CN100556260C - 冷却系统和方法 - Google Patents

冷却系统和方法 Download PDF

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Publication number
CN100556260C
CN100556260C CN200580042255.3A CN200580042255A CN100556260C CN 100556260 C CN100556260 C CN 100556260C CN 200580042255 A CN200580042255 A CN 200580042255A CN 100556260 C CN100556260 C CN 100556260C
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CN
China
Prior art keywords
coolant
cooling
cooling circuit
heat
electronics
Prior art date
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Expired - Lifetime
Application number
CN200580042255.3A
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English (en)
Chinese (zh)
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CN101091424A (zh
Inventor
莱维·坎贝尔
朱兆凡
迈克尔·埃尔斯沃斯
马德胡苏丹·英加尔
罗格·施米德
罗伯特·西蒙斯
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Lenovo International Ltd
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International Business Machines Corp
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Publication of CN101091424A publication Critical patent/CN101091424A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/2079—Liquid cooling without phase change within rooms for removing heat from cabinets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Motor Or Generator Cooling System (AREA)
CN200580042255.3A 2004-12-09 2005-12-07 冷却系统和方法 Expired - Lifetime CN100556260C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/008,711 2004-12-09
US11/008,711 US6973801B1 (en) 2004-12-09 2004-12-09 Cooling system and method employing a closed loop coolant path and micro-scaled cooling structure within an electronics subsystem of an electronics rack

Publications (2)

Publication Number Publication Date
CN101091424A CN101091424A (zh) 2007-12-19
CN100556260C true CN100556260C (zh) 2009-10-28

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Family Applications (1)

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CN200580042255.3A Expired - Lifetime CN100556260C (zh) 2004-12-09 2005-12-07 冷却系统和方法

Country Status (7)

Country Link
US (1) US6973801B1 (enExample)
EP (1) EP1829441B1 (enExample)
JP (1) JP4511601B2 (enExample)
CN (1) CN100556260C (enExample)
AT (1) ATE391406T1 (enExample)
DE (1) DE602005005859T2 (enExample)
WO (1) WO2006061404A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105144861A (zh) * 2013-03-29 2015-12-09 惠普发展公司，有限责任合伙企业 具有冷却装置的电子装置
TWI877838B (zh) * 2023-07-26 2025-03-21 廣達電腦股份有限公司 用於電腦系統之液冷機架組合及包含其之電信系統

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CN105144861B (zh) * 2013-03-29 2018-04-17 慧与发展有限责任合伙企业 具有冷却装置的电子装置
TWI877838B (zh) * 2023-07-26 2025-03-21 廣達電腦股份有限公司 用於電腦系統之液冷機架組合及包含其之電信系統
US12369282B2 (en) 2023-07-26 2025-07-22 Quanta Computer Inc. Liquid cooling rack assembly for computing system and telecommunication system including the same

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DE602005005859T2 (de) 2009-05-20
CN101091424A (zh) 2007-12-19
EP1829441A1 (en) 2007-09-05
DE602005005859D1 (de) 2008-05-15
US6973801B1 (en) 2005-12-13
JP2008523599A (ja) 2008-07-03
ATE391406T1 (de) 2008-04-15
EP1829441B1 (en) 2008-04-02
WO2006061404A1 (en) 2006-06-15
JP4511601B2 (ja) 2010-07-28

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