DE602004004236D1 - Poliertuch und Herstellungsverfahren eines Halbleiterbauelementes - Google Patents

Poliertuch und Herstellungsverfahren eines Halbleiterbauelementes

Info

Publication number
DE602004004236D1
DE602004004236D1 DE602004004236T DE602004004236T DE602004004236D1 DE 602004004236 D1 DE602004004236 D1 DE 602004004236D1 DE 602004004236 T DE602004004236 T DE 602004004236T DE 602004004236 T DE602004004236 T DE 602004004236T DE 602004004236 D1 DE602004004236 D1 DE 602004004236D1
Authority
DE
Germany
Prior art keywords
manufacturing
semiconductor device
polishing cloth
polishing
cloth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004004236T
Other languages
English (en)
Other versions
DE602004004236T2 (de
Inventor
Hideaki Hirabayashi
Naoaki Sakurai
Akiko Saito
Koji Sato
Tomiho Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of DE602004004236D1 publication Critical patent/DE602004004236D1/de
Application granted granted Critical
Publication of DE602004004236T2 publication Critical patent/DE602004004236T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
DE602004004236T 2003-11-28 2004-11-25 Poliertuch und Herstellungsverfahren eines Halbleiterbauelementes Active DE602004004236T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003400915A JP4342918B2 (ja) 2003-11-28 2003-11-28 研磨布および半導体装置の製造方法
JP2003400915 2003-11-28

Publications (2)

Publication Number Publication Date
DE602004004236D1 true DE602004004236D1 (de) 2007-02-22
DE602004004236T2 DE602004004236T2 (de) 2007-08-23

Family

ID=34463915

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004004236T Active DE602004004236T2 (de) 2003-11-28 2004-11-25 Poliertuch und Herstellungsverfahren eines Halbleiterbauelementes

Country Status (7)

Country Link
US (2) US7291188B2 (de)
EP (1) EP1535978B1 (de)
JP (1) JP4342918B2 (de)
KR (1) KR100615002B1 (de)
CN (1) CN100413033C (de)
DE (1) DE602004004236T2 (de)
TW (1) TWI268198B (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7048610B1 (en) * 2005-01-26 2006-05-23 Intel Corporation Conditioning polishing pad for chemical-mechanical polishing
WO2007043517A1 (ja) * 2005-10-12 2007-04-19 Hitachi Chemical Co., Ltd. Ｃｍｐ用研磨液及び研磨方法
KR100722984B1 (ko) * 2005-12-05 2007-05-30 제일모직주식회사 반도체 미세 갭 필용 중합체 및 이를 이용한 반도체 미세갭 필용 조성물
KR100717511B1 (ko) 2005-11-02 2007-05-11 제일모직주식회사 반도체 미세 갭 필용 중합체 및 이를 이용한 조성물
US20090317974A1 (en) * 2006-03-15 2009-12-24 Dupont Airproducts Nanomaterials Limited Liability Company Polishing composition for silicon wafer, polishing composition kit for silicon wafer and method of polishing silicon wafer
JP4499136B2 (ja) * 2007-06-06 2010-07-07 シャープ株式会社 研磨パッドの製造方法
KR101396055B1 (ko) * 2007-07-05 2014-05-15 히타치가세이가부시끼가이샤 금속막용 연마액 및 연마방법
CN101834130A (zh) * 2010-03-31 2010-09-15 上海集成电路研发中心有限公司 一种硅片的湿法处理方法
JP6325441B2 (ja) * 2012-07-17 2018-05-16 株式会社フジミインコーポレーテッド 合金材料研磨用組成物及びそれを用いた合金材料の製造方法
US8998677B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Bellows driven floatation-type abrading workholder
US9233452B2 (en) 2012-10-29 2016-01-12 Wayne O. Duescher Vacuum-grooved membrane abrasive polishing wafer workholder
US9011207B2 (en) 2012-10-29 2015-04-21 Wayne O. Duescher Flexible diaphragm combination floating and rigid abrading workholder
US9039488B2 (en) 2012-10-29 2015-05-26 Wayne O. Duescher Pin driven flexible chamber abrading workholder
US8998678B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Spider arm driven flexible chamber abrading workholder
US8845394B2 (en) 2012-10-29 2014-09-30 Wayne O. Duescher Bellows driven air floatation abrading workholder
US9199354B2 (en) 2012-10-29 2015-12-01 Wayne O. Duescher Flexible diaphragm post-type floating and rigid abrading workholder
US9604339B2 (en) 2012-10-29 2017-03-28 Wayne O. Duescher Vacuum-grooved membrane wafer polishing workholder
US10144850B2 (en) * 2015-09-25 2018-12-04 Versum Materials Us, Llc Stop-on silicon containing layer additive
WO2018119275A1 (en) 2016-12-23 2018-06-28 Saint-Gobain Abrasives, Inc. Coated abrasives having a performance enhancing composition
US10926378B2 (en) 2017-07-08 2021-02-23 Wayne O. Duescher Abrasive coated disk islands using magnetic font sheet
US11691241B1 (en) * 2019-08-05 2023-07-04 Keltech Engineering, Inc. Abrasive lapping head with floating and rigid workpiece carrier

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4138228A (en) * 1977-02-02 1979-02-06 Ralf Hoehn Abrasive of a microporous polymer matrix with inorganic particles thereon
JP3435469B2 (ja) * 1995-01-20 2003-08-11 日本油脂Ｂａｓｆコーティングス株式会社 水性塗料組成物
JP3693408B2 (ja) * 1996-04-08 2005-09-07 三井化学株式会社 半導体ウエハ裏面研削用粘着フィルム及びそれを用いる半導体ウエハの加工方法
JP2000077366A (ja) * 1998-08-28 2000-03-14 Nitta Ind Corp 研磨布及びその研磨布の研磨機定盤への脱着方法
JP2001179607A (ja) 1999-12-22 2001-07-03 Toray Ind Inc 研磨用パッドおよびそれを用いた研磨装置及び研磨方法
JP2001291685A (ja) 2000-04-07 2001-10-19 Toray Ind Inc 研磨パッドおよびその製造方法
EP1295682B1 (de) 2000-05-31 2007-10-24 JSR Corporation Schleifmaterial
US20020042200A1 (en) * 2000-10-02 2002-04-11 Clyde Fawcett Method for conditioning polishing pads
JP2002190460A (ja) * 2000-10-12 2002-07-05 Toshiba Corp 研磨布、研磨装置および半導体装置の製造方法

Also Published As

Publication number Publication date
KR20050052365A (ko) 2005-06-02
US7291188B2 (en) 2007-11-06
DE602004004236T2 (de) 2007-08-23
JP2005166766A (ja) 2005-06-23
TWI268198B (en) 2006-12-11
US20080032504A1 (en) 2008-02-07
CN100413033C (zh) 2008-08-20
CN1622290A (zh) 2005-06-01
EP1535978A1 (de) 2005-06-01
EP1535978B1 (de) 2007-01-10
KR100615002B1 (ko) 2006-08-25
TW200526354A (en) 2005-08-16
US7884020B2 (en) 2011-02-08
US20050148185A1 (en) 2005-07-07
JP4342918B2 (ja) 2009-10-14

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