DE602004003459D1 - Optischer Halbleiter und Verfahren zu seiner Herstellung - Google Patents

Optischer Halbleiter und Verfahren zu seiner Herstellung

Info

Publication number
DE602004003459D1
DE602004003459D1 DE602004003459T DE602004003459T DE602004003459D1 DE 602004003459 D1 DE602004003459 D1 DE 602004003459D1 DE 602004003459 T DE602004003459 T DE 602004003459T DE 602004003459 T DE602004003459 T DE 602004003459T DE 602004003459 D1 DE602004003459 D1 DE 602004003459D1
Authority
DE
Germany
Prior art keywords
production
optical semiconductor
semiconductor
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004003459T
Other languages
English (en)
Other versions
DE602004003459T2 (de
Inventor
Takaki Iwai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE602004003459D1 publication Critical patent/DE602004003459D1/de
Application granted granted Critical
Publication of DE602004003459T2 publication Critical patent/DE602004003459T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
    • H01L31/14—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the light source or sources being controlled by the semiconductor device sensitive to radiation, e.g. image converters, image amplifiers or image storage devices
    • H01L31/147—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the light source or sources being controlled by the semiconductor device sensitive to radiation, e.g. image converters, image amplifiers or image storage devices the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers
    • H01L31/153—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the light source or sources being controlled by the semiconductor device sensitive to radiation, e.g. image converters, image amplifiers or image storage devices the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers formed in, or on, a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10157—Shape being other than a cuboid at the active surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02255—Out-coupling of light using beam deflecting elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Light Receiving Elements (AREA)
  • Semiconductor Lasers (AREA)
DE602004003459T 2003-12-16 2004-12-10 Optischer Halbleiter und Verfahren zu seiner Herstellung Active DE602004003459T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003417792 2003-12-16
JP2003417792 2003-12-16

Publications (2)

Publication Number Publication Date
DE602004003459D1 true DE602004003459D1 (de) 2007-01-11
DE602004003459T2 DE602004003459T2 (de) 2007-03-15

Family

ID=34510614

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004003459T Active DE602004003459T2 (de) 2003-12-16 2004-12-10 Optischer Halbleiter und Verfahren zu seiner Herstellung

Country Status (4)

Country Link
US (2) US20050129079A1 (de)
EP (1) EP1544966B1 (de)
CN (1) CN1630150A (de)
DE (1) DE602004003459T2 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005025937B4 (de) * 2005-02-18 2009-11-26 Austriamicrosystems Ag Lichtempfindliches Bauelement mit erhöhter Blauempfindlichkeit, Verfahren zur Herstellung und Betriebsverfahren
JP2007317767A (ja) * 2006-05-24 2007-12-06 Matsushita Electric Ind Co Ltd 光半導体装置およびその製造方法
JP2009021426A (ja) * 2007-07-12 2009-01-29 Sharp Corp チップ部品型ｌｅｄ及びその製造方法
EP2238621B1 (de) * 2008-01-29 2015-10-21 Nxp B.V. Beleuchtungseinheit mit temperaturausgleich
JP2010103221A (ja) * 2008-10-22 2010-05-06 Panasonic Corp 光半導体装置
JP2011176552A (ja) * 2010-02-24 2011-09-08 Renesas Electronics Corp 光増幅回路及びフォトカプラ
IT1399690B1 (it) * 2010-03-30 2013-04-26 St Microelectronics Srl Fotodiodo a valanga operante in modalita' geiger ad elevato rapporto segnale rumore e relativo procedimento di fabbricazione
DE102014114618A1 (de) 2014-10-08 2016-04-14 Osram Opto Semiconductors Gmbh Laserbauelement und Verfahren zu seiner Herstellung
JP2018156984A (ja) * 2017-03-15 2018-10-04 株式会社東芝 光検出素子
JP7206489B2 (ja) * 2019-03-07 2023-01-18 ミツミ電機株式会社 光学モジュール及び光学式エンコーダ

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51139789A (en) * 1975-05-29 1976-12-02 Fujitsu Ltd Photo-electric conversion semiconductor device
US5404373A (en) * 1991-11-08 1995-04-04 University Of New Mexico Electro-optical device
US5479426A (en) 1994-03-04 1995-12-26 Matsushita Electronics Corporation Semiconductor laser device with integrated reflector on a (511) tilted lattice plane silicon substrate
JPH09219534A (ja) 1995-12-06 1997-08-19 Sony Corp 受光素子、光ピツクアツプ及び半導体装置製造方法
JPH1051065A (ja) 1996-08-02 1998-02-20 Matsushita Electron Corp 半導体レーザ装置
US6458711B1 (en) * 1997-03-20 2002-10-01 Texas Instruments Incorporated Self-aligned silicide process
JP2001144317A (ja) 1999-11-15 2001-05-25 Sharp Corp 回路内蔵型受光素子
JP3091448B2 (ja) * 1999-01-13 2000-09-25 松下電子工業株式会社 光半導体装置
JP3934828B2 (ja) * 1999-06-30 2007-06-20 株式会社東芝 半導体レーザ装置
US6534794B1 (en) * 1999-08-05 2003-03-18 Matsushita Electric Industrial Co., Ltd. Semiconductor light-emitting unit, optical apparatus and optical disk system having heat sinking means and a heating element incorporated with the mounting system
JP2001111165A (ja) 1999-08-05 2001-04-20 Matsushita Electronics Industry Corp 半導体発光装置，光ヘッド装置及び光ディスク装置
JP4131059B2 (ja) * 1999-08-23 2008-08-13 ソニー株式会社 受光素子を有する半導体装置、光学ピックアップ装置、および受光素子を有する半導体装置の製造方法
JP2001102676A (ja) 1999-09-27 2001-04-13 Toshiba Electronic Engineering Corp 光集積ユニット、光ピックアップ及び光記録媒体駆動装置
JP3317942B2 (ja) * 1999-11-08 2002-08-26 シャープ株式会社 半導体装置およびその製造方法
JP3596428B2 (ja) * 2000-05-31 2004-12-02 松下電器産業株式会社 半導体発光装置および半導体基板
US6559488B1 (en) * 2000-10-02 2003-05-06 Stmicroelectronics, Inc. Integrated photodetector
JP2003158291A (ja) * 2001-11-20 2003-05-30 Matsushita Electric Ind Co Ltd 受光素子を内蔵する半導体装置及びその製造方法
US6743652B2 (en) 2002-02-01 2004-06-01 Stmicroelectronics, Inc. Method for making an integrated circuit device including photodiodes
JP3803339B2 (ja) 2003-01-10 2006-08-02 松下電器産業株式会社 半導体レーザ装置
JP2004349432A (ja) * 2003-05-22 2004-12-09 Matsushita Electric Ind Co Ltd 光電子集積回路

Also Published As

Publication number Publication date
EP1544966A2 (de) 2005-06-22
EP1544966A3 (de) 2005-07-27
US20050129079A1 (en) 2005-06-16
US20080194052A1 (en) 2008-08-14
DE602004003459T2 (de) 2007-03-15
CN1630150A (zh) 2005-06-22
EP1544966B1 (de) 2006-11-29
US7736923B2 (en) 2010-06-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP