DE602005005859T2 - Kühlsystem und -verfahren - Google Patents

Kühlsystem und -verfahren Download PDF

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Publication number
DE602005005859T2
DE602005005859T2 DE602005005859T DE602005005859T DE602005005859T2 DE 602005005859 T2 DE602005005859 T2 DE 602005005859T2 DE 602005005859 T DE602005005859 T DE 602005005859T DE 602005005859 T DE602005005859 T DE 602005005859T DE 602005005859 T2 DE602005005859 T2 DE 602005005859T2
Authority
DE
Germany
Prior art keywords
coolant
cooling
cooling circuit
heat
heat exchanger
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602005005859T
Other languages
German (de)
English (en)
Other versions
DE602005005859D1 (de
Inventor
Levi New Paltz CAMPBELL
Richard Hopewell Junction CHU
Michael Lagrangeville ELLSWORTH
Madhusudan c/o IBM UK Limited IPL IYENGAR
Roger Poughkeepsie SCHMIDT
Robert Poughkeepsie SIMONS
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE602005005859D1 publication Critical patent/DE602005005859D1/de
Application granted granted Critical
Publication of DE602005005859T2 publication Critical patent/DE602005005859T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/2079—Liquid cooling without phase change within rooms for removing heat from cabinets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Motor Or Generator Cooling System (AREA)
DE602005005859T 2004-12-09 2005-12-07 Kühlsystem und -verfahren Expired - Lifetime DE602005005859T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US8711 2004-12-09
US11/008,711 US6973801B1 (en) 2004-12-09 2004-12-09 Cooling system and method employing a closed loop coolant path and micro-scaled cooling structure within an electronics subsystem of an electronics rack
PCT/EP2005/056581 WO2006061404A1 (en) 2004-12-09 2005-12-07 Cooling system and method

Publications (2)

Publication Number Publication Date
DE602005005859D1 DE602005005859D1 (de) 2008-05-15
DE602005005859T2 true DE602005005859T2 (de) 2009-05-20

Family

ID=35452409

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005005859T Expired - Lifetime DE602005005859T2 (de) 2004-12-09 2005-12-07 Kühlsystem und -verfahren

Country Status (7)

Country Link
US (1) US6973801B1 (enExample)
EP (1) EP1829441B1 (enExample)
JP (1) JP4511601B2 (enExample)
CN (1) CN100556260C (enExample)
AT (1) ATE391406T1 (enExample)
DE (1) DE602005005859T2 (enExample)
WO (1) WO2006061404A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202018102582U1 (de) 2018-01-23 2018-05-22 MEGWARE Computer Vertrieb und Service GmbH Hochtemperatur-direktflüssigkeitsgekühltes Hochleistungsrechnersystem

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DE202018102582U1 (de) 2018-01-23 2018-05-22 MEGWARE Computer Vertrieb und Service GmbH Hochtemperatur-direktflüssigkeitsgekühltes Hochleistungsrechnersystem

Also Published As

Publication number Publication date
EP1829441B1 (en) 2008-04-02
JP2008523599A (ja) 2008-07-03
DE602005005859D1 (de) 2008-05-15
JP4511601B2 (ja) 2010-07-28
EP1829441A1 (en) 2007-09-05
ATE391406T1 (de) 2008-04-15
CN101091424A (zh) 2007-12-19
US6973801B1 (en) 2005-12-13
WO2006061404A1 (en) 2006-06-15
CN100556260C (zh) 2009-10-28

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