DE60121849D1 - Piezoelektrische/elektrostriktive Film-Bauelemente sowie deren Herstellungsverfahren - Google Patents
Piezoelektrische/elektrostriktive Film-Bauelemente sowie deren HerstellungsverfahrenInfo
- Publication number
- DE60121849D1 DE60121849D1 DE60121849T DE60121849T DE60121849D1 DE 60121849 D1 DE60121849 D1 DE 60121849D1 DE 60121849 T DE60121849 T DE 60121849T DE 60121849 T DE60121849 T DE 60121849T DE 60121849 D1 DE60121849 D1 DE 60121849D1
- Authority
- DE
- Germany
- Prior art keywords
- piezoelectric
- manufacturing processes
- electrostrictive film
- film components
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
- B81B3/0021—Transducers for transforming electrical into mechanical energy or vice versa
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/09—Forming piezoelectric or electrostrictive materials
- H10N30/093—Forming inorganic materials
- H10N30/097—Forming inorganic materials by sintering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2041—Beam type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2041—Beam type
- H10N30/2042—Cantilevers, i.e. having one fixed end
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2047—Membrane type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
- H10N30/706—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/40—Umbrella-frame making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Analytical Chemistry (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Oxide Ceramics (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000118030 | 2000-04-19 | ||
JP2000118030 | 2000-04-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60121849D1 true DE60121849D1 (de) | 2006-09-14 |
DE60121849T2 DE60121849T2 (de) | 2007-02-01 |
Family
ID=18629244
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60121849T Expired - Lifetime DE60121849T2 (de) | 2000-04-19 | 2001-04-19 | Piezoelektrische/elektrostriktive Film-Bauelemente sowie deren Herstellungsverfahren |
Country Status (3)
Country | Link |
---|---|
US (2) | US6518690B2 (de) |
EP (1) | EP1148561B1 (de) |
DE (1) | DE60121849T2 (de) |
Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3904240B2 (ja) * | 1996-11-29 | 2007-04-11 | 日本碍子株式会社 | セラミック素子 |
JP4074493B2 (ja) * | 2001-08-31 | 2008-04-09 | 日本碍子株式会社 | セラミック素子 |
US20050206275A1 (en) * | 2002-01-18 | 2005-09-22 | Radziemski Leon J | Apparatus and method to generate electricity |
JP3957528B2 (ja) * | 2002-03-05 | 2007-08-15 | 日本碍子株式会社 | 圧電/電歪膜型素子 |
JP4422973B2 (ja) * | 2002-08-27 | 2010-03-03 | 京セラ株式会社 | 積層圧電体、アクチュエータ及び印刷ヘッド |
GB0229655D0 (en) * | 2002-12-20 | 2003-01-22 | Xaar Technology Ltd | Droplet deposition apparatus |
JP3920223B2 (ja) * | 2003-01-07 | 2007-05-30 | 日本碍子株式会社 | 反応性チップと、このチップを用いた標的物質の結合検出方法 |
US20040159166A1 (en) * | 2003-02-13 | 2004-08-19 | Schiller Peter J. | Solid-state piezoelectric motion transducer |
WO2004109749A2 (en) * | 2003-06-11 | 2004-12-16 | Yeda Research And Development Company Ltd. | Pyroelectric compound and method of its preparation |
US20040254471A1 (en) * | 2003-06-13 | 2004-12-16 | Andreas Hadjicostis | Miniature ultrasonic phased array for intracardiac and intracavity applications |
US20050251127A1 (en) * | 2003-10-15 | 2005-11-10 | Jared Brosch | Miniature ultrasonic transducer with focusing lens for intracardiac and intracavity applications |
WO2005104257A1 (en) * | 2004-04-23 | 2005-11-03 | Agency For Science, Technology And Research | Micro-electromechanical device |
EP1796183A4 (de) * | 2004-09-29 | 2010-12-08 | Ngk Insulators Ltd | Piezoelektrizitäts-/elektrostriktionsfilmelement und herstellungsverfahren dafür |
US7332851B2 (en) | 2004-09-29 | 2008-02-19 | Ngk Insulators, Ltd. | Piezoelectric/electrostrictive film type device and method of manufacturing the same |
EP2124269B1 (de) * | 2007-02-20 | 2013-05-08 | NGK Insulators, Ltd. | Piezoelektrisches bauelement |
US9370640B2 (en) | 2007-09-12 | 2016-06-21 | Novasentis, Inc. | Steerable medical guide wire device |
CN101514870B (zh) * | 2008-02-22 | 2012-02-22 | 中冶天工建设有限公司 | 利用木模板及型钢制作环形加热炉工作层的施工方法 |
NO336140B1 (no) * | 2009-09-18 | 2015-05-26 | Sintef | Aktuator for mikro optisk enhet |
FR2967149B1 (fr) * | 2010-11-04 | 2013-10-25 | Inst Nat Sciences Appliq | Micro-actionneur et procédé de fabrication associe |
US8941286B2 (en) * | 2012-02-14 | 2015-01-27 | Taiyo Yuden Co., Ltd. | Acoustic wave device |
JP6102075B2 (ja) | 2012-03-30 | 2017-03-29 | セイコーエプソン株式会社 | 超音波トランスデューサー素子チップおよびプローブ並びに電子機器および超音波診断装置 |
US9705068B2 (en) | 2012-06-19 | 2017-07-11 | Novasentis, Inc. | Ultra-thin inertial actuator |
US9183710B2 (en) | 2012-08-03 | 2015-11-10 | Novasentis, Inc. | Localized multimodal electromechanical polymer transducers |
US9357312B2 (en) | 2012-11-21 | 2016-05-31 | Novasentis, Inc. | System of audio speakers implemented using EMP actuators |
US9053617B2 (en) | 2012-11-21 | 2015-06-09 | Novasentis, Inc. | Systems including electromechanical polymer sensors and actuators |
US9164586B2 (en) | 2012-11-21 | 2015-10-20 | Novasentis, Inc. | Haptic system with localized response |
US9170650B2 (en) | 2012-11-21 | 2015-10-27 | Novasentis, Inc. | EMP actuators for deformable surface and keyboard application |
WO2014107677A1 (en) | 2013-01-07 | 2014-07-10 | Novasentis, Inc. | Method and localized haptic response system provided on an interior-facing surface of a housing of an electronic device |
US10088936B2 (en) | 2013-01-07 | 2018-10-02 | Novasentis, Inc. | Thin profile user interface device and method providing localized haptic response |
US9590533B2 (en) * | 2013-01-23 | 2017-03-07 | The Regents Of The University Of Michigan | Piezoelectric vibrational energy harvester |
US20140262742A1 (en) * | 2013-03-12 | 2014-09-18 | Sunpower Technologies Llc | Substrate for Increased Efficiency of Semiconductor Photocatalysts |
US10125758B2 (en) | 2013-08-30 | 2018-11-13 | Novasentis, Inc. | Electromechanical polymer pumps |
US9507468B2 (en) | 2013-08-30 | 2016-11-29 | Novasentis, Inc. | Electromechanical polymer-based sensor |
US9833596B2 (en) | 2013-08-30 | 2017-12-05 | Novasentis, Inc. | Catheter having a steerable tip |
US9666391B2 (en) | 2013-10-22 | 2017-05-30 | Novasentis, Inc. | Retractable snap domes |
WO2015131083A1 (en) | 2014-02-28 | 2015-09-03 | The Regents Of The University Of California | Variable thickness diaphragm for a wideband robust piezoelectric micromachined ultrasonic transducer (pmut) |
US9652946B2 (en) | 2014-05-02 | 2017-05-16 | Novasentis, Inc. | Hands-free, wearable vibration devices and method |
US20170194553A1 (en) * | 2014-06-05 | 2017-07-06 | University Of Florida Research Foundation, Inc. | Laterally Curved Actuators of Shape Memory Materials |
US9576446B2 (en) | 2014-08-07 | 2017-02-21 | Novasentis, Inc. | Ultra-thin haptic switch with lighting |
US9972768B2 (en) | 2014-08-15 | 2018-05-15 | Novasentis, Inc. | Actuator structure and method |
US9862592B2 (en) * | 2015-03-13 | 2018-01-09 | Taiwan Semiconductor Manufacturing Co., Ltd. | MEMS transducer and method for manufacturing the same |
KR102605479B1 (ko) * | 2018-08-30 | 2023-11-22 | 엘지디스플레이 주식회사 | 압전 소자 및 이를 포함하는 표시 장치 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2544085A1 (de) * | 1974-10-04 | 1976-04-08 | Ncr Co | Verfahren zum tempern von duennen ferroelektrischen schichten |
DD119917A1 (de) * | 1975-06-27 | 1976-05-12 | ||
EP0408306B1 (de) * | 1989-07-11 | 1996-05-01 | Ngk Insulators, Ltd. | Einen piezoelektrischen/elektrostriktiven Film enthaltende piezoelektrischer/elektrostriktiver Antrieb |
JP2842448B2 (ja) | 1989-07-11 | 1999-01-06 | 日本碍子株式会社 | 圧電/電歪膜型アクチュエータ |
JP2693291B2 (ja) | 1990-07-26 | 1997-12-24 | 日本碍子株式会社 | 圧電/電歪アクチュエータ |
JP3126212B2 (ja) | 1992-03-21 | 2001-01-22 | 日本碍子株式会社 | 圧電/電歪膜型素子 |
DE69223096T2 (de) * | 1991-07-18 | 1998-05-28 | Ngk Insulators Ltd | Piezoelektrischer/elektrostriktiver Element mit einem keramischen Substrat aus stabilisiertem Zirkoniumdioxid |
JP3272004B2 (ja) | 1991-10-03 | 2002-04-08 | 日本碍子株式会社 | 圧電/電歪膜型素子 |
JP3009945B2 (ja) | 1991-07-18 | 2000-02-14 | 日本碍子株式会社 | 圧電/電歪膜型素子 |
DE19615695C1 (de) * | 1996-04-19 | 1997-07-03 | Siemens Ag | Verfahren zur Herstellung eines Piezoaktors monolithischer Vielschichtbauweise |
EP0810676B1 (de) * | 1996-05-27 | 2002-08-28 | Ngk Insulators, Ltd. | Piezoelektrisches Element des Dünnschichttyps |
JP3193302B2 (ja) * | 1996-06-26 | 2001-07-30 | ティーディーケイ株式会社 | 膜構造体、電子デバイス、記録媒体および強誘電体薄膜の製造方法 |
US6091182A (en) | 1996-11-07 | 2000-07-18 | Ngk Insulators, Ltd. | Piezoelectric/electrostrictive element |
JP3904240B2 (ja) | 1996-11-29 | 2007-04-11 | 日本碍子株式会社 | セラミック素子 |
JP3545269B2 (ja) | 1998-09-04 | 2004-07-21 | 日本碍子株式会社 | 質量センサ及び質量検出方法 |
US6594875B2 (en) * | 1998-10-14 | 2003-07-22 | Samsung Electro-Mechanics Co. | Method for producing a piezoelectric/electrostrictive actuator |
-
2001
- 2001-04-18 US US09/837,546 patent/US6518690B2/en not_active Expired - Lifetime
- 2001-04-19 DE DE60121849T patent/DE60121849T2/de not_active Expired - Lifetime
- 2001-04-19 EP EP01303594A patent/EP1148561B1/de not_active Expired - Lifetime
-
2002
- 2002-09-06 US US10/236,754 patent/US6703257B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1148561A3 (de) | 2004-06-16 |
US20030033700A1 (en) | 2003-02-20 |
US20020014816A1 (en) | 2002-02-07 |
US6518690B2 (en) | 2003-02-11 |
EP1148561B1 (de) | 2006-08-02 |
DE60121849T2 (de) | 2007-02-01 |
EP1148561A2 (de) | 2001-10-24 |
US6703257B2 (en) | 2004-03-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |