DE602005011626D1 - Poliervorrichtung und substratverarbeitungsverfahren - Google Patents

Poliervorrichtung und substratverarbeitungsverfahren

Info

Publication number
DE602005011626D1
DE602005011626D1 DE602005011626T DE602005011626T DE602005011626D1 DE 602005011626 D1 DE602005011626 D1 DE 602005011626D1 DE 602005011626 T DE602005011626 T DE 602005011626T DE 602005011626 T DE602005011626 T DE 602005011626T DE 602005011626 D1 DE602005011626 D1 DE 602005011626D1
Authority
DE
Germany
Prior art keywords
processing method
substrate processing
polishing device
polishing
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005011626T
Other languages
English (en)
Inventor
Kenichiro Saito
Akihiro Yazawa
Masanori Sasaki
Takashi Mitsuya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of DE602005011626D1 publication Critical patent/DE602005011626D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/0053—Control means for lapping machines or devices detecting loss or breakage of a workpiece during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
DE602005011626T 2004-07-22 2005-07-21 Poliervorrichtung und substratverarbeitungsverfahren Active DE602005011626D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004214598A JP4703141B2 (ja) 2004-07-22 2004-07-22 研磨装置、基板処理装置、基板飛び出し検知方法
PCT/JP2005/013784 WO2006009304A1 (en) 2004-07-22 2005-07-21 Polishing apparatus and substrate processing method

Publications (1)

Publication Number Publication Date
DE602005011626D1 true DE602005011626D1 (de) 2009-01-22

Family

ID=35044527

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005011626T Active DE602005011626D1 (de) 2004-07-22 2005-07-21 Poliervorrichtung und substratverarbeitungsverfahren

Country Status (6)

Country Link
US (1) US8128458B2 (de)
EP (1) EP1771279B1 (de)
JP (1) JP4703141B2 (de)
KR (1) KR101236320B1 (de)
DE (1) DE602005011626D1 (de)
WO (1) WO2006009304A1 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5080930B2 (ja) * 2007-10-11 2012-11-21 株式会社東京精密 ウェーハ研磨装置
JP5511190B2 (ja) 2008-01-23 2014-06-04 株式会社荏原製作所 基板処理装置の運転方法
JP5248127B2 (ja) * 2008-01-30 2013-07-31 株式会社荏原製作所 研磨方法及び研磨装置
KR101098980B1 (ko) * 2009-08-14 2011-12-28 세메스 주식회사 기판 연마 장치 및 그의 기판 슬립 감지 방법
US9530676B2 (en) 2011-06-01 2016-12-27 Ebara Corporation Substrate processing apparatus, substrate transfer method and substrate transfer device
JP6128941B2 (ja) * 2013-05-10 2017-05-17 ルネサスエレクトロニクス株式会社 半導体装置の製造方法及び半導体製造装置
KR101448442B1 (ko) * 2013-06-13 2014-10-13 주식회사 케이씨텍 화학 기계적 연마 시스템의 웨이퍼 이탈 감지 장치
US9240042B2 (en) * 2013-10-24 2016-01-19 Globalfoundries Inc. Wafer slip detection during CMP processing
US9768080B2 (en) * 2013-12-18 2017-09-19 Taiwan Semiconductor Manufacturing Company Ltd Semiconductor manufacturing apparatus and method thereof
JP6486757B2 (ja) * 2015-04-23 2019-03-20 株式会社荏原製作所 基板処理装置
JP2018029142A (ja) * 2016-08-18 2018-02-22 株式会社クラレ 研磨パッド及びそれを用いた研磨方法
JP6791551B2 (ja) * 2016-11-01 2020-11-25 株式会社ディスコ 研削装置
JP6910723B2 (ja) * 2017-08-22 2021-07-28 株式会社ディスコ 研削方法
JP2020077670A (ja) * 2018-11-05 2020-05-21 株式会社ディスコ 配線基板の製造方法
CN109454547A (zh) * 2018-12-27 2019-03-12 杭州众硅电子科技有限公司 一种用于cmp抛光垫寿命在线检测的系统和方法
JP7286240B2 (ja) * 2019-03-01 2023-06-05 株式会社ディスコ 加工装置、及び加工方法
CN112276798A (zh) * 2019-07-24 2021-01-29 陕西坤同半导体科技有限公司 打磨装置及打磨系统
JP2022542219A (ja) 2019-08-02 2022-09-30 アクス テクノロジー エルエルシー ワークピースの研磨中のウェーハスリップ検出の現場調整方法及び装置
JP7393926B2 (ja) * 2019-11-27 2023-12-07 株式会社ディスコ 加工装置
CN110948303A (zh) * 2019-12-19 2020-04-03 芜湖哈特机器人产业技术研究院有限公司 汽车车轮轮毂打磨系统
JP7406980B2 (ja) * 2019-12-24 2023-12-28 株式会社荏原製作所 研磨ユニット、基板処理装置、および研磨方法
CN115157108A (zh) * 2022-06-22 2022-10-11 北京烁科精微电子装备有限公司 一种滑片监测系统及监测方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5823853A (en) 1996-07-18 1998-10-20 Speedfam Corporation Apparatus for the in-process detection of workpieces with a monochromatic light source
US5733171A (en) * 1996-07-18 1998-03-31 Speedfam Corporation Apparatus for the in-process detection of workpieces in a CMP environment
JPH08181806A (ja) * 1994-12-26 1996-07-12 Casio Comput Co Ltd 画像読み取り装置
JP3761673B2 (ja) 1997-06-17 2006-03-29 株式会社荏原製作所 ポリッシング装置
JP4624546B2 (ja) * 2000-12-25 2011-02-02 ホーチキ株式会社 防災監視設備
JP4060133B2 (ja) * 2002-06-27 2008-03-12 株式会社ハイレックスコ−ポレ−ション パルスエンコーダ
JP2004063589A (ja) * 2002-07-25 2004-02-26 Ebara Corp ポリッシング装置
JP3773245B2 (ja) * 2002-09-17 2006-05-10 ケル株式会社 ファン駆動制御回路
JP2004166330A (ja) * 2002-11-11 2004-06-10 Fukushin Denki Kk 電動車
JP4549636B2 (ja) * 2003-04-22 2010-09-22 株式会社荏原製作所 基板処理装置

Also Published As

Publication number Publication date
JP4703141B2 (ja) 2011-06-15
US20090209175A1 (en) 2009-08-20
WO2006009304A1 (en) 2006-01-26
US8128458B2 (en) 2012-03-06
JP2006035328A (ja) 2006-02-09
EP1771279B1 (de) 2008-12-10
KR101236320B1 (ko) 2013-02-22
EP1771279A1 (de) 2007-04-11
KR20070048732A (ko) 2007-05-09

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