DE602008004004D1 - Kondensator und Verfahren zu seiner Herstellung - Google Patents

Kondensator und Verfahren zu seiner Herstellung

Info

Publication number
DE602008004004D1
DE602008004004D1 DE602008004004T DE602008004004T DE602008004004D1 DE 602008004004 D1 DE602008004004 D1 DE 602008004004D1 DE 602008004004 T DE602008004004 T DE 602008004004T DE 602008004004 T DE602008004004 T DE 602008004004T DE 602008004004 D1 DE602008004004 D1 DE 602008004004D1
Authority
DE
Germany
Prior art keywords
capacitor
production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602008004004T
Other languages
English (en)
Inventor
Sung-Taek Lim
Yul-Kyo Chung
Kim Woon-Chun
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of DE602008004004D1 publication Critical patent/DE602008004004D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors 
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B1/00—Nanostructures formed by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/10—Metal-oxide dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0179—Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Nanotechnology (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
DE602008004004T 2007-04-18 2008-03-31 Kondensator und Verfahren zu seiner Herstellung Active DE602008004004D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070037740A KR100851067B1 (ko) 2007-04-18 2007-04-18 캐패시터 및 그 제조방법

Publications (1)

Publication Number Publication Date
DE602008004004D1 true DE602008004004D1 (de) 2011-02-03

Family

ID=39653828

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602008004004T Active DE602008004004D1 (de) 2007-04-18 2008-03-31 Kondensator und Verfahren zu seiner Herstellung

Country Status (6)

Country Link
US (1) US8199456B2 (de)
EP (1) EP1983532B1 (de)
JP (1) JP4734369B2 (de)
KR (1) KR100851067B1 (de)
CN (1) CN101291562B (de)
DE (1) DE602008004004D1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10043707B2 (en) * 2012-10-16 2018-08-07 Qorvo Us, Inc. Additive conductor redistribution layer (ACRL)
US9490323B2 (en) 2014-06-13 2016-11-08 Samsung Electronics Co., Ltd. Nanosheet FETs with stacked nanosheets having smaller horizontal spacing than vertical spacing for large effective width
US9685564B2 (en) 2015-10-16 2017-06-20 Samsung Electronics Co., Ltd. Gate-all-around field effect transistors with horizontal nanosheet conductive channel structures for MOL/inter-channel spacing and related cell architectures
KR101901697B1 (ko) * 2016-03-21 2018-11-07 삼성전기 주식회사 코일 장치의 제작 방법 및 코일 장치
US10032856B1 (en) 2017-01-24 2018-07-24 International Business Machines Corporation Nanosheet capacitor
KR102290337B1 (ko) * 2018-06-29 2021-08-17 한국세라믹기술원 가스센서용 전극 제조방법 및 가스센서

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1463989A (fr) * 1965-11-15 1966-07-22 Electronique & Automatisme Sa Procédé de préparation d'oxyde de titane diélectrique et produits industriels nouveaux en résultant
JPS60170229A (ja) 1984-02-14 1985-09-03 松下電器産業株式会社 金属化フイルムコンデンサ
JPH0714834B2 (ja) 1987-10-19 1995-02-22 東レ株式会社 チタニア薄膜の形成方法
JPH02203511A (ja) * 1989-02-02 1990-08-13 Matsushita Electric Ind Co Ltd 薄膜コンデンサの形成方法
JPH02279520A (ja) 1989-04-20 1990-11-15 Noboru Yoshimura ＴｉＯ２薄膜形成方法
US5219611A (en) * 1991-09-30 1993-06-15 Cornell Research Foundation, Inc. Preparing densified low porosity titania sol gel forms
JPH0737754A (ja) * 1993-07-16 1995-02-07 Murata Mfg Co Ltd 誘電体薄膜素子
US5756395A (en) * 1995-08-18 1998-05-26 Lsi Logic Corporation Process for forming metal interconnect structures for use with integrated circuit devices to form integrated circuit structures
US5736448A (en) * 1995-12-04 1998-04-07 General Electric Company Fabrication method for thin film capacitors
US5920454A (en) * 1997-02-11 1999-07-06 Hokuriko Electric Industry Co., Ltd. Capacitor-mounted circuit board
JP2000031387A (ja) * 1998-07-14 2000-01-28 Fuji Electric Co Ltd 誘電体薄膜コンデンサの製造方法
KR100376482B1 (ko) * 1999-12-17 2003-03-17 삼성전기주식회사 캐패시터 내장형 인쇄회로기판 제조방법
JP3513589B2 (ja) * 2000-03-24 2004-03-31 独立行政法人物質・材料研究機構 チタニア超薄膜およびその製造方法
KR20020076695A (ko) * 2001-03-30 2002-10-11 파츠닉(주) 다층 인쇄회로기판
JP2003158378A (ja) 2001-11-26 2003-05-30 Hitachi Ltd 多層回路基板を有する電子回路装置の製造方法
US7279777B2 (en) * 2003-05-08 2007-10-09 3M Innovative Properties Company Organic polymers, laminates, and capacitors
JP2005093736A (ja) 2003-09-17 2005-04-07 Ngk Spark Plug Co Ltd 薄膜キャパシタ用セラミック基板及びその製造方法並びにこれを用いた薄膜キャパシタ
US7186919B2 (en) * 2004-08-16 2007-03-06 Samsung Electro-Mechanics Co., Ltd. Printed circuit board including embedded capacitors and method of manufacturing the same
JP2006072352A (ja) * 2004-08-19 2006-03-16 Rohm & Haas Electronic Materials Llc プリント回路板を形成する方法
JP2006147607A (ja) 2004-11-16 2006-06-08 Nec Toppan Circuit Solutions Inc 印刷配線板及びその製造方法並びに半導体装置
US7192654B2 (en) * 2005-02-22 2007-03-20 Oak-Mitsui Inc. Multilayered construction for resistor and capacitor formation
KR100867038B1 (ko) * 2005-03-02 2008-11-04 삼성전기주식회사 커패시터 내장형 인쇄회로기판 및 그 제조방법

Also Published As

Publication number Publication date
JP2008270804A (ja) 2008-11-06
CN101291562B (zh) 2010-08-04
EP1983532A1 (de) 2008-10-22
JP4734369B2 (ja) 2011-07-27
CN101291562A (zh) 2008-10-22
US8199456B2 (en) 2012-06-12
US20080259523A1 (en) 2008-10-23
EP1983532B1 (de) 2010-12-22
KR100851067B1 (ko) 2008-08-12

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