DE602007001752D1 - Epoxidharzzusammensetzung zur Kapselung eines optischen Halbleiters, gehärtetes Harz daraus und daraus hergestellte optische Halbleitervorrichtung - Google Patents
Epoxidharzzusammensetzung zur Kapselung eines optischen Halbleiters, gehärtetes Harz daraus und daraus hergestellte optische HalbleitervorrichtungInfo
- Publication number
- DE602007001752D1 DE602007001752D1 DE602007001752T DE602007001752T DE602007001752D1 DE 602007001752 D1 DE602007001752 D1 DE 602007001752D1 DE 602007001752 T DE602007001752 T DE 602007001752T DE 602007001752 T DE602007001752 T DE 602007001752T DE 602007001752 D1 DE602007001752 D1 DE 602007001752D1
- Authority
- DE
- Germany
- Prior art keywords
- optical semiconductor
- therefrom
- epoxy resin
- resin composition
- encapsulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0091—Complexes with metal-heteroatom-bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/315—Compounds containing carbon-to-nitrogen triple bonds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006255410 | 2006-09-21 | ||
JP2007145913A JP4950770B2 (ja) | 2006-09-21 | 2007-05-31 | 光半導体封止用エポキシ樹脂組成物およびその硬化体ならびにそれを用いた光半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602007001752D1 true DE602007001752D1 (de) | 2009-09-10 |
Family
ID=38698444
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602007001752T Active DE602007001752D1 (de) | 2006-09-21 | 2007-09-17 | Epoxidharzzusammensetzung zur Kapselung eines optischen Halbleiters, gehärtetes Harz daraus und daraus hergestellte optische Halbleitervorrichtung |
Country Status (8)
Country | Link |
---|---|
US (1) | US8017670B2 (de) |
EP (1) | EP1903605B1 (de) |
JP (1) | JP4950770B2 (de) |
KR (1) | KR101069786B1 (de) |
AT (1) | ATE438198T1 (de) |
DE (1) | DE602007001752D1 (de) |
MY (1) | MY142489A (de) |
TW (1) | TWI415231B (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5349087B2 (ja) | 2009-03-09 | 2013-11-20 | 日東電工株式会社 | 光半導体受光素子封止用エポキシ樹脂組成物およびその製造方法、ならびに光半導体装置 |
KR100967613B1 (ko) * | 2009-11-10 | 2010-07-05 | 주식회사 네패스신소재 | 반경화 에폭시 수지, 및 이의 제조방법 |
KR20120104198A (ko) | 2009-11-10 | 2012-09-20 | 로무 가부시키가이샤 | 반도체 장치 및 반도체 장치의 제조 방법 |
JP6277611B2 (ja) * | 2013-06-24 | 2018-02-14 | 日立化成株式会社 | 素子封止用エポキシ樹脂成形材料及び電子部品装置 |
WO2014208514A1 (ja) * | 2013-06-28 | 2014-12-31 | 山田化学工業株式会社 | フタロシアニン化合物、近赤外線吸収色素及び近赤外線吸収材料 |
EP2827368B1 (de) | 2013-07-19 | 2019-06-05 | ams AG | Verpackung für einen optischen Sensor, Anordnung eines optischen Sensors und Verfahren zur Herstellung einer Verpackung für einen optischen Sensor |
CN104151776B (zh) * | 2014-08-08 | 2017-05-10 | 吴晓龙 | 可见光传感器 |
US10611911B1 (en) | 2016-05-05 | 2020-04-07 | SolEpoxy, Inc. | Epoxy resin composition with soda lime glass filler |
TWI743440B (zh) | 2018-01-31 | 2021-10-21 | 日商信越化學工業股份有限公司 | 紅外線穿透性硬化型組成物、其硬化物及光半導體裝置 |
CN113711113B (zh) | 2019-04-26 | 2023-07-28 | 三井化学株式会社 | 光学材料、光学材料用聚合性组合物、塑料透镜、护目镜、红外线传感器及红外线照相机 |
WO2023176610A1 (ja) * | 2022-03-17 | 2023-09-21 | 富士フイルム株式会社 | 硬化性組成物、膜、光学フィルタ、固体撮像素子および画像表示装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63179921A (ja) * | 1987-01-21 | 1988-07-23 | Toshiba Corp | 封止用樹脂組成物およびそれを用いた樹脂封止型半導体装置 |
EP0433220B1 (de) | 1989-11-22 | 1995-01-25 | Ciba-Geigy Ag | Substituierte Naphthalocyanine und deren Verwendung |
JP3888712B2 (ja) * | 1995-10-02 | 2007-03-07 | 三井化学株式会社 | 高耐久性近赤外線吸収化合物及びその用途 |
JPH09263658A (ja) * | 1996-01-25 | 1997-10-07 | Mitsui Toatsu Chem Inc | 近赤外線吸収樹脂組成物およびその用途 |
JP2000044883A (ja) * | 1998-05-25 | 2000-02-15 | Mitsubishi Chemicals Corp | 熱線遮断有機膜およびその製造方法 |
JP3855067B2 (ja) * | 1999-04-28 | 2006-12-06 | 山本化成株式会社 | 半導体封止用エポキシ樹脂組成物 |
JP2002226678A (ja) * | 2000-11-28 | 2002-08-14 | Sumitomo Bakelite Co Ltd | 難燃性エポキシ樹脂組成物およびそれを用いた半導体封止材料並びに半導体装置 |
JP2002265760A (ja) | 2001-03-14 | 2002-09-18 | Sumitomo Bakelite Co Ltd | 難燃性エポキシ樹脂組成物およびそれを用いた半導体封止材料 |
JP2004182857A (ja) | 2002-12-03 | 2004-07-02 | Sumitomo Seika Chem Co Ltd | 近赤外線吸収色素 |
JP4488762B2 (ja) | 2003-04-04 | 2010-06-23 | 株式会社Adeka | シアニン化合物、光学フィルター及び光学記録材料 |
JP2005120228A (ja) | 2003-10-16 | 2005-05-12 | Nitto Denko Corp | 光半導体素子封止用エポキシ樹脂組成物およびそれを用いた光半導体装置 |
JP4512940B2 (ja) | 2003-12-24 | 2010-07-28 | 三菱マテリアル株式会社 | 錫ドープ酸化インジウム微粒子分散液とその製造方法、および該分散液を用いた熱線遮蔽性を有する合わせガラス用中間膜、ならびにその合わせガラス |
JP4894147B2 (ja) | 2005-01-31 | 2012-03-14 | 住友ベークライト株式会社 | 半導体封止用樹脂組成物及び半導体装置 |
-
2007
- 2007-05-31 JP JP2007145913A patent/JP4950770B2/ja active Active
- 2007-09-10 TW TW096133727A patent/TWI415231B/zh active
- 2007-09-14 US US11/855,267 patent/US8017670B2/en not_active Expired - Fee Related
- 2007-09-17 AT AT07018230T patent/ATE438198T1/de not_active IP Right Cessation
- 2007-09-17 MY MYPI20071553A patent/MY142489A/en unknown
- 2007-09-17 DE DE602007001752T patent/DE602007001752D1/de active Active
- 2007-09-17 EP EP07018230A patent/EP1903605B1/de not_active Not-in-force
- 2007-09-20 KR KR1020070095811A patent/KR101069786B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
TWI415231B (zh) | 2013-11-11 |
EP1903605B1 (de) | 2009-07-29 |
ATE438198T1 (de) | 2009-08-15 |
MY142489A (en) | 2010-11-30 |
US8017670B2 (en) | 2011-09-13 |
TW200901399A (en) | 2009-01-01 |
JP2008101188A (ja) | 2008-05-01 |
US20100041799A2 (en) | 2010-02-18 |
KR101069786B1 (ko) | 2011-10-05 |
EP1903605A1 (de) | 2008-03-26 |
KR20080027172A (ko) | 2008-03-26 |
JP4950770B2 (ja) | 2012-06-13 |
US20080114101A1 (en) | 2008-05-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |