DE60140722D1 - Integrierte elektromagnetische Abschirmvorrichtung - Google Patents
Integrierte elektromagnetische AbschirmvorrichtungInfo
- Publication number
- DE60140722D1 DE60140722D1 DE60140722T DE60140722T DE60140722D1 DE 60140722 D1 DE60140722 D1 DE 60140722D1 DE 60140722 T DE60140722 T DE 60140722T DE 60140722 T DE60140722 T DE 60140722T DE 60140722 D1 DE60140722 D1 DE 60140722D1
- Authority
- DE
- Germany
- Prior art keywords
- electromagnetic shielding
- shielding device
- integrated electromagnetic
- integrated
- shielding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
- H01L23/5225—Shielding layers formed together with wiring layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6605—High-frequency electrical connections
- H01L2223/6616—Vertical connections, e.g. vias
- H01L2223/6622—Coaxial feed-throughs in active or passive substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Integrated Circuits (AREA)
- Element Separation (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0011307 | 2000-09-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60140722D1 true DE60140722D1 (de) | 2010-01-21 |
Family
ID=8853987
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60140722T Expired - Lifetime DE60140722D1 (de) | 2000-09-05 | 2001-08-28 | Integrierte elektromagnetische Abschirmvorrichtung |
Country Status (6)
Country | Link |
---|---|
US (1) | US7030455B2 (de) |
EP (1) | EP1187206B1 (de) |
JP (1) | JP2002093810A (de) |
KR (1) | KR100867457B1 (de) |
CN (1) | CN100565869C (de) |
DE (1) | DE60140722D1 (de) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE0200715D0 (sv) * | 2001-12-14 | 2002-03-11 | Optillion Ab | Feedthrough Interconnection Assembly |
DE10309614A1 (de) * | 2003-03-05 | 2004-09-23 | Infineon Technologies Ag | Halbleiterstruktur und Verfahren zur Herstellung derselben |
US7186924B2 (en) * | 2003-10-21 | 2007-03-06 | International Business Machines Corporation | Dielectric structure for printed circuit board traces |
CN100533967C (zh) * | 2004-05-06 | 2009-08-26 | Nxp股份有限公司 | 电子装置 |
US7566971B2 (en) | 2005-05-27 | 2009-07-28 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
TWI294681B (en) * | 2006-01-25 | 2008-03-11 | Ind Tech Res Inst | Image ground shielding structure |
DE102006022360B4 (de) * | 2006-05-12 | 2009-07-09 | Infineon Technologies Ag | Abschirmvorrichtung |
DE102006062844B4 (de) * | 2006-05-12 | 2016-11-17 | Infineon Technologies Ag | Abschirmvorrichtung zum Abschirmen von elektromagnetischer Strahlung |
US7609125B2 (en) * | 2006-10-13 | 2009-10-27 | Avago Technologies Enterprise IP (Singapore) Pte. Ltd. | System, device and method for reducing cross-talk in differential signal conductor pairs |
KR100898247B1 (ko) | 2007-10-24 | 2009-05-18 | 주식회사 동부하이텍 | 반도체형 rf소자 |
US8106474B2 (en) * | 2008-04-18 | 2012-01-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
CN102356703B (zh) * | 2009-03-19 | 2015-05-13 | 株式会社村田制作所 | 电路基板以及母层叠体 |
KR101361058B1 (ko) * | 2009-12-09 | 2014-02-12 | 한국전자통신연구원 | 광 소자를 포함하는 반도체 장치의 형성 방법 |
US8508029B2 (en) * | 2011-09-29 | 2013-08-13 | Broadcom Corporation | Semiconductor package including an integrated waveguide |
US8670638B2 (en) | 2011-09-29 | 2014-03-11 | Broadcom Corporation | Signal distribution and radiation in a wireless enabled integrated circuit (IC) using a leaky waveguide |
US9318785B2 (en) | 2011-09-29 | 2016-04-19 | Broadcom Corporation | Apparatus for reconfiguring an integrated waveguide |
US9075105B2 (en) | 2011-09-29 | 2015-07-07 | Broadcom Corporation | Passive probing of various locations in a wireless enabled integrated circuit (IC) |
US9570420B2 (en) | 2011-09-29 | 2017-02-14 | Broadcom Corporation | Wireless communicating among vertically arranged integrated circuits (ICs) in a semiconductor package |
TWI528525B (zh) * | 2013-09-03 | 2016-04-01 | 瑞昱半導體股份有限公司 | 金屬溝渠減噪結構及其製造方法 |
US10939541B2 (en) | 2017-03-31 | 2021-03-02 | Huawei Technologies Co., Ltd. | Shield structure for a low crosstalk single ended clock distribution circuit |
KR102672313B1 (ko) * | 2022-07-08 | 2024-06-05 | 한국전자통신연구원 | 전자파 간섭 제거 기능을 갖는 수광 소자 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4608590A (en) * | 1978-12-20 | 1986-08-26 | At&T Bell Laboratories | High voltage dielectrically isolated solid-state switch |
US4956688A (en) * | 1984-10-29 | 1990-09-11 | Hitachi, Ltd. | Radiation resistant bipolar memory |
US4954929A (en) * | 1989-08-22 | 1990-09-04 | Ast Research, Inc. | Multi-layer circuit board that suppresses radio frequency interference from high frequency signals |
JPH03165058A (ja) | 1989-11-24 | 1991-07-17 | Mitsubishi Electric Corp | 半導体装置 |
DE9214898U1 (de) * | 1991-11-07 | 1992-12-17 | Siemens AG, 8000 München | Steuergerät |
US5262353A (en) * | 1992-02-03 | 1993-11-16 | Motorola, Inc. | Process for forming a structure which electrically shields conductors |
US5196920A (en) * | 1992-04-21 | 1993-03-23 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor integrated circuit device for limiting capacitive coupling between adjacent circuit blocks |
JP3283984B2 (ja) * | 1993-12-28 | 2002-05-20 | 株式会社東芝 | 半導体集積回路装置 |
US5631491A (en) * | 1994-09-27 | 1997-05-20 | Fuji Electric Co., Ltd. | Lateral semiconductor device and method of fixing potential of the same |
KR0175000B1 (ko) | 1994-12-14 | 1999-02-01 | 윤종용 | 전자파 억제구조를 갖는 반도체 소자 |
US5859466A (en) * | 1995-06-07 | 1999-01-12 | Nippon Steel Semiconductor Corporation | Semiconductor device having a field-shield device isolation structure and method for making thereof |
US6472723B1 (en) * | 1996-03-22 | 2002-10-29 | Telefonaktiebolaget Lm Ericsson (Publ) | Substrate contacts and shielding devices in a semiconductor component |
US5994765A (en) * | 1996-07-01 | 1999-11-30 | Sun Microsystems, Inc. | Clock distribution network with efficient shielding |
US5780340A (en) * | 1996-10-30 | 1998-07-14 | Advanced Micro Devices, Inc. | Method of forming trench transistor and isolation trench |
US6157065A (en) * | 1999-01-14 | 2000-12-05 | United Microelectronics Corp. | Electrostatic discharge protective circuit under conductive pad |
US6075700A (en) * | 1999-02-02 | 2000-06-13 | Compaq Computer Corporation | Method and system for controlling radio frequency radiation in microelectronic packages using heat dissipation structures |
-
2001
- 2001-08-28 DE DE60140722T patent/DE60140722D1/de not_active Expired - Lifetime
- 2001-08-28 EP EP01203251A patent/EP1187206B1/de not_active Expired - Lifetime
- 2001-09-01 CN CNB011357592A patent/CN100565869C/zh not_active Expired - Lifetime
- 2001-09-04 KR KR1020010054182A patent/KR100867457B1/ko not_active IP Right Cessation
- 2001-09-05 JP JP2001268493A patent/JP2002093810A/ja not_active Withdrawn
- 2001-09-05 US US09/946,715 patent/US7030455B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2002093810A (ja) | 2002-03-29 |
EP1187206A1 (de) | 2002-03-13 |
US20020074605A1 (en) | 2002-06-20 |
US7030455B2 (en) | 2006-04-18 |
EP1187206B1 (de) | 2009-12-09 |
KR100867457B1 (ko) | 2008-11-06 |
CN100565869C (zh) | 2009-12-02 |
KR20020019413A (ko) | 2002-03-12 |
CN1341964A (zh) | 2002-03-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE60140722D1 (de) | Integrierte elektromagnetische Abschirmvorrichtung | |
DE60214666D1 (de) | Elektromagnetische schaltvorrichtung | |
DE60128170D1 (de) | Abschirmgehäuse | |
DE60135949D1 (de) | Elektromagnetische Induktionsvorrichtung | |
DE60135078D1 (de) | Hochfrequenzvorrichtung | |
DE60027515D1 (de) | Elektronisches Gerät | |
DE69900343D1 (de) | Abschirmeinrichtung | |
DE50103923D1 (de) | Elektronik-anordnung | |
DE50100526D1 (de) | Elektromagnetische schalteinrichtung | |
DE10084599T1 (de) | Elektromagnetische Schaltvorrichtung | |
DE60131793D1 (de) | Antennenvorrichtung | |
EP1343180A4 (de) | Elektromagnetische betriebseinrichtung | |
DE60127017D1 (de) | Aufschlämmungsrückfluss-Vorrichtung | |
FR2816101B1 (fr) | Dispositif electromagnetique | |
NO20005524L (no) | Ror-i-roranordning | |
DE60127739D1 (de) | Führungsvorrichtung | |
DE60228243D1 (de) | Veränderliche elektromagnetische dämpfungseinrichtung | |
DK1259784T3 (da) | Elektromagnetisk detekteringsapparat | |
FR2816124B1 (fr) | Dispositif electromagnetique | |
DE60227161D1 (de) | Abschirmhülle | |
DE60133469D1 (de) | Elektromagnetische signalhorneinrichtung | |
DE60137072D1 (de) | Abgeschirmtes gehäuse | |
DE50110826D1 (de) | Elektronisches gerät | |
FR2816100B1 (fr) | Dispositif electromagnetique | |
DE60144512D1 (de) | Elektronisches uhrwerk |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |