DE602007010547D1 - Phasenwechsel-Speicherzelle mit Nanoverbundisolator - Google Patents

Phasenwechsel-Speicherzelle mit Nanoverbundisolator

Info

Publication number
DE602007010547D1
DE602007010547D1 DE602007010547T DE602007010547T DE602007010547D1 DE 602007010547 D1 DE602007010547 D1 DE 602007010547D1 DE 602007010547 T DE602007010547 T DE 602007010547T DE 602007010547 T DE602007010547 T DE 602007010547T DE 602007010547 D1 DE602007010547 D1 DE 602007010547D1
Authority
DE
Germany
Prior art keywords
nanocomposite
isolator
memory cell
phase change
change memory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007010547T
Other languages
English (en)
Inventor
Thomas Dr Happ
Jan Boris Philipp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qimonda AG
Original Assignee
Qimonda North America Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qimonda North America Corp filed Critical Qimonda North America Corp
Publication of DE602007010547D1 publication Critical patent/DE602007010547D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20—Multistable switching devices, e.g. memristors
    • H10N70/231—Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/011—Manufacture or treatment of multistable switching devices
    • H10N70/021—Formation of switching materials, e.g. deposition of layers
    • H10N70/023—Formation of switching materials, e.g. deposition of layers by chemical vapor deposition, e.g. MOCVD, ALD
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/821—Device geometry
    • H10N70/823—Device geometry adapted for essentially horizontal current flow, e.g. bridge type devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/821—Device geometry
    • H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/821—Device geometry
    • H10N70/828—Current flow limiting means within the switching material region, e.g. constrictions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/861—Thermal details
    • H10N70/8616—Thermal insulation means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/881—Switching materials
    • H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
    • H10N70/8828—Tellurides, e.g. GeSbTe
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/881—Switching materials
    • H10N70/884—Switching materials based on at least one element of group IIIA, IVA or VA, e.g. elemental or compound semiconductors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/70—Nanostructure
    • Y10S977/701—Integrated with dissimilar structures on a common substrate
    • Y10S977/72—On an electrically conducting, semi-conducting, or semi-insulating substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/70—Nanostructure
    • Y10S977/701—Integrated with dissimilar structures on a common substrate
    • Y10S977/723—On an electrically insulating substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/70—Nanostructure
    • Y10S977/778—Nanostructure within specified host or matrix material, e.g. nanocomposite films
    • Y10S977/785—Electrically insulating host material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/70—Nanostructure
    • Y10S977/831—Of specified ceramic or electrically insulating compositions

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Nanotechnology (AREA)
  • Semiconductor Memories (AREA)
DE602007010547T 2006-07-20 2007-07-16 Phasenwechsel-Speicherzelle mit Nanoverbundisolator Active DE602007010547D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/490,213 US7453081B2 (en) 2006-07-20 2006-07-20 Phase change memory cell including nanocomposite insulator

Publications (1)

Publication Number Publication Date
DE602007010547D1 true DE602007010547D1 (de) 2010-12-30

Family

ID=38626702

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007010547T Active DE602007010547D1 (de) 2006-07-20 2007-07-16 Phasenwechsel-Speicherzelle mit Nanoverbundisolator

Country Status (6)

Country Link
US (1) US7453081B2 (de)
EP (1) EP1881542B8 (de)
JP (1) JP2008078625A (de)
KR (1) KR20080009023A (de)
CN (1) CN101110468A (de)
DE (1) DE602007010547D1 (de)

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US7459717B2 (en) * 2005-11-28 2008-12-02 Macronix International Co., Ltd. Phase change memory cell and manufacturing method
JP4991155B2 (ja) * 2006-01-19 2012-08-01 株式会社東芝 半導体記憶装置
US7646006B2 (en) * 2006-03-30 2010-01-12 International Business Machines Corporation Three-terminal cascade switch for controlling static power consumption in integrated circuits
US7545667B2 (en) * 2006-03-30 2009-06-09 International Business Machines Corporation Programmable via structure for three dimensional integration technology
US7394089B2 (en) * 2006-08-25 2008-07-01 International Business Machines Corporation Heat-shielded low power PCM-based reprogrammable EFUSE device
US7749802B2 (en) * 2007-01-09 2010-07-06 International Business Machines Corporation Process for chemical vapor deposition of materials with via filling capability and structure formed thereby
US7411818B1 (en) * 2007-02-07 2008-08-12 International Business Machines Corporation Programmable fuse/non-volatile memory structures using externally heated phase change material
US7732888B2 (en) * 2007-04-16 2010-06-08 Qimonda Ag Integrated circuit, method for manufacturing an integrated circuit, memory cell array, memory module, and device
US8373148B2 (en) * 2007-04-26 2013-02-12 Spansion Llc Memory device with improved performance
US7679163B2 (en) * 2007-05-14 2010-03-16 Industrial Technology Research Institute Phase-change memory element
US7997791B2 (en) * 2007-07-24 2011-08-16 Qimonda Ag Temperature sensor, integrated circuit, memory module, and method of collecting temperature treatment data
US7633079B2 (en) * 2007-09-06 2009-12-15 International Business Machines Corporation Programmable fuse/non-volatile memory structures in BEOL regions using externally heated phase change material
KR20090075539A (ko) * 2008-01-04 2009-07-08 삼성전자주식회사 단일 조성의 반금속 박막을 이용한 상변화 메모리
TWI375324B (en) * 2008-01-18 2012-10-21 Univ Nat Taiwan Phase-change material, memory unit, and method for storing/reading data electrically
US8426838B2 (en) 2008-01-25 2013-04-23 Higgs Opl. Capital Llc Phase-change memory
US8378328B2 (en) * 2008-02-22 2013-02-19 International Business Machines Corporation Phase change memory random access device using single-element phase change material
US8324605B2 (en) * 2008-10-02 2012-12-04 Macronix International Co., Ltd. Dielectric mesh isolated phase change structure for phase change memory
US8604457B2 (en) 2008-11-12 2013-12-10 Higgs Opl. Capital Llc Phase-change memory element
US8363463B2 (en) 2009-06-25 2013-01-29 Macronix International Co., Ltd. Phase change memory having one or more non-constant doping profiles
JP5692085B2 (ja) 2009-11-11 2015-04-01 日本電気株式会社 抵抗変化素子、半導体装置、および抵抗変化素子の形成方法
KR20110090583A (ko) * 2010-02-04 2011-08-10 삼성전자주식회사 상변화 메모리 장치 및 그 형성 방법
JP5572056B2 (ja) * 2010-10-20 2014-08-13 株式会社東芝 記憶装置及びその製造方法
US8735863B2 (en) * 2011-01-28 2014-05-27 Privatran Integrated nonvolatile resistive memory elements
US8426242B2 (en) 2011-02-01 2013-04-23 Macronix International Co., Ltd. Composite target sputtering for forming doped phase change materials
FR2972849A1 (fr) * 2011-03-15 2012-09-21 Commissariat Energie Atomique Cellule memoire
US8946666B2 (en) 2011-06-23 2015-02-03 Macronix International Co., Ltd. Ge-Rich GST-212 phase change memory materials
CN103733338B (zh) 2011-06-24 2016-10-26 慧与发展有限责任合伙企业 高可靠性高速忆阻器
JP5225479B2 (ja) * 2011-09-27 2013-07-03 有限会社 ナプラ 半導体基板、電子デバイス及びその製造方法
US8994489B2 (en) 2011-10-19 2015-03-31 Micron Technology, Inc. Fuses, and methods of forming and using fuses
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US9093141B2 (en) 2011-12-16 2015-07-28 Intermec Ip Corp. Phase change memory devices, method for encoding, and methods for storing data
US9136467B2 (en) * 2012-04-30 2015-09-15 Micron Technology, Inc. Phase change memory cells and methods of forming phase change memory cells
TWI469408B (zh) * 2012-05-07 2015-01-11 Univ Feng Chia 超薄與多層結構相變化記憶體元件
US9291297B2 (en) 2012-12-19 2016-03-22 Elwha Llc Multi-layer phononic crystal thermal insulators
US9553262B2 (en) 2013-02-07 2017-01-24 Micron Technology, Inc. Arrays of memory cells and methods of forming an array of memory cells
TWI549229B (zh) 2014-01-24 2016-09-11 旺宏電子股份有限公司 應用於系統單晶片之記憶體裝置內的多相變化材料
US9881971B2 (en) 2014-04-01 2018-01-30 Micron Technology, Inc. Memory arrays
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Also Published As

Publication number Publication date
KR20080009023A (ko) 2008-01-24
US20080017842A1 (en) 2008-01-24
US7453081B2 (en) 2008-11-18
EP1881542B1 (de) 2010-11-17
EP1881542B8 (de) 2011-01-19
JP2008078625A (ja) 2008-04-03
EP1881542A1 (de) 2008-01-23
CN101110468A (zh) 2008-01-23

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Legal Events

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8327 Change in the person/name/address of the patent owner

Owner name: QIMONDA AG, 81739 MUENCHEN, DE