JP4511601B2 - 冷却システム及び方法 - Google Patents

冷却システム及び方法 Download PDF

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Publication number
JP4511601B2
JP4511601B2 JP2007544912A JP2007544912A JP4511601B2 JP 4511601 B2 JP4511601 B2 JP 4511601B2 JP 2007544912 A JP2007544912 A JP 2007544912A JP 2007544912 A JP2007544912 A JP 2007544912A JP 4511601 B2 JP4511601 B2 JP 4511601B2
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JP
Japan
Prior art keywords
cooling
coolant
loop
subsystem
cooling loop
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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JP2007544912A
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English (en)
Japanese (ja)
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JP2008523599A (ja
JP2008523599A5 (enExample
Inventor
キャンベル、リーバイ
チュー、リチャード
エルスワース、マイケル
アイアンガー、マドゥスーダン
シュミット、ロジャー
サイモンズ、ロバート
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International Business Machines Corp
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International Business Machines Corp
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Publication of JP2008523599A publication Critical patent/JP2008523599A/ja
Publication of JP2008523599A5 publication Critical patent/JP2008523599A5/ja
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Publication of JP4511601B2 publication Critical patent/JP4511601B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/2079—Liquid cooling without phase change within rooms for removing heat from cabinets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Motor Or Generator Cooling System (AREA)
JP2007544912A 2004-12-09 2005-12-07 冷却システム及び方法 Expired - Lifetime JP4511601B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/008,711 US6973801B1 (en) 2004-12-09 2004-12-09 Cooling system and method employing a closed loop coolant path and micro-scaled cooling structure within an electronics subsystem of an electronics rack
PCT/EP2005/056581 WO2006061404A1 (en) 2004-12-09 2005-12-07 Cooling system and method

Publications (3)

Publication Number Publication Date
JP2008523599A JP2008523599A (ja) 2008-07-03
JP2008523599A5 JP2008523599A5 (enExample) 2008-10-23
JP4511601B2 true JP4511601B2 (ja) 2010-07-28

Family

ID=35452409

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007544912A Expired - Lifetime JP4511601B2 (ja) 2004-12-09 2005-12-07 冷却システム及び方法

Country Status (7)

Country Link
US (1) US6973801B1 (enExample)
EP (1) EP1829441B1 (enExample)
JP (1) JP4511601B2 (enExample)
CN (1) CN100556260C (enExample)
AT (1) ATE391406T1 (enExample)
DE (1) DE602005005859T2 (enExample)
WO (1) WO2006061404A1 (enExample)

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Also Published As

Publication number Publication date
DE602005005859T2 (de) 2009-05-20
CN101091424A (zh) 2007-12-19
EP1829441A1 (en) 2007-09-05
DE602005005859D1 (de) 2008-05-15
US6973801B1 (en) 2005-12-13
CN100556260C (zh) 2009-10-28
JP2008523599A (ja) 2008-07-03
ATE391406T1 (de) 2008-04-15
EP1829441B1 (en) 2008-04-02
WO2006061404A1 (en) 2006-06-15

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