TWI268198B - Polishing cloth and method of manufacturing semiconductor device comprises a molded body of (meth)acrylic copolymer having an acid value of 10 to 100 mg KOH/g and a hydroxyl group value of 50 to 150 mg KOH/g - Google Patents

Polishing cloth and method of manufacturing semiconductor device comprises a molded body of (meth)acrylic copolymer having an acid value of 10 to 100 mg KOH/g and a hydroxyl group value of 50 to 150 mg KOH/g

Info

Publication number
TWI268198B
TWI268198B TW093136576A TW93136576A TWI268198B TW I268198 B TWI268198 B TW I268198B TW 093136576 A TW093136576 A TW 093136576A TW 93136576 A TW93136576 A TW 93136576A TW I268198 B TWI268198 B TW I268198B
Authority
TW
Taiwan
Prior art keywords
koh
meth
hydroxyl group
molded body
acrylic copolymer
Prior art date
Application number
TW093136576A
Other languages
English (en)
Other versions
TW200526354A (en
Inventor
Hideaki Hirabayashi
Naoaki Sakurai
Akiko Saito
Koji Sato
Tomiho Yamada
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of TW200526354A publication Critical patent/TW200526354A/zh
Application granted granted Critical
Publication of TWI268198B publication Critical patent/TWI268198B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
TW093136576A 2003-11-28 2004-11-26 Polishing cloth and method of manufacturing semiconductor device comprises a molded body of (meth)acrylic copolymer having an acid value of 10 to 100 mg KOH/g and a hydroxyl group value of 50 to 150 mg KOH/g TWI268198B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003400915A JP4342918B2 (ja) 2003-11-28 2003-11-28 研磨布および半導体装置の製造方法

Publications (2)

Publication Number Publication Date
TW200526354A TW200526354A (en) 2005-08-16
TWI268198B true TWI268198B (en) 2006-12-11

Family

ID=34463915

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093136576A TWI268198B (en) 2003-11-28 2004-11-26 Polishing cloth and method of manufacturing semiconductor device comprises a molded body of (meth)acrylic copolymer having an acid value of 10 to 100 mg KOH/g and a hydroxyl group value of 50 to 150 mg KOH/g

Country Status (7)

Country Link
US (2) US7291188B2 (zh)
EP (1) EP1535978B1 (zh)
JP (1) JP4342918B2 (zh)
KR (1) KR100615002B1 (zh)
CN (1) CN100413033C (zh)
DE (1) DE602004004236T2 (zh)
TW (1) TWI268198B (zh)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7048610B1 (en) * 2005-01-26 2006-05-23 Intel Corporation Conditioning polishing pad for chemical-mechanical polishing
EP1936673A4 (en) * 2005-10-12 2011-01-05 Hitachi Chemical Co Ltd POLISHING SOLUTION FOR PMC AND METHOD OF POLISHING
KR100717511B1 (ko) 2005-11-02 2007-05-11 제일모직주식회사 반도체 미세 갭 필용 중합체 및 이를 이용한 조성물
KR100722984B1 (ko) * 2005-12-05 2007-05-30 제일모직주식회사 반도체 미세 갭 필용 중합체 및 이를 이용한 반도체 미세갭 필용 조성물
US20090317974A1 (en) * 2006-03-15 2009-12-24 Dupont Airproducts Nanomaterials Limited Liability Company Polishing composition for silicon wafer, polishing composition kit for silicon wafer and method of polishing silicon wafer
JP4499136B2 (ja) * 2007-06-06 2010-07-07 シャープ株式会社 研磨パッドの製造方法
CN101689494B (zh) * 2007-07-05 2013-09-25 日立化成株式会社 金属膜用研磨液及研磨方法
CN101834130A (zh) * 2010-03-31 2010-09-15 上海集成电路研发中心有限公司 一种硅片的湿法处理方法
TWI629347B (zh) * 2012-07-17 2018-07-11 福吉米股份有限公司 使用合金材料硏磨用組成物來研磨合金材料的方法
US8845394B2 (en) 2012-10-29 2014-09-30 Wayne O. Duescher Bellows driven air floatation abrading workholder
US8998678B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Spider arm driven flexible chamber abrading workholder
US9604339B2 (en) 2012-10-29 2017-03-28 Wayne O. Duescher Vacuum-grooved membrane wafer polishing workholder
US9233452B2 (en) 2012-10-29 2016-01-12 Wayne O. Duescher Vacuum-grooved membrane abrasive polishing wafer workholder
US9039488B2 (en) 2012-10-29 2015-05-26 Wayne O. Duescher Pin driven flexible chamber abrading workholder
US9199354B2 (en) 2012-10-29 2015-12-01 Wayne O. Duescher Flexible diaphragm post-type floating and rigid abrading workholder
US9011207B2 (en) 2012-10-29 2015-04-21 Wayne O. Duescher Flexible diaphragm combination floating and rigid abrading workholder
US8998677B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Bellows driven floatation-type abrading workholder
US10144850B2 (en) * 2015-09-25 2018-12-04 Versum Materials Us, Llc Stop-on silicon containing layer additive
BR112019013057B1 (pt) 2016-12-23 2023-10-17 Saint-Gobain Abrasives, Inc. Abrasivos revestidos apresentando uma composição de melhoria de desempenho
US10926378B2 (en) 2017-07-08 2021-02-23 Wayne O. Duescher Abrasive coated disk islands using magnetic font sheet
US11691241B1 (en) * 2019-08-05 2023-07-04 Keltech Engineering, Inc. Abrasive lapping head with floating and rigid workpiece carrier

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4138228A (en) * 1977-02-02 1979-02-06 Ralf Hoehn Abrasive of a microporous polymer matrix with inorganic particles thereon
JP3435469B2 (ja) 1995-01-20 2003-08-11 日本油脂Ｂａｓｆコーティングス株式会社 水性塗料組成物
JP3693408B2 (ja) * 1996-04-08 2005-09-07 三井化学株式会社 半導体ウエハ裏面研削用粘着フィルム及びそれを用いる半導体ウエハの加工方法
JP2000077366A (ja) * 1998-08-28 2000-03-14 Nitta Ind Corp 研磨布及びその研磨布の研磨機定盤への脱着方法
JP2001179607A (ja) 1999-12-22 2001-07-03 Toray Ind Inc 研磨用パッドおよびそれを用いた研磨装置及び研磨方法
JP2001291685A (ja) 2000-04-07 2001-10-19 Toray Ind Inc 研磨パッドおよびその製造方法
US7001252B2 (en) * 2000-05-31 2006-02-21 Jsr Corporation Abrasive material
WO2002028598A1 (en) 2000-10-02 2002-04-11 Rodel Holdings, Inc. Method for conditioning polishing pads
JP2002190460A (ja) 2000-10-12 2002-07-05 Toshiba Corp 研磨布、研磨装置および半導体装置の製造方法

Also Published As

Publication number Publication date
KR100615002B1 (ko) 2006-08-25
DE602004004236D1 (de) 2007-02-22
JP4342918B2 (ja) 2009-10-14
US20050148185A1 (en) 2005-07-07
US20080032504A1 (en) 2008-02-07
CN1622290A (zh) 2005-06-01
JP2005166766A (ja) 2005-06-23
DE602004004236T2 (de) 2007-08-23
EP1535978B1 (en) 2007-01-10
EP1535978A1 (en) 2005-06-01
TW200526354A (en) 2005-08-16
KR20050052365A (ko) 2005-06-02
US7291188B2 (en) 2007-11-06
US7884020B2 (en) 2011-02-08
CN100413033C (zh) 2008-08-20

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees