koetse
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO
Original Assignee
Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO filed Critical Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO
Publication of DE602008006059D1 publication Critical patent/DE602008006059D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/66—Electroplating: Baths therefor from melts
    • C25D3/665—Electroplating: Baths therefor from melts from ionic liquids
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Adornments (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
DE602008006059T 2007-04-17 2008-04-17 Barriereschicht und herstellungsverfahren dafür Active DE602008006059D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP07106347A EP1983079A1 (de) 2007-04-17 2007-04-17 Barriereschicht und Herstellungsverfahren dafür
PCT/NL2008/050220 WO2008127110A1 (en) 2007-04-17 2008-04-17 Barrier layer and method for making the same

Publications (1)

Publication Number Publication Date
DE602008006059D1 true DE602008006059D1 (de) 2011-05-19

Family

ID=38511369

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602008006059T Active DE602008006059D1 (de) 2007-04-17 2008-04-17 Barriereschicht und herstellungsverfahren dafür

Country Status (6)

Country Link
US (1) US20100108524A1 (de)
EP (2) EP1983079A1 (de)
JP (1) JP2010525161A (de)
AT (1) ATE504676T1 (de)
DE (1) DE602008006059D1 (de)
WO (1) WO2008127110A1 (de)

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* Cited by examiner, † Cited by third party
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TWI420722B (zh) 2008-01-30 2013-12-21 Osram Opto Semiconductors Gmbh 具有封裝單元之裝置
WO2010093237A1 (en) * 2009-02-11 2010-08-19 Nederlandse Organisatie Voor Toegepast- Natuurwetenschappelijk Onderzoek Tno Optoelectronic device and method for fabricating such device
EP2244317A1 (de) * 2009-04-23 2010-10-27 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Optoelektrische Vorrichtung und Verfahren zu deren Herstellung
US10030312B2 (en) * 2009-10-14 2018-07-24 Massachusetts Institute Of Technology Electrodeposited alloys and methods of making same using power pulses
DE102009046732A1 (de) * 2009-11-16 2011-05-19 Ewald Dörken Ag Verfahren zur Beschichtung einer metallischen Oberfläche eines Werkstücks
EP2576724B1 (de) * 2010-05-27 2019-04-24 Merck Patent GmbH Verfahren zur herstellung organischer elektronischer vorrichtungen
MX2013001964A (es) 2010-08-20 2013-06-28 Rhodia Operations Peliculas que contienen polimeros electricamente conductores.
WO2012043129A1 (ja) * 2010-09-30 2012-04-05 株式会社日立製作所 電気アルミニウムめっき液
US8367160B2 (en) 2010-11-05 2013-02-05 United Technologies Corporation Coating method for reactive metal
US9757109B2 (en) 2010-12-10 2017-09-12 Illumix Surgical Canada Inc. Organic light emitting diode illuminated surgical retractor
US8778164B2 (en) 2010-12-16 2014-07-15 Honeywell International Inc. Methods for producing a high temperature oxidation resistant coating on superalloy substrates and the coated superalloy substrates thereby produced
EP2476784A1 (de) 2011-01-18 2012-07-18 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Verfahren zur Herstellung einer elektronischen Vorrichtung durch Elektroablagerung aus einer Ionenflüssigkeit
JP2014521840A (ja) * 2011-08-02 2014-08-28 マサチューセッツ インスティテュート オブ テクノロジー Ａｌ‐Ｍｎおよびそれに類似する合金を含む、イオン溶液を用いて電着された多層合金におけるナノスケール結晶粒径分布の調整
US9771661B2 (en) 2012-02-06 2017-09-26 Honeywell International Inc. Methods for producing a high temperature oxidation resistant MCrAlX coating on superalloy substrates
US20130299453A1 (en) * 2012-05-14 2013-11-14 United Technologies Corporation Method for making metal plated gas turbine engine components
JPWO2014162395A1 (ja) * 2013-04-01 2017-02-16 パイオニア株式会社 発光装置
US11932960B2 (en) * 2013-11-26 2024-03-19 Arizona Board Of Regents On Behalf Of Arizona State University Light-induced aluminum plating on silicon for solar cell metallization
KR101628575B1 (ko) * 2014-12-24 2016-06-08 현대자동차주식회사 이온성 액체 전기 도금 기법을 이용한 염료감응형 태양전지용 고내식성 탄탈룸-은 복합 전극 제조방법
US10087540B2 (en) 2015-02-17 2018-10-02 Honeywell International Inc. Surface modifiers for ionic liquid aluminum electroplating solutions, processes for electroplating aluminum therefrom, and methods for producing an aluminum coating using the same
WO2018044930A1 (en) * 2016-08-29 2018-03-08 Board Of Trustees Of The University Of Arkansas Light-directed electrochemical patterning of copper structures
CN107785501B (zh) * 2017-10-17 2019-12-24 深圳市华星光电半导体显示技术有限公司 柔性oled面板的封装方法及封装结构

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EP0309831A1 (de) * 1987-09-29 1989-04-05 Siemens Aktiengesellschaft Ionensperrschicht auf Metallen und Nichtmetallen
EP0309830A1 (de) * 1987-09-29 1989-04-05 Siemens Aktiengesellschaft Gassperrschicht auf Überspannungsableiter und Lichtwellenleiter
JPH0261087A (ja) * 1988-08-27 1990-03-01 Nobuyuki Koura ニオブおよびニオブ合金の電着法およびその電着浴
JPH0488189A (ja) * 1990-07-31 1992-03-23 Nisshin Steel Co Ltd 電気Ｔｉ合金めっき浴およびその浴によるめっき方法
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JP2006278021A (ja) * 2005-03-28 2006-10-12 Pioneer Electronic Corp 有機機能素子封止膜検査方法及び構造
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EP1983592A1 (de) * 2007-04-17 2008-10-22 Nederlandse Organisatie voor Toegepast-Natuuurwetenschappelijk Onderzoek TNO Verfahren zur Herstellung einer Elektrode

Also Published As

Publication number Publication date
JP2010525161A (ja) 2010-07-22
WO2008127110A1 (en) 2008-10-23
EP2142685A1 (de) 2010-01-13
US20100108524A1 (en) 2010-05-06
EP2142685B1 (de) 2011-04-06
EP1983079A8 (de) 2010-06-16
EP1983079A1 (de) 2008-10-22
ATE504676T1 (de) 2011-04-15

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