DE60114859D1 - Verfahren und gerät zur temperaturgradientregelung in einem elektronischen system - Google Patents
Verfahren und gerät zur temperaturgradientregelung in einem elektronischen systemInfo
- Publication number
- DE60114859D1 DE60114859D1 DE60114859T DE60114859T DE60114859D1 DE 60114859 D1 DE60114859 D1 DE 60114859D1 DE 60114859 T DE60114859 T DE 60114859T DE 60114859 T DE60114859 T DE 60114859T DE 60114859 D1 DE60114859 D1 DE 60114859D1
- Authority
- DE
- Germany
- Prior art keywords
- electronic system
- temperature gradient
- gradient control
- control
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/08—Tubular elements crimped or corrugated in longitudinal section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/42—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being both outside and inside the tubular element
- F28F1/424—Means comprising outside portions integral with inside portions
- F28F1/426—Means comprising outside portions integral with inside portions the outside portions and the inside portions forming parts of complementary shape, e.g. concave and convex
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
- F28F13/08—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by varying the cross-section of the flow channels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2210/00—Heat exchange conduits
- F28F2210/10—Particular layout, e.g. for uniform temperature distribution
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/660,733 US7017651B1 (en) | 2000-09-13 | 2000-09-13 | Method and apparatus for temperature gradient control in an electronic system |
US660733 | 2000-09-13 | ||
PCT/US2001/028852 WO2002023966A2 (en) | 2000-09-13 | 2001-09-12 | Method and apparatus for temperature gradient control in an electronic system |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60114859D1 true DE60114859D1 (de) | 2005-12-15 |
DE60114859T2 DE60114859T2 (de) | 2006-06-01 |
Family
ID=24650756
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60114859T Expired - Lifetime DE60114859T2 (de) | 2000-09-13 | 2001-09-12 | Verfahren und gerät zur temperaturgradientregelung in einem elektronischen system |
Country Status (5)
Country | Link |
---|---|
US (1) | US7017651B1 (de) |
EP (1) | EP1317774B1 (de) |
AU (1) | AU2001290974A1 (de) |
DE (1) | DE60114859T2 (de) |
WO (1) | WO2002023966A2 (de) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6937471B1 (en) * | 2002-07-11 | 2005-08-30 | Raytheon Company | Method and apparatus for removing heat from a circuit |
US7000691B1 (en) | 2002-07-11 | 2006-02-21 | Raytheon Company | Method and apparatus for cooling with coolant at a subambient pressure |
US6957550B2 (en) | 2003-05-19 | 2005-10-25 | Raytheon Company | Method and apparatus for extracting non-condensable gases in a cooling system |
US6952345B2 (en) * | 2003-10-31 | 2005-10-04 | Raytheon Company | Method and apparatus for cooling heat-generating structure |
US6989991B2 (en) * | 2004-05-18 | 2006-01-24 | Raytheon Company | Thermal management system and method for electronic equipment mounted on coldplates |
US7983042B2 (en) * | 2004-06-15 | 2011-07-19 | Raytheon Company | Thermal management system and method for thin membrane type antennas |
US8341965B2 (en) | 2004-06-24 | 2013-01-01 | Raytheon Company | Method and system for cooling |
US20060067052A1 (en) * | 2004-09-30 | 2006-03-30 | Llapitan David J | Liquid cooling system |
US7254957B2 (en) | 2005-02-15 | 2007-08-14 | Raytheon Company | Method and apparatus for cooling with coolant at a subambient pressure |
TWI280096B (en) * | 2005-05-11 | 2007-04-21 | Quanta Comp Inc | Electronic device |
US7443354B2 (en) | 2005-08-09 | 2008-10-28 | The Boeing Company | Compliant, internally cooled antenna apparatus and method |
US20070119572A1 (en) | 2005-11-30 | 2007-05-31 | Raytheon Company | System and Method for Boiling Heat Transfer Using Self-Induced Coolant Transport and Impingements |
US7417598B2 (en) | 2006-11-08 | 2008-08-26 | The Boeing Company | Compact, low profile electronically scanned antenna |
US7548424B2 (en) * | 2007-03-12 | 2009-06-16 | Raytheon Company | Distributed transmit/receive integrated microwave module chip level cooling system |
US7940524B2 (en) | 2007-10-01 | 2011-05-10 | Raytheon Company | Remote cooling of a phased array antenna |
US9644869B2 (en) * | 2007-10-25 | 2017-05-09 | Raytheon Company | System and method for cooling structures having both an active state and an inactive state |
US8503941B2 (en) | 2008-02-21 | 2013-08-06 | The Boeing Company | System and method for optimized unmanned vehicle communication using telemetry |
US8490678B2 (en) * | 2008-06-02 | 2013-07-23 | Gerald Ho Kim | Silicon-based thermal energy transfer device and apparatus |
FR2938637B1 (fr) * | 2008-11-18 | 2013-01-04 | Cie Mediterraneenne Des Cafes | Conduit de circulation d'un fluide |
US8045329B2 (en) * | 2009-04-29 | 2011-10-25 | Raytheon Company | Thermal dissipation mechanism for an antenna |
JP5487423B2 (ja) * | 2009-07-14 | 2014-05-07 | 株式会社神戸製鋼所 | 熱交換器 |
IL228426B (en) | 2013-09-15 | 2018-10-31 | Elta Systems Ltd | Temperature control for show array antenna |
US10222125B2 (en) | 2015-04-06 | 2019-03-05 | International Business Machines Corporation | Burst resistant thin wall heat sink |
US10215504B2 (en) * | 2015-04-06 | 2019-02-26 | International Business Machines Corporation | Flexible cold plate with enhanced flexibility |
EP3465064B1 (de) | 2016-05-30 | 2021-04-28 | Saab Ab | Kühlvorrichtung mit gleichmässig verteiltem und gerichtetem kühleffekt für hohen wärmefluss und entlüftungsfunktionalität |
US20180023895A1 (en) * | 2016-07-22 | 2018-01-25 | Trane International Inc. | Enhanced Tubular Heat Exchanger |
US20180106500A1 (en) * | 2016-10-18 | 2018-04-19 | Trane International Inc. | Enhanced Tubular Heat Exchanger |
US9894801B1 (en) | 2016-10-31 | 2018-02-13 | International Business Machines Corporation | Cold plate |
US10539371B2 (en) * | 2017-01-18 | 2020-01-21 | Qorvo Us, Inc. | Heat transfer device incorporating a helical flow element within a fluid conduit |
JP2019160831A (ja) * | 2018-03-07 | 2019-09-19 | 富士通株式会社 | クーリングプレート及び情報処理装置 |
US11686539B2 (en) | 2020-03-09 | 2023-06-27 | Raytheon Company | Coldplate with heat transfer module |
JP7140988B2 (ja) * | 2020-07-17 | 2022-09-22 | ダイキン工業株式会社 | 熱交換器 |
EP4260668A1 (de) * | 2020-12-09 | 2023-10-18 | Saab Ab | Kühlsystem eines elektronischen moduls mit einer leckagekontrollvorrichtung |
Family Cites Families (57)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA587174A (en) * | 1959-11-17 | T. Booth Harry | Heat transfer method and apparatus | |
DE240986C (de) * | ||||
DE967450C (de) * | 1952-08-27 | 1957-11-14 | Siemens Ag | Kuehleinrichtung fuer Trockengleichrichter mit Kuehlkanaelen |
US2688467A (en) * | 1953-04-10 | 1954-09-07 | Robert W Leatzow | Device for cooling beverages and the like |
NL291309A (de) * | 1962-08-29 | |||
US3360032A (en) * | 1965-09-20 | 1967-12-26 | Globe Union Inc | Temperature controlling system |
US3826304A (en) * | 1967-10-11 | 1974-07-30 | Universal Oil Prod Co | Advantageous configuration of tubing for internal boiling |
US3631819A (en) * | 1969-07-10 | 1972-01-04 | Boleslaw Houchman | Baking ovens |
US3779312A (en) * | 1972-03-07 | 1973-12-18 | Universal Oil Prod Co | Internally ridged heat transfer tube |
US4103737A (en) | 1976-12-16 | 1978-08-01 | Marantz Company, Inc. | Heat exchanger structure for electronic apparatus |
US4188996A (en) * | 1977-05-04 | 1980-02-19 | Ckd Praha, Oborovy Podnik | Liquid cooler for semiconductor power elements |
DE2814828C3 (de) * | 1978-04-06 | 1981-07-09 | Metallgesellschaft Ag, 6000 Frankfurt | Gaskühler mit innenberippten Bleirohren |
US4222434A (en) * | 1978-04-27 | 1980-09-16 | Clyde Robert A | Ceramic sponge heat-exchanger member |
DE2926342C2 (de) * | 1979-06-29 | 1982-10-28 | Siemens AG, 1000 Berlin und 8000 München | Kühldose für scheibenförmige Halbleiterbauelemente |
US4353350A (en) * | 1981-03-11 | 1982-10-12 | Helmut Albrecht | Fireplace heat exchanger |
SU989301A1 (ru) | 1981-06-04 | 1983-01-15 | Всесоюзный Научно-Исследовательский И Экспериментально-Конструкторский Институт Торгового Машиностроения | Теплообменный элемент |
EP0114640B1 (de) * | 1983-01-25 | 1988-03-02 | Wickes Products, Inc. | Rippenrohr für Wärmetauscher mit optimierten Wärmeübertragungseigenschaften |
JPS60185095A (ja) * | 1984-02-29 | 1985-09-20 | Matsushita Electric Ind Co Ltd | 積層式熱交換器 |
JPS60185094A (ja) * | 1984-03-02 | 1985-09-20 | Satoru Fujii | 均一熱流伝熱管 |
GB2159265B (en) * | 1984-05-22 | 1987-05-28 | Eric Smith | Heat exchangers |
SU1245851A1 (ru) * | 1984-09-18 | 1986-07-23 | Белгородский завод энергетического машиностроения им.60-летия Союза ССР | Теплообменна труба |
JPS61265499A (ja) * | 1985-05-17 | 1986-11-25 | Furukawa Electric Co Ltd:The | 伝熱管 |
SU1288483A2 (ru) * | 1985-07-18 | 1987-02-07 | Voblikov Veniamin A | Теплообменна труба |
JPS62242795A (ja) * | 1986-04-15 | 1987-10-23 | Sumitomo Light Metal Ind Ltd | 伝熱管 |
DE3739585C1 (en) * | 1987-11-23 | 1989-05-11 | Witzenmann Metallschlauchfab | Cold plate for dissipating heat losses from large-scale-integrated electronic chips |
US4851856A (en) * | 1988-02-16 | 1989-07-25 | Westinghouse Electric Corp. | Flexible diaphragm cooling device for microwave antennas |
US5111280A (en) * | 1988-11-10 | 1992-05-05 | Iversen Arthur H | Thermal management of power conditioning systems |
GB2225170B (en) * | 1988-11-22 | 1992-12-16 | Marconi Gec Ltd | Antenna |
GB2236841B (en) * | 1989-08-09 | 1993-09-01 | James Wing Ho Wong | Heat exchangers |
US5140335A (en) * | 1990-10-26 | 1992-08-18 | Westinghouse Electric Corp. | Back-to-back ridged branch manifold structure for a radar frequency antenna |
US5271376A (en) * | 1991-08-12 | 1993-12-21 | Rheem Manufacturing Company | Serpentined tubular heat exchanger apparatus for a fuel-fired forced air heating furnace |
US5269372A (en) * | 1992-12-21 | 1993-12-14 | International Business Machines Corporation | Intersecting flow network for a cold plate cooling system |
US5573062A (en) * | 1992-12-30 | 1996-11-12 | The Furukawa Electric Co., Ltd. | Heat transfer tube for absorption refrigerating machine |
US5375654A (en) * | 1993-11-16 | 1994-12-27 | Fr Mfg. Corporation | Turbulating heat exchange tube and system |
US6067712A (en) * | 1993-12-15 | 2000-05-30 | Olin Corporation | Heat exchange tube with embossed enhancement |
US5829516A (en) | 1993-12-15 | 1998-11-03 | Aavid Thermal Products, Inc. | Liquid cooled heat sink for cooling electronic components |
JPH07211832A (ja) * | 1994-01-03 | 1995-08-11 | Motorola Inc | 電力放散装置とその製造方法 |
DE19541266A1 (de) * | 1995-11-06 | 1997-05-07 | Bayer Ag | Verfahren und Vorrichtung zur Durchführung chemischer Reaktionen mittels eines Mikrostruktur-Lamellenmischers |
DE19541922C2 (de) * | 1995-11-10 | 1997-11-27 | Ws Waermeprozesstechnik Gmbh | Keramischer Rekuperator für einen Rekuperatorbrenner |
JPH09152290A (ja) * | 1995-11-29 | 1997-06-10 | Sanyo Electric Co Ltd | 吸収式冷凍機 |
US5915463A (en) * | 1996-03-23 | 1999-06-29 | Motorola, Inc. | Heat dissipation apparatus and method |
US6184832B1 (en) * | 1996-05-17 | 2001-02-06 | Raytheon Company | Phased array antenna |
US5812372A (en) * | 1996-06-07 | 1998-09-22 | International Business Machines Corporation | Tube in plate heat sink |
US5839505A (en) * | 1996-07-26 | 1998-11-24 | Aaon, Inc. | Dimpled heat exchange tube |
US5835345A (en) * | 1996-10-02 | 1998-11-10 | Sdl, Inc. | Cooler for removing heat from a heated region |
US5983997A (en) * | 1996-10-17 | 1999-11-16 | Brazonics, Inc. | Cold plate having uniform pressure drop and uniform flow rate |
JP3268734B2 (ja) | 1996-11-15 | 2002-03-25 | 古河電気工業株式会社 | ヒートパイプを用いた電子機器放熱ユニットの製造方法 |
JP3082738B2 (ja) * | 1998-03-13 | 2000-08-28 | 日本電気株式会社 | 高効率液体冷却装置 |
JPH11317618A (ja) * | 1998-04-30 | 1999-11-16 | Japan Radio Co Ltd | フェーズドアレイ空中線放熱方式 |
DE19860415A1 (de) | 1998-12-28 | 2000-06-29 | Abb Research Ltd | Halbleitermodul |
US6330153B1 (en) * | 1999-01-14 | 2001-12-11 | Nokia Telecommunications Oy | Method and system for efficiently removing heat generated from an electronic device |
JP2001041675A (ja) * | 1999-07-28 | 2001-02-16 | Mitsubishi Heavy Ind Ltd | 熱交換器用チューブおよび熱交換器 |
US6366461B1 (en) * | 1999-09-29 | 2002-04-02 | Silicon Graphics, Inc. | System and method for cooling electronic components |
SE522799C2 (sv) | 2000-02-23 | 2004-03-09 | Teracom Ab | Anordning för borttransport av värme från uppvärmda element samt ett förfarande för tillverkning av anordningen |
US6257320B1 (en) * | 2000-03-28 | 2001-07-10 | Alec Wargo | Heat sink device for power semiconductors |
US6292364B1 (en) * | 2000-04-28 | 2001-09-18 | Raytheon Company | Liquid spray cooled module |
US6469671B1 (en) * | 2001-07-13 | 2002-10-22 | Lockheed Martin Corporation | Low-temperature-difference TR module mounting, and antenna array using such mounting |
-
2000
- 2000-09-13 US US09/660,733 patent/US7017651B1/en not_active Expired - Lifetime
-
2001
- 2001-09-12 EP EP01971038A patent/EP1317774B1/de not_active Expired - Lifetime
- 2001-09-12 DE DE60114859T patent/DE60114859T2/de not_active Expired - Lifetime
- 2001-09-12 AU AU2001290974A patent/AU2001290974A1/en not_active Abandoned
- 2001-09-12 WO PCT/US2001/028852 patent/WO2002023966A2/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
AU2001290974A1 (en) | 2002-03-26 |
EP1317774A2 (de) | 2003-06-11 |
EP1317774B1 (de) | 2005-11-09 |
US7017651B1 (en) | 2006-03-28 |
WO2002023966A2 (en) | 2002-03-21 |
WO2002023966A3 (en) | 2002-05-30 |
DE60114859T2 (de) | 2006-06-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE60114859D1 (de) | Verfahren und gerät zur temperaturgradientregelung in einem elektronischen system | |
DE60138109D1 (de) | Verfahren und vorrichtung zur mehrwegesignalkompen | |
DE69922180D1 (de) | Verfahren und vorrichtung zur datenflussteuerung | |
DE60228013D1 (de) | Vorrichtung und Verfahren zur Fahrzeugsteuerung | |
DE69942230D1 (de) | Verfahren und vorrichtung zur temperaturkontrolle integrierter batterien | |
DE69817109D1 (de) | Sichere Vorrichtung und Verfahren zur Datensteuerung | |
DE60034121D1 (de) | Verfahren und vorrichtung zur streuparameter-kalibrierung | |
DE60141949D1 (de) | Verfahren und einrichtung zur beteiligung an gruppunikationssystem | |
DE59804554D1 (de) | Vorrichtung und Verfahren zur Temperaturmessung in Rohrreaktoren | |
DE60042309D1 (de) | Verfahren und vorrichtung zur datenflusssteuerung in einem elektrizitätszähler | |
DE69931004D1 (de) | Verfahren und Vorrichtung zur Datenverarbeitung | |
DE50100861D1 (de) | Verfahren und Vorrichtung zur Laser-Mikrodissektion | |
DE60000380D1 (de) | Verfahren und Vorrichtung zur Datenkompression | |
DE69925155D1 (de) | Verfahren und gerät zur klassifikation | |
DE60110961D1 (de) | Verfahren und Vorrichtung zur elektronischen Fernbedienung | |
DE69909635D1 (de) | Gerät und verfahren zur elektronischen bildverbesserung | |
DE50202624D1 (de) | Verfahren und vorrichtung zur kontinuierlichen rodox-regelung bei azokupplungen | |
DE50100784D1 (de) | Verfahren und Vorrichtung zur Laser-Mikrodissektion | |
ATE335275T1 (de) | Verfahren und vorrichtung zur informationsaufzeichnung in einheiten | |
DE60009228D1 (de) | Verfahren und Gerät zur arithmetischen Steurung | |
DE69819366D1 (de) | Verfahren und vorrichtung zur verflüssigung | |
DE60102130D1 (de) | Verfahren und Vorrichtung zur synchronen Regelung | |
DE59611083D1 (de) | Regeleinrichtung und Verfahren zur Temperaturregelung in Kühlgeräten | |
DE60007956D1 (de) | Vorrichtung und Verfahren zur SISO Dekodierung | |
DE60003831D1 (de) | Vorrichtung und verfahren zur schusssimulation |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |