DE602007012345D1 - Elektromagnetische Abschirmungen und zugehöriges Herstellungsverfahren - Google Patents

Elektromagnetische Abschirmungen und zugehöriges Herstellungsverfahren

Info

Publication number
DE602007012345D1
DE602007012345D1 DE602007012345T DE602007012345T DE602007012345D1 DE 602007012345 D1 DE602007012345 D1 DE 602007012345D1 DE 602007012345 T DE602007012345 T DE 602007012345T DE 602007012345 T DE602007012345 T DE 602007012345T DE 602007012345 D1 DE602007012345 D1 DE 602007012345D1
Authority
DE
Germany
Prior art keywords
sidewall portions
top surface
integral top
interlock
upper sidewall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007012345T
Other languages
English (en)
Inventor
Paul W Crotty Jr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Laird Technologies Inc
Original Assignee
Laird Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Laird Technologies Inc filed Critical Laird Technologies Inc
Publication of DE602007012345D1 publication Critical patent/DE602007012345D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
DE602007012345T 2007-08-31 2007-10-05 Elektromagnetische Abschirmungen und zugehöriges Herstellungsverfahren Active DE602007012345D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/848,923 US7504592B1 (en) 2007-08-31 2007-08-31 Electromagnetic interference shields and related manufacturing methods

Publications (1)

Publication Number Publication Date
DE602007012345D1 true DE602007012345D1 (de) 2011-03-17

Family

ID=39473424

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007012345T Active DE602007012345D1 (de) 2007-08-31 2007-10-05 Elektromagnetische Abschirmungen und zugehöriges Herstellungsverfahren

Country Status (8)

Country Link
US (1) US7504592B1 (de)
EP (1) EP2031950B1 (de)
JP (1) JP4777962B2 (de)
KR (1) KR100898026B1 (de)
CN (1) CN101378647B (de)
AT (1) ATE497688T1 (de)
DE (1) DE602007012345D1 (de)
TW (1) TWI354533B (de)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7491899B2 (en) * 2005-10-06 2009-02-17 Laird Technologies, Inc. EMI shields and related manufacturing methods
US7729130B1 (en) * 2007-01-02 2010-06-01 Fourte Design & Development LLC Transceiver module with collapsible fingers that form a sealed EMI shield
US7910839B2 (en) * 2008-11-26 2011-03-22 Itt Manufacturing Enterprises, Inc. Electro-conductive contact structure for enclosure sealing in housings
JP5442990B2 (ja) * 2008-12-24 2014-03-19 京セラ株式会社 回路装置の製造方法及び電子機器の製造方法
DE102009057068A1 (de) * 2009-12-04 2011-06-09 Wincor Nixdorf International Gmbh Vorrichtung zur Handhabung von Wertscheinen
CN201657591U (zh) * 2010-03-08 2010-11-24 国基电子（上海）有限公司 电磁屏蔽装置
CN201700123U (zh) * 2010-03-16 2011-01-05 鸿富锦精密工业（深圳）有限公司 电磁屏蔽装置
CN102835199A (zh) * 2010-04-02 2012-12-19 日本电气株式会社 框架构件、框架单元、安装板单元和制造方法
US8279624B2 (en) 2010-06-03 2012-10-02 Laird Technologies, Inc. Board level electromagnetic interference (EMI) shields with through hole latching mechanisms
JP2014063768A (ja) * 2011-01-24 2014-04-10 Panasonic Corp 非接触給電システムに用いられるコイルユニット
US20130033843A1 (en) * 2011-08-03 2013-02-07 Laird Technologies, Inc. Board level electromagnetic interference (emi) shields including releasably attached/detachable pickup members
CN103124484B (zh) * 2011-11-21 2017-01-25 富泰华工业（深圳）有限公司 电子设备
TWI491347B (zh) * 2012-10-24 2015-07-01 Hon Hai Prec Ind Co Ltd 散熱板及封裝殼體
US9462732B2 (en) 2013-03-13 2016-10-04 Laird Technologies, Inc. Electromagnetic interference shielding (EMI) apparatus including a frame with drawn latching features
TWI533793B (zh) * 2013-10-25 2016-05-11 緯創資通股份有限公司 電子裝置及其電磁波屏蔽模組
CN106664815B (zh) * 2014-08-01 2019-04-12 华为技术有限公司 一种电磁屏蔽材料及封装光模块的方法
JP6022010B2 (ja) * 2015-07-23 2016-11-09 キヤノン株式会社 情報処理装置、情報処理装置の制御方法及びコンピュータプログラム
WO2017019738A1 (en) * 2015-07-30 2017-02-02 Laird Technologies, Inc. Soft and/or flexible emi shields and related methods
EP3378293B1 (de) 2015-11-20 2023-06-07 Laird Technologies, Inc. Schilde auf plattenebene mit integriertem kühlkörper
CN106817887B (zh) * 2015-11-30 2020-08-18 深圳富泰宏精密工业有限公司 屏蔽罩、屏蔽罩组件以及应用该屏蔽罩组件的电子装置
KR102458297B1 (ko) 2016-01-12 2022-10-25 삼성전자주식회사 전자 장치 및 그를 제조하는 방법
TWM537383U (zh) * 2016-10-26 2017-02-21 啓碁科技股份有限公司 屏蔽罩
US10893636B2 (en) 2017-03-10 2021-01-12 Laird Technologies Inc. Method for forming a pickup area of a board level shield
CN107333463A (zh) * 2017-08-23 2017-11-07 努比亚技术有限公司 一种屏蔽装置及电子设备
CN107484403B (zh) * 2017-09-19 2020-02-14 Oppo广东移动通信有限公司 屏蔽罩、电路板组件以及电子设备
USD846547S1 (en) * 2017-09-20 2019-04-23 Audio Precision, Inc. Cage for shielding interference
US10985538B2 (en) * 2018-05-25 2021-04-20 Leoni Bordnetz-Systeme Gmbh System and method for reducing air volume in a splitter
JP6574024B1 (ja) * 2018-06-07 2019-09-11 レノボ・シンガポール・プライベート・リミテッド 電子機器
USD895623S1 (en) * 2018-10-05 2020-09-08 Laird Technologies, Inc. Frame for shielding assembly
US10653048B1 (en) 2018-11-21 2020-05-12 Laird Technologies, Inc. Frames for shielding assemblies and shielding assemblies including the same
JP7486891B2 (ja) 2020-03-12 2024-05-20 三菱電機株式会社 電子機器筐体、電子機器及び電子装置
US11917801B1 (en) 2023-04-28 2024-02-27 Hewlett Packard Enterprise Development Lp Electromagnetic interference shield

Family Cites Families (77)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1257502A (en) 1916-04-03 1918-02-26 American Company Method of making cans.
US2016225A (en) 1934-08-01 1935-10-01 Roman B Bukolt Method of making closure parts to eliminate waste
US4759466A (en) * 1986-08-14 1988-07-26 Apple Computer, Inc. EMI seam for enclosures
US4754101A (en) 1986-10-23 1988-06-28 Instrument Specialties Co., Inc. Electromagnetic shield for printed circuit board
US5014160A (en) * 1989-07-05 1991-05-07 Digital Equipment Corporation EMI/RFI shielding method and apparatus
GB2236910B (en) * 1989-09-28 1993-12-08 Technophone Ltd A housing for electronic circuitry
US5153379A (en) 1990-10-09 1992-10-06 Motorola, Inc. Shielded low-profile electronic component assembly
US5095296A (en) * 1990-12-31 1992-03-10 Fair-Rite Products Corporation Spilt ferrite bead case for flat cable
US5383098A (en) 1991-09-19 1995-01-17 Motorola, Inc. Shield assembly
US5365410A (en) 1991-10-22 1994-11-15 Nokia Mobile Phones Ltd. Electromagnetic compatibility enclosure
JP2501638Y2 (ja) * 1991-11-25 1996-06-19 船井電機株式会社 プリント基板装着用シ―ルド板
US5252782A (en) * 1992-06-29 1993-10-12 E-Systems, Inc. Apparatus for providing RFI/EMI isolation between adjacent circuit areas on a single circuit board
US5354951A (en) 1993-03-15 1994-10-11 Leader Tech, Inc. Circuit board component shielding enclosure and assembly
US5422433A (en) 1993-11-15 1995-06-06 Motorola, Inc. Radio frequency isolation shield having reclosable opening
US5436802A (en) 1994-03-16 1995-07-25 Motorola Method and apparatus for shielding an electrical circuit that is disposed on a substrate
US5495399A (en) 1994-07-05 1996-02-27 Motorola, Inc. Shield with detachable grasp support member
US5513996A (en) 1994-09-20 1996-05-07 Motorola, Inc. Clip and method therefor
US5530202A (en) 1995-01-09 1996-06-25 At&T Corp. Metallic RF or thermal shield for automatic vacuum placement
GB2297868B (en) * 1995-02-07 1999-04-28 Nokia Mobile Phones Ltd A shielding device
US5566055A (en) 1995-03-03 1996-10-15 Parker-Hannifin Corporation Shieled enclosure for electronics
DE19509553C1 (de) 1995-03-16 1996-07-18 Bosch Gmbh Robert Abschirmhaube
US5614694A (en) 1995-03-31 1997-03-25 Motorola, Inc. One piece open and closable metal RF shield
GB2300761B (en) 1995-05-12 1999-11-17 Nokia Mobile Phones Ltd Electromagnetic shield assembly
FI956226A (fi) 1995-12-22 1997-06-23 Nokia Mobile Phones Ltd Menetelmä ja järjestely elektronisen väliaineen sähkömagneettiseksi suojaamiseksi
DE19636182A1 (de) 1996-09-06 1998-03-12 Philips Patentverwaltung Abschirmgehäuse für elektronische Bauelemente
JPH10154890A (ja) * 1996-11-22 1998-06-09 Mitsumi Electric Co Ltd 複数のシールドケースの組立構造
US5991165A (en) 1996-12-24 1999-11-23 Ericsson Inc. Board to board RF shield with integrated connector/connector holder and method
US5844784A (en) 1997-03-24 1998-12-01 Qualcomm Incorporated Brace apparatus and method for printed wiring board assembly
SE511964C2 (sv) 1997-05-29 1999-12-20 Ericsson Telefon Ab L M Skärmningshölje jämte förfaranden för att framställa ett skärmningshölje
US6049469A (en) 1997-08-20 2000-04-11 Dell Usa, L.P. Combination electromagnetic shield and heat spreader
US6051781A (en) 1997-09-24 2000-04-18 Autosplice, Inc. Surface mount electromagnetic frequency interference shield clip
US6005186A (en) 1998-03-27 1999-12-21 International Business Machines Corporation Snap-fit electromagnetic shield
US6136131A (en) 1998-06-02 2000-10-24 Instrument Specialties Company, Inc. Method of shielding and obtaining access to a component on a printed circuit board
US6043983A (en) 1998-06-17 2000-03-28 Intel Corporation EMI containment for microprocessor core mounted on a card using surface mounted clips
FR2784262A1 (fr) 1998-10-06 2000-04-07 Philips Consumer Communication Ecran de blindage electromagnetique et substrat support de circuit equipe d'un tel ecran
US6347035B1 (en) 1998-10-30 2002-02-12 Fujitsu Limited Low profile EMI shield with heat spreading plate
FI982586A (fi) 1998-11-30 2000-05-31 Nokia Mobile Phones Ltd Elektroninen laite
US6178097B1 (en) 1999-01-22 2001-01-23 Dial Tool Industries, Inc. RF shield having removable cover
US6175077B1 (en) 1999-02-09 2001-01-16 Ericsson Inc. Shield can having tapered wall ends for surface mounting and radiotelephones incorporating same
JP4334662B2 (ja) 1999-04-07 2009-09-30 日本圧着端子製造株式会社 Ｉｃカード用フレームキットおよびｉｃカード
US6274808B1 (en) 1999-05-06 2001-08-14 Lucent Technologies, Inc. EMI shielding enclosure
US6313400B1 (en) 1999-07-13 2001-11-06 Itt Manufacturing Enterprises, Inc. Data card easily assembled housing
US6399875B1 (en) 1999-08-13 2002-06-04 Ptmw, Inc. Lightning protected housing structure
US6537084B2 (en) 1999-09-30 2003-03-25 Berg Technology, Inc. Electrical connector with electrical shield having latch and mounting arms
USD434771S (en) 1999-10-05 2000-12-05 Honda Tsushin Kogyo Co., Ltd. Upper metal cover for compact flash card
US6522291B1 (en) 1999-12-10 2003-02-18 Matsushita Electric Works, Ltd. GPS receiver sharing an antenna ground plane with an EMI shield
TW477516U (en) 2000-04-18 2002-02-21 Hon Hai Prec Ind Co Ltd Shielding structure of electronic device
US6738265B1 (en) 2000-04-19 2004-05-18 Nokia Mobile Phones Ltd. EMI shielding for portable electronic devices
JP2002043785A (ja) * 2000-07-28 2002-02-08 Murata Mfg Co Ltd シールドケース及びそれを用いた電子機器及びそれを用いた電子装置及びシールドケースの製造方法
SE0003930D0 (sv) 2000-10-27 2000-10-27 Allgon Ab Shielded housing
US6743975B2 (en) 2001-03-19 2004-06-01 Hewlett-Packard Development Company, L.P. Low profile non-electrically-conductive component cover for encasing circuit board components to prevent direct contact of a conformal EMI shield
US20020185294A1 (en) 2001-04-27 2002-12-12 Anatoliy Shlyakhtichman Push-fit shield and method for fabricating same
DE10120715A1 (de) 2001-04-27 2002-11-28 Bosch Gmbh Robert Gehäuse für ein elektrisches Gerät
WO2002093996A1 (en) 2001-05-10 2002-11-21 Parker Hannifin Corporation Manufacture of electronics enclosure having a metallized shielding layer
WO2003030610A1 (en) 2001-10-02 2003-04-10 Parker Hannifin Corporation Emi shielding gasket construction
US20030067757A1 (en) 2001-10-05 2003-04-10 Richardson Patrick J. Apparatus and method for shielding a device
JP2003133777A (ja) * 2001-10-24 2003-05-09 Matsushita Electric Ind Co Ltd シールドケース
US6711032B2 (en) 2001-11-20 2004-03-23 Mitsubishi Wireless Communications, Inc. Shield and method for shielding an electronic device
DE60110267T2 (de) 2001-12-17 2005-09-22 Nokia Corporation Abschirmelement für elektrische und/oder elektronische komponenten einer elektrischen oder elektronischen schaltung
US20040012939A1 (en) 2002-03-14 2004-01-22 Sun Microsystems, Inc. EMI shielding apparatus
US6744640B2 (en) 2002-04-10 2004-06-01 Gore Enterprise Holdings, Inc. Board-level EMI shield with enhanced thermal dissipation
US6781851B2 (en) 2002-05-30 2004-08-24 Lucent Technologies Inc. Electromagnetic interference shield
US6897371B1 (en) 2002-08-27 2005-05-24 A K Stamping Co. Inc. One-piece shielding enclosure with selective interior access, and method and blank therefor
US6870091B2 (en) 2002-11-01 2005-03-22 Interplex Nas, Inc. Two-piece electrical RF shield and method of manufacturing the same
USD484508S1 (en) 2002-11-27 2003-12-30 International Business Machines Corporation Server blade enclosure base
GB2396748B (en) 2002-12-24 2006-06-07 Ubinetics Ltd Screening electrical/electronic components
US6831224B2 (en) 2003-04-25 2004-12-14 Nokia Corporation One-piece manufactured shielding casing for accommodating electronic functional elements
US7095626B2 (en) 2003-05-29 2006-08-22 Interplex Nas Inc. Openable one-piece electrical RF shield and method of manufacturing the same
US6940010B2 (en) 2003-06-30 2005-09-06 Nokia Corporation Electromagnetic interference shield and method of making the same
EP1692927A4 (de) 2003-12-08 2009-04-01 Laird Technologies Inc Ersatzabdeckung für ein elektromagnetisches abschirmsystem
TWI351918B (en) * 2004-01-29 2011-11-01 Laird Technologies Inc Ultra-low height electromagnetic interference shie
USD522517S1 (en) 2005-02-25 2006-06-06 Laird Technologies, Inc. Push-fit EMI shield
TW200700171A (en) 2005-06-24 2007-01-01 Yuan Deng Metals Ind Co Ltd Isolating shield
JP4539983B2 (ja) * 2005-07-14 2010-09-08 ニチコン株式会社 電子回路のシールド構造
JP2007059835A (ja) * 2005-08-26 2007-03-08 Matsushita Electric Works Ltd 電磁波シールド成形体
US7491899B2 (en) 2005-10-06 2009-02-17 Laird Technologies, Inc. EMI shields and related manufacturing methods
CN2887006Y (zh) * 2005-11-30 2007-04-04 富士康(昆山)电脑接插件有限公司 电子装置的屏蔽构造

Also Published As

Publication number Publication date
JP2009060067A (ja) 2009-03-19
JP4777962B2 (ja) 2011-09-21
EP2031950A1 (de) 2009-03-04
KR20090022985A (ko) 2009-03-04
KR100898026B1 (ko) 2009-05-19
US7504592B1 (en) 2009-03-17
ATE497688T1 (de) 2011-02-15
EP2031950B1 (de) 2011-02-02
CN101378647A (zh) 2009-03-04
TWI354533B (en) 2011-12-11
US20090057003A1 (en) 2009-03-05
TW200911106A (en) 2009-03-01
CN101378647B (zh) 2012-03-14

Similar Documents

Publication Publication Date Title
DE602007012345D1 (de) Elektromagnetische Abschirmungen und zugehöriges Herstellungsverfahren
ATE427032T1 (de) Abschirmvorrichtung fur elektromagnetische interferenz und herstellungsverfahren dafur
DE602005024676D1 (de) Ultraniedriges elektromagnetische störungen abschirmendes gehäuse
USD676004S1 (en) Printed circuit board for a mobile speaker unit
USD653799S1 (en) Light grid bezel
USD623020S1 (en) Child's plate
USD697722S1 (en) Fibrous material sheet with patterned surface
CA138912S (en) Lid
CA118714S (en) Front cover for a handset
CA135409S (en) Sample processing disk cover
NZ591309A (en) A vent insert for a mask having a base and one or more grill components coupled to the base to selectively define fine, porous vent orifices through the insert
NZ601237A (en) Container
TW200712664A (en) Backlight module
TW200951569A (en) Backlight module
USD673754S1 (en) Shipping pallet
CA139660S (en) Front combination lamp for automobile
CA145417S (en) Multi-panel sidewall container
USD715426S1 (en) Light shielding cover of a biochemical analyzer
CA151242S (en) Packaging for medicated sponges
WO2010142271A3 (de) Siebdruckform
USD715425S1 (en) Light shielding cover of a biochemical analyzer
CA134528S (en) Cargo box lid with double bevel edge
USD659061S1 (en) Hibiscus license plate frame
TW200709412A (en) Semiconductor device with recessed L-shaped spacer and method of fabricating the same
USD663305S1 (en) Enclosure for electronic components