SE0200715D0 - Feedthrough Interconnection Assembly - Google Patents
Feedthrough Interconnection AssemblyInfo
- Publication number
- SE0200715D0 SE0200715D0 SE0200715A SE0200715A SE0200715D0 SE 0200715 D0 SE0200715 D0 SE 0200715D0 SE 0200715 A SE0200715 A SE 0200715A SE 0200715 A SE0200715 A SE 0200715A SE 0200715 D0 SE0200715 D0 SE 0200715D0
- Authority
- SE
- Sweden
- Prior art keywords
- sub
- lead
- signal
- assembly
- electrical information
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0058—Casings specially adapted for optoelectronic applications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0200715A SE0200715D0 (sv) | 2001-12-14 | 2002-03-11 | Feedthrough Interconnection Assembly |
JP2003553883A JP2005513792A (ja) | 2001-12-14 | 2002-12-05 | フィードスルーインターコネクションアセンブリー |
EP02793605A EP1454514A1 (en) | 2001-12-14 | 2002-12-05 | Feedthrough interconnection assembly |
AU2002359101A AU2002359101A1 (en) | 2001-12-14 | 2002-12-05 | Feedthrough interconnection assembly |
PCT/SE2002/002248 WO2003053113A1 (en) | 2001-12-14 | 2002-12-05 | Feedthrough interconnection assembly |
US10/317,868 US6888061B2 (en) | 2001-12-14 | 2002-12-12 | Feedthrough interconnection assembly |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0104232A SE0104232D0 (sv) | 2001-12-14 | 2001-12-14 | Feedtheought Interconnection Assembly |
SE0200715A SE0200715D0 (sv) | 2001-12-14 | 2002-03-11 | Feedthrough Interconnection Assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
SE0200715D0 true SE0200715D0 (sv) | 2002-03-11 |
Family
ID=26655626
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE0200715A SE0200715D0 (sv) | 2001-12-14 | 2002-03-11 | Feedthrough Interconnection Assembly |
Country Status (6)
Country | Link |
---|---|
US (1) | US6888061B2 (sv) |
EP (1) | EP1454514A1 (sv) |
JP (1) | JP2005513792A (sv) |
AU (1) | AU2002359101A1 (sv) |
SE (1) | SE0200715D0 (sv) |
WO (1) | WO2003053113A1 (sv) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060194015A1 (en) * | 2004-11-05 | 2006-08-31 | Vincente Sabater | Flooring system with slant pattern |
US7994434B2 (en) * | 2009-02-19 | 2011-08-09 | International Business Machines Corporation | Electromagnetic interference shielding apparatus and method |
US8294043B2 (en) * | 2010-12-07 | 2012-10-23 | Honeywell International Inc. | Integrated connector shield ring for shielded enclosures |
US20120145450A1 (en) * | 2010-12-08 | 2012-06-14 | Ezconn Corporation | Shielding device |
CN113640927B (zh) * | 2021-07-26 | 2022-10-21 | 嘉兴佳利电子有限公司 | 一种5g光通信模块用多层结构封装陶瓷及其制备方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4873566A (en) * | 1985-10-28 | 1989-10-10 | American Telephone And Telegraph Company | Multilayer ceramic laser package |
US4922325A (en) * | 1987-10-02 | 1990-05-01 | American Telephone And Telegraph Company | Multilayer ceramic package with high frequency connections |
DE69122748T2 (de) * | 1990-12-26 | 1997-05-07 | Tdk Corp | Hochfrequenzvorrichtung |
US5428327A (en) * | 1993-08-23 | 1995-06-27 | Itt Corporation | Microwave feedthrough apparatus |
WO1998006243A1 (de) * | 1996-07-31 | 1998-02-12 | Dyconex Patente | Verfahren zur herstellung von verbindungsleitern |
JP3667948B2 (ja) * | 1997-08-29 | 2005-07-06 | 京セラ株式会社 | 高周波複合回路ブロック |
US5923234A (en) * | 1997-10-27 | 1999-07-13 | Lockheed Martin Corp. | Hermetic feedthrough using three-via transmission lines |
JP3438132B2 (ja) * | 1999-04-23 | 2003-08-18 | 富士通カンタムデバイス株式会社 | 高周波デバイス用パッケージ |
KR100308872B1 (ko) * | 2000-02-23 | 2001-11-03 | 이상헌 | 다층 멀티칩 모듈 |
JP3708789B2 (ja) * | 2000-05-01 | 2005-10-19 | 三菱電機株式会社 | 高周波接続構造体 |
EP1187206B1 (fr) * | 2000-09-05 | 2009-12-09 | Nxp B.V. | Dispositif intégré de protection électromagnétique |
-
2002
- 2002-03-11 SE SE0200715A patent/SE0200715D0/sv unknown
- 2002-12-05 WO PCT/SE2002/002248 patent/WO2003053113A1/en not_active Application Discontinuation
- 2002-12-05 JP JP2003553883A patent/JP2005513792A/ja active Pending
- 2002-12-05 EP EP02793605A patent/EP1454514A1/en not_active Withdrawn
- 2002-12-05 AU AU2002359101A patent/AU2002359101A1/en not_active Abandoned
- 2002-12-12 US US10/317,868 patent/US6888061B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2005513792A (ja) | 2005-05-12 |
US6888061B2 (en) | 2005-05-03 |
AU2002359101A1 (en) | 2003-06-30 |
US20030111243A1 (en) | 2003-06-19 |
WO2003053113A1 (en) | 2003-06-26 |
EP1454514A1 (en) | 2004-09-08 |
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