DE60115899D1 - Verfahren zur verklebung von polymeren materialien auf metalloberflächen - Google Patents

Verfahren zur verklebung von polymeren materialien auf metalloberflächen

Info

Publication number
DE60115899D1
DE60115899D1 DE60115899T DE60115899T DE60115899D1 DE 60115899 D1 DE60115899 D1 DE 60115899D1 DE 60115899 T DE60115899 T DE 60115899T DE 60115899 T DE60115899 T DE 60115899T DE 60115899 D1 DE60115899 D1 DE 60115899D1
Authority
DE
Germany
Prior art keywords
polymeric materials
metal surfaces
bonding polymeric
bonding
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60115899T
Other languages
English (en)
Other versions
DE60115899T2 (de
Inventor
Donald Ferrier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Inc
Original Assignee
MacDermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MacDermid Inc filed Critical MacDermid Inc
Application granted granted Critical
Publication of DE60115899D1 publication Critical patent/DE60115899D1/de
Publication of DE60115899T2 publication Critical patent/DE60115899T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/32—Alkaline compositions
    • C23F1/34—Alkaline compositions for etching copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • C09J2400/166—Metal in the pretreated surface to be joined

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
DE60115899T 2000-06-21 2001-05-01 Verfahren zur verklebung von polymeren materialien auf metalloberflächen Expired - Lifetime DE60115899T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US598857 1996-02-09
US09/598,857 US6419784B1 (en) 2000-06-21 2000-06-21 Process for improving the adhesion of polymeric materials to metal surfaces
PCT/US2001/014018 WO2001098423A1 (en) 2000-06-21 2001-05-01 Polymeric materials to metal surfaces adhesion process

Publications (2)

Publication Number Publication Date
DE60115899D1 true DE60115899D1 (de) 2006-01-19
DE60115899T2 DE60115899T2 (de) 2006-08-10

Family

ID=24397203

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60115899T Expired - Lifetime DE60115899T2 (de) 2000-06-21 2001-05-01 Verfahren zur verklebung von polymeren materialien auf metalloberflächen

Country Status (10)

Country Link
US (1) US6419784B1 (de)
EP (1) EP1297086B1 (de)
JP (1) JP3908663B2 (de)
CN (1) CN1233762C (de)
AU (1) AU2001255784A1 (de)
CA (1) CA2407281C (de)
DE (1) DE60115899T2 (de)
ES (1) ES2254409T3 (de)
TW (1) TW522166B (de)
WO (1) WO2001098423A1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6560110B1 (en) * 2002-02-22 2003-05-06 Delphi Technologies, Inc. Corrosive resistant flip chip thermal management structure
US6841263B2 (en) * 2002-05-03 2005-01-11 The John Hopkins University Method of adhering a solid polymer to a substrate and resulting article
US7232478B2 (en) * 2003-07-14 2007-06-19 Enthone Inc. Adhesion promotion in printed circuit boards
EP1647588A3 (de) * 2004-10-13 2006-11-02 Rohm and Haas Company An der Oberfläche aktivierte Michaelhärtung
US20070066503A1 (en) * 2005-08-19 2007-03-22 Mores Basaly Methods and compositions for acid treatment of a metal surface
US8088246B2 (en) * 2009-01-08 2012-01-03 Cordani Jr John L Process for improving the adhesion of polymeric materials to metal surfaces
US8512504B2 (en) 2009-05-06 2013-08-20 Steven A. Castaldi Process for improving adhesion of polymeric materials to metal surfaces
US8308893B2 (en) * 2010-02-01 2012-11-13 Ming De Wang Nano-oxide process for bonding copper/copper alloy and resin
JP5630341B2 (ja) * 2010-06-18 2014-11-26 株式会社ジェイテクト 接着せん断強度の管理方法
US8524540B2 (en) 2011-02-01 2013-09-03 Nilesh Kapadia Adhesion promoting composition for metal leadframes
CN105713554B (zh) * 2016-04-27 2018-08-17 吉林大学 一种有机/无机杂化的质子导电黏合剂及其制备方法
WO2020148308A1 (en) * 2019-01-15 2020-07-23 Atotech Deutschland Gmbh Method of forming copper oxide on a copper surface
JP2022099497A (ja) * 2020-12-23 2022-07-05 セイコーエプソン株式会社 電気光学装置及び電子機器

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3392008B2 (ja) * 1996-10-30 2003-03-31 日本表面化学株式会社 金属の保護皮膜形成処理剤と処理方法
US3107198A (en) 1959-12-22 1963-10-15 Du Pont Laminated prepared with werner complex coating on an aluminum layer
US3449192A (en) 1966-12-16 1969-06-10 Continental Can Co Polyethylene aluminum laminates
US3466207A (en) 1967-07-19 1969-09-09 Dow Chemical Co Treatment of metals for promoting adhesion of polyolefins
JPS5221460B1 (de) 1971-04-26 1977-06-10
SE400575B (sv) 1974-12-13 1978-04-03 Nordnero Ab Bad for betning av koppar och dess legeringar
JPS5187540A (ja) * 1975-01-30 1976-07-31 Matsushita Electric Works Ltd Mukizairyotokinzokuno setsuchakuseikojoho
DE2557269A1 (de) 1975-12-19 1977-06-30 Licentia Gmbh Verfahren zum aetzen von kupfer oder kupferlegierungen
JPS52150104A (en) 1976-06-07 1977-12-13 Fuji Photo Film Co Ltd Photoosensitive lithographic press plate material
JPS57116775A (en) 1981-01-14 1982-07-20 Toshiba Corp Etching solution for nickel
US4409037A (en) 1982-04-05 1983-10-11 Macdermid Incorporated Adhesion promoter for printed circuits
US4844981A (en) 1982-04-05 1989-07-04 Macdermid, Incorporated Adhesion promoter for printed circuits
JPS6113688A (ja) 1984-06-28 1986-01-21 福田金属箔粉工業株式会社 印刷回路用銅箔およびその製造方法
JPS61176192A (ja) 1985-01-31 1986-08-07 株式会社日立製作所 銅と樹脂との接着方法
US4775444A (en) 1987-08-26 1988-10-04 Macdermid, Incorporated Process for fabricating multilayer circuit boards
JPH0713304B2 (ja) 1987-12-14 1995-02-15 日立化成工業株式会社 銅の表面処理法
JPH01240683A (ja) 1988-03-19 1989-09-26 Sanshin Kagaku Kogyo Kk 銅のエッチング液組成物およびエッチング方法
JPH01246393A (ja) 1988-03-25 1989-10-02 Fukuda Metal Foil & Powder Co Ltd 内層用銅箔または銅張積層板の表面処理方法
US4997722A (en) 1989-07-10 1991-03-05 Edward Adler Composition and method for improving adherence of copper foil to resinous substrates
US4997516A (en) 1989-07-10 1991-03-05 Edward Adler Method for improving adherence of copper foil to resinous substrates
JPH0379778A (ja) 1989-08-21 1991-04-04 Sanshin Chem Ind Co Ltd 銅のエッチング液組成物およびエッチング方法
US5037482A (en) 1990-02-16 1991-08-06 Macdermid, Incorporated Composition and method for improving adhesion of coatings to copper surfaces
US5128065A (en) 1990-10-03 1992-07-07 Betz Laboratories, Inc. Method for the inhibition of corrosion of copper-bearing metallurgies
US5289630A (en) 1991-07-22 1994-03-01 Macdermid, Incorporated Process for fabricating multilayer printed circuits
JP3387528B2 (ja) 1992-08-07 2003-03-17 朝日化学工業株式会社 銅または銅合金のエッチング用組成物およびそのエッチング方法
JP2717911B2 (ja) 1992-11-19 1998-02-25 日鉱グールド・フォイル株式会社 印刷回路用銅箔及びその製造方法
JP3225471B2 (ja) 1992-12-24 2001-11-05 旭電化工業株式会社 銅溶解剤
BR9307811A (pt) 1993-01-11 1995-11-14 Macdermid Inc Composições fosfatantes e processo particularmente para uso na preparação de circuitos impressos utilizando protetores orgânicos
JP3347457B2 (ja) 1994-02-24 2002-11-20 日本電解株式会社 非シアン系銅−亜鉛電気めっき浴、これを用いたプリント配線板用銅箔の表面処理方法及びプリント配線板用銅箔
JP2781954B2 (ja) 1994-03-04 1998-07-30 メック株式会社 銅および銅合金の表面処理剤
JP3400558B2 (ja) 1994-08-12 2003-04-28 メック株式会社 銅および銅合金のエッチング液
GB9425090D0 (en) 1994-12-12 1995-02-08 Alpha Metals Ltd Copper coating
JP2923524B2 (ja) 1995-08-01 1999-07-26 メック株式会社 銅および銅合金のマイクロエッチング剤並びにマイクロエッチング方法
JP3284057B2 (ja) * 1996-06-27 2002-05-20 ワイケイケイ株式会社 スライドファスナー又はそのチェーンの製造方法
JPH1056263A (ja) 1996-08-07 1998-02-24 Ebara Densan:Kk プリント配線基板の製造方法
TW374802B (en) 1996-07-29 1999-11-21 Ebara Densan Ltd Etching composition, method for roughening copper surface and method for producing printed wiring board
US6146701A (en) * 1997-06-12 2000-11-14 Macdermid, Incorporated Process for improving the adhension of polymeric materials to metal surfaces
US6020029A (en) * 1997-06-12 2000-02-01 Macdermid, Incorporated Process for treating metal surfaces
US5869130A (en) 1997-06-12 1999-02-09 Mac Dermid, Incorporated Process for improving the adhesion of polymeric materials to metal surfaces
US6383272B1 (en) * 2000-06-08 2002-05-07 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces

Also Published As

Publication number Publication date
CN1233762C (zh) 2005-12-28
ES2254409T3 (es) 2006-06-16
EP1297086B1 (de) 2005-12-14
CN1436226A (zh) 2003-08-13
TW522166B (en) 2003-03-01
EP1297086A1 (de) 2003-04-02
JP2004501265A (ja) 2004-01-15
JP3908663B2 (ja) 2007-04-25
CA2407281C (en) 2008-12-02
DE60115899T2 (de) 2006-08-10
AU2001255784A1 (en) 2002-01-02
WO2001098423A1 (en) 2001-12-27
EP1297086A4 (de) 2004-08-25
CA2407281A1 (en) 2001-12-27
US6419784B1 (en) 2002-07-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition