DE60122379T2 - Ladungskontroll- und dosimetriesystem sowie verfahren für einen gas-cluster-ionenstrahl - Google Patents

Ladungskontroll- und dosimetriesystem sowie verfahren für einen gas-cluster-ionenstrahl Download PDF

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Publication number
DE60122379T2
DE60122379T2 DE60122379T DE60122379T DE60122379T2 DE 60122379 T2 DE60122379 T2 DE 60122379T2 DE 60122379 T DE60122379 T DE 60122379T DE 60122379 T DE60122379 T DE 60122379T DE 60122379 T2 DE60122379 T2 DE 60122379T2
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DE
Germany
Prior art keywords
workpiece
ion beam
cluster ion
current
gas cluster
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60122379T
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German (de)
English (en)
Other versions
DE60122379D1 (de
Inventor
c/o Epion Corporation Michael E. Billerica MACK
c/o Epion Corporation Bruce K. Billerica LIBBY
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TEL Epion Inc
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TEL Epion Inc
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Publication of DE60122379D1 publication Critical patent/DE60122379D1/de
Publication of DE60122379T2 publication Critical patent/DE60122379T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/304Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/026Means for avoiding or neutralising unwanted electrical charges on tube components
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/004Charge control of objects or beams
    • H01J2237/0041Neutralising arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/06Sources
    • H01J2237/08Ion sources
    • H01J2237/0812Ionized cluster beam [ICB] sources
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30Electron or ion beam tubes for processing objects
    • H01J2237/304Controlling tubes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Electron Sources, Ion Sources (AREA)
DE60122379T 2000-12-26 2001-12-26 Ladungskontroll- und dosimetriesystem sowie verfahren für einen gas-cluster-ionenstrahl Expired - Lifetime DE60122379T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US25828000P 2000-12-26 2000-12-26
US258280P 2000-12-26
PCT/US2001/050343 WO2002052608A2 (en) 2000-12-26 2001-12-26 Charging control and dosimetry system for gas cluster ion beam

Publications (2)

Publication Number Publication Date
DE60122379D1 DE60122379D1 (de) 2006-09-28
DE60122379T2 true DE60122379T2 (de) 2007-08-09

Family

ID=22979888

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60122379T Expired - Lifetime DE60122379T2 (de) 2000-12-26 2001-12-26 Ladungskontroll- und dosimetriesystem sowie verfahren für einen gas-cluster-ionenstrahl

Country Status (5)

Country Link
US (1) US6646277B2 (enExample)
EP (1) EP1348227B1 (enExample)
JP (1) JP4168381B2 (enExample)
DE (1) DE60122379T2 (enExample)
WO (1) WO2002052608A2 (enExample)

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US7883999B2 (en) * 2008-01-25 2011-02-08 Tel Epion Inc. Method for increasing the penetration depth of material infusion in a substrate using a gas cluster ion beam
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US9103031B2 (en) * 2008-06-24 2015-08-11 Tel Epion Inc. Method and system for growing a thin film using a gas cluster ion beam
US7905199B2 (en) * 2008-06-24 2011-03-15 Tel Epion Inc. Method and system for directional growth using a gas cluster ion beam
US7776743B2 (en) * 2008-07-30 2010-08-17 Tel Epion Inc. Method of forming semiconductor devices containing metal cap layers
US7871929B2 (en) * 2008-07-30 2011-01-18 Tel Epion Inc. Method of forming semiconductor devices containing metal cap layers
US8202435B2 (en) * 2008-08-01 2012-06-19 Tel Epion Inc. Method for selectively etching areas of a substrate using a gas cluster ion beam
US7948734B2 (en) * 2008-09-11 2011-05-24 Tel Epion Inc. Electrostatic chuck power supply
US8169769B2 (en) * 2008-09-11 2012-05-01 Tel Epion Inc. Electrostatic chuck power supply
US7834327B2 (en) * 2008-09-23 2010-11-16 Tel Epion Inc. Self-biasing active load circuit and related power supply for use in a charged particle beam processing system
US8313663B2 (en) * 2008-09-24 2012-11-20 Tel Epion Inc. Surface profile adjustment using gas cluster ion beam processing
US8097860B2 (en) * 2009-02-04 2012-01-17 Tel Epion Inc. Multiple nozzle gas cluster ion beam processing system and method of operating
US8981322B2 (en) * 2009-02-04 2015-03-17 Tel Epion Inc. Multiple nozzle gas cluster ion beam system
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US20100200774A1 (en) * 2009-02-09 2010-08-12 Tel Epion Inc. Multi-sequence film deposition and growth using gas cluster ion beam processing
US8455060B2 (en) * 2009-02-19 2013-06-04 Tel Epion Inc. Method for depositing hydrogenated diamond-like carbon films using a gas cluster ion beam
US7947582B2 (en) * 2009-02-27 2011-05-24 Tel Epion Inc. Material infusion in a trap layer structure using gas cluster ion beam processing
US8226835B2 (en) * 2009-03-06 2012-07-24 Tel Epion Inc. Ultra-thin film formation using gas cluster ion beam processing
JP5701783B2 (ja) * 2009-03-11 2015-04-15 エクソジェネシス コーポレーション 表面の生物活性特性を改善する方法とこの方法によって改善された表面をもつ物体
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US8877299B2 (en) * 2009-03-31 2014-11-04 Tel Epion Inc. Method for enhancing a substrate using gas cluster ion beam processing
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US8237136B2 (en) * 2009-10-08 2012-08-07 Tel Epion Inc. Method and system for tilting a substrate during gas cluster ion beam processing
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Also Published As

Publication number Publication date
JP2004527875A (ja) 2004-09-09
US20020130275A1 (en) 2002-09-19
DE60122379D1 (de) 2006-09-28
JP4168381B2 (ja) 2008-10-22
EP1348227A2 (en) 2003-10-01
EP1348227B1 (en) 2006-08-16
US6646277B2 (en) 2003-11-11
WO2002052608A3 (en) 2003-01-09
WO2002052608A2 (en) 2002-07-04

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8327 Change in the person/name/address of the patent owner

Owner name: TEL EPION INC., BILLERICA, MASS., US