DE602004024022D1 - Verfahren zur Herstellung eines RFIDs - Google Patents

Verfahren zur Herstellung eines RFIDs

Info

Publication number
DE602004024022D1
DE602004024022D1 DE602004024022T DE602004024022T DE602004024022D1 DE 602004024022 D1 DE602004024022 D1 DE 602004024022D1 DE 602004024022 T DE602004024022 T DE 602004024022T DE 602004024022 T DE602004024022 T DE 602004024022T DE 602004024022 D1 DE602004024022 D1 DE 602004024022D1
Authority
DE
Germany
Prior art keywords
rfid
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004024022T
Other languages
English (en)
Inventor
Naoya Kanda
Kosuke Inoue
Madoka Minagawa
Shigeharu Tsunoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE602004024022D1 publication Critical patent/DE602004024022D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16238—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area protruding from the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8138—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/81395—Bonding interfaces outside the semiconductor or solid-state body having an external coating, e.g. protective bond-through coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
DE602004024022T 2003-11-12 2004-09-27 Verfahren zur Herstellung eines RFIDs Active DE602004024022D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003381954 2003-11-12
JP2004234016A JP4438558B2 (ja) 2003-11-12 2004-08-11 Ｒｆｉｄタグの製造方法

Publications (1)

Publication Number Publication Date
DE602004024022D1 true DE602004024022D1 (de) 2009-12-24

Family

ID=34467813

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004024022T Active DE602004024022D1 (de) 2003-11-12 2004-09-27 Verfahren zur Herstellung eines RFIDs

Country Status (7)

Country Link
US (1) US7122087B2 (de)
EP (1) EP1538559B1 (de)
JP (1) JP4438558B2 (de)
KR (1) KR100712576B1 (de)
CN (1) CN100358119C (de)
DE (1) DE602004024022D1 (de)
TW (1) TWI239555B (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004094839A (ja) * 2002-09-04 2004-03-25 Hitachi Ltd Ｒｆｉｄタグ
JP4567988B2 (ja) * 2004-02-05 2010-10-27 株式会社日立製作所 紙状ｒｆｉｄタグおよびその製造方法
TWI339358B (en) * 2005-07-04 2011-03-21 Hitachi Ltd Rfid tag and manufacturing method thereof
EP1912284B1 (de) * 2005-07-29 2012-04-11 Fujitsu Ltd. Hf-etikett und hf-etikettenherstellungsverfahren
DE602005024628D1 (de) 2005-07-29 2010-12-16 Fujitsu Ltd Hf-etikettenherstellungsverfahren
JP2007058479A (ja) * 2005-08-24 2007-03-08 Omron Corp Ｉｃモジュール検査方法とその装置、ｉｃモジュール通信方法とその装置、およびｉｃモジュール
NL1030664C2 (nl) * 2005-12-13 2007-06-14 Meco Equip Eng Werkwijze voor het verbinden van sporen aan tegenover elkaar gelegen zijden van een drager.
US7756747B2 (en) * 2006-03-10 2010-07-13 Microsoft Corporation RFID business process-decoupling of design and deployment time activities
US20070256773A1 (en) * 2006-05-03 2007-11-08 Fu-Nan Huang Cool transfer wireless RF identification label
CN101601054B (zh) * 2006-10-09 2011-12-14 Nxp股份有限公司 包括芯片和衬底的系统以及组装该系统的方法
DE102008016830A1 (de) * 2008-03-28 2009-10-15 Smartrac Ip B.V. Verfahren und Vorrichtung zur Applikation eines Chipmoduls
US8393547B2 (en) * 2009-08-05 2013-03-12 Perfect Plastic Printing Corporation RF proximity financial transaction card having metallic foil layer(s)
JP2010251789A (ja) * 2010-06-22 2010-11-04 Sony Chemical & Information Device Corp 接合体及びその製造方法
DE102013016856A1 (de) 2013-10-10 2015-04-16 Klöckner Pentaplast Gmbh Polymerfolie mit RFID-Tags
CN104091196B (zh) * 2014-08-06 2018-05-22 朱云晖 一种耐水洗、耐高温的rfid标签及其复合成型工艺
CN107108922B (zh) 2014-12-08 2020-08-18 3M创新有限公司 丙烯酸聚乙烯醇缩醛膜和组合物
CN106691519A (zh) * 2015-11-13 2017-05-24 刘智佳 一种手术器械及该手术器械用rfid标签的安装方法
JP2019502574A (ja) * 2015-12-22 2019-01-31 スリーエム イノベイティブ プロパティズ カンパニー 第２の層を備えたアクリルポリビニルアセタールフィルム
CN106295773A (zh) * 2016-08-08 2017-01-04 深圳劲嘉集团股份有限公司 带有射频识别天线的卡纸及生产工艺
TWI685119B (zh) * 2018-10-02 2020-02-11 臺灣塑膠工業股份有限公司 染料敏化電池之貼膜方法
CN109685181A (zh) * 2018-12-05 2019-04-26 永道无线射频标签(扬州)有限公司 一种耐高温的rfid标签
US10909438B1 (en) * 2019-07-12 2021-02-02 The Florida International University Board Of Trustees Passive RFID temperature sensors with liquid crystal elastomers

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0740906B2 (ja) * 1987-09-22 1995-05-10 日本たばこ産業株式会社 たばこ原料の膨化方法
US5354392A (en) * 1992-01-24 1994-10-11 Matsushita Electric Industrial Co., Ltd. Method for connecting a wiring arranged on a sheet with another wiring arranged on another sheet by ultrasonic waves
JP3928682B2 (ja) * 1999-06-22 2007-06-13 オムロン株式会社 配線基板同士の接合体、配線基板同士の接合方法、データキャリアの製造方法、及び電子部品モジュールの実装装置
JP3451373B2 (ja) * 1999-11-24 2003-09-29 オムロン株式会社 電磁波読み取り可能なデータキャリアの製造方法
FI111881B (fi) * 2000-06-06 2003-09-30 Rafsec Oy Älykorttiraina ja menetelmä sen valmistamiseksi
US6693541B2 (en) * 2001-07-19 2004-02-17 3M Innovative Properties Co RFID tag with bridge circuit assembly and methods of use
JP3584404B2 (ja) * 2003-01-17 2004-11-04 オムロン株式会社 半導体チップの実装方法

Also Published As

Publication number Publication date
TW200516640A (en) 2005-05-16
CN1617317A (zh) 2005-05-18
JP2005166012A (ja) 2005-06-23
JP4438558B2 (ja) 2010-03-24
KR100712576B1 (ko) 2007-05-02
EP1538559A1 (de) 2005-06-08
CN100358119C (zh) 2007-12-26
TWI239555B (en) 2005-09-11
US7122087B2 (en) 2006-10-17
EP1538559B1 (de) 2009-11-11
KR20050045911A (ko) 2005-05-17
US20050130425A1 (en) 2005-06-16

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