AU2001290974A1 - Method and apparatus for temperature gradient control in an electronic system - Google Patents

Method and apparatus for temperature gradient control in an electronic system

Info

Publication number
AU2001290974A1
AU2001290974A1 AU2001290974A AU9097401A AU2001290974A1 AU 2001290974 A1 AU2001290974 A1 AU 2001290974A1 AU 2001290974 A AU2001290974 A AU 2001290974A AU 9097401 A AU9097401 A AU 9097401A AU 2001290974 A1 AU2001290974 A1 AU 2001290974A1
Authority
AU
Australia
Prior art keywords
electronic system
temperature gradient
gradient control
control
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001290974A
Inventor
Lucian A. Brasier
Timothy C. Fletcher
James S. Mason
James S. Wilson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Publication of AU2001290974A1 publication Critical patent/AU2001290974A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/08—Tubular elements crimped or corrugated in longitudinal section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/42—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being both outside and inside the tubular element
    • F28F1/424—Means comprising outside portions integral with inside portions
    • F28F1/426—Means comprising outside portions integral with inside portions the outside portions and the inside portions forming parts of complementary shape, e.g. concave and convex
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F28F13/08—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by varying the cross-section of the flow channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2210/00—Heat exchange conduits
    • F28F2210/10—Particular layout, e.g. for uniform temperature distribution
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
AU2001290974A 2000-09-13 2001-09-12 Method and apparatus for temperature gradient control in an electronic system Abandoned AU2001290974A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/660,733 US7017651B1 (en) 2000-09-13 2000-09-13 Method and apparatus for temperature gradient control in an electronic system
US09660733 2000-09-13
PCT/US2001/028852 WO2002023966A2 (en) 2000-09-13 2001-09-12 Method and apparatus for temperature gradient control in an electronic system

Publications (1)

Publication Number Publication Date
AU2001290974A1 true AU2001290974A1 (en) 2002-03-26

Family

ID=24650756

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001290974A Abandoned AU2001290974A1 (en) 2000-09-13 2001-09-12 Method and apparatus for temperature gradient control in an electronic system

Country Status (5)

Country Link
US (1) US7017651B1 (en)
EP (1) EP1317774B1 (en)
AU (1) AU2001290974A1 (en)
DE (1) DE60114859T2 (en)
WO (1) WO2002023966A2 (en)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6937471B1 (en) 2002-07-11 2005-08-30 Raytheon Company Method and apparatus for removing heat from a circuit
US7000691B1 (en) 2002-07-11 2006-02-21 Raytheon Company Method and apparatus for cooling with coolant at a subambient pressure
US6957550B2 (en) 2003-05-19 2005-10-25 Raytheon Company Method and apparatus for extracting non-condensable gases in a cooling system
US6952345B2 (en) 2003-10-31 2005-10-04 Raytheon Company Method and apparatus for cooling heat-generating structure
US6989991B2 (en) * 2004-05-18 2006-01-24 Raytheon Company Thermal management system and method for electronic equipment mounted on coldplates
US7983042B2 (en) * 2004-06-15 2011-07-19 Raytheon Company Thermal management system and method for thin membrane type antennas
US8341965B2 (en) 2004-06-24 2013-01-01 Raytheon Company Method and system for cooling
US20060067052A1 (en) * 2004-09-30 2006-03-30 Llapitan David J Liquid cooling system
US7254957B2 (en) 2005-02-15 2007-08-14 Raytheon Company Method and apparatus for cooling with coolant at a subambient pressure
TWI280096B (en) * 2005-05-11 2007-04-21 Quanta Comp Inc Electronic device
US7443354B2 (en) 2005-08-09 2008-10-28 The Boeing Company Compliant, internally cooled antenna apparatus and method
US20070119572A1 (en) 2005-11-30 2007-05-31 Raytheon Company System and Method for Boiling Heat Transfer Using Self-Induced Coolant Transport and Impingements
US7417598B2 (en) 2006-11-08 2008-08-26 The Boeing Company Compact, low profile electronically scanned antenna
US7548424B2 (en) * 2007-03-12 2009-06-16 Raytheon Company Distributed transmit/receive integrated microwave module chip level cooling system
US7940524B2 (en) 2007-10-01 2011-05-10 Raytheon Company Remote cooling of a phased array antenna
US9644869B2 (en) * 2007-10-25 2017-05-09 Raytheon Company System and method for cooling structures having both an active state and an inactive state
US8503941B2 (en) 2008-02-21 2013-08-06 The Boeing Company System and method for optimized unmanned vehicle communication using telemetry
US8490678B2 (en) * 2008-06-02 2013-07-23 Gerald Ho Kim Silicon-based thermal energy transfer device and apparatus
FR2938637B1 (en) * 2008-11-18 2013-01-04 Cie Mediterraneenne Des Cafes CIRCULATING CONDUIT OF A FLUID
US8045329B2 (en) * 2009-04-29 2011-10-25 Raytheon Company Thermal dissipation mechanism for an antenna
JP5487423B2 (en) * 2009-07-14 2014-05-07 株式会社神戸製鋼所 Heat exchanger
IL228426B (en) 2013-09-15 2018-10-31 Elta Systems Ltd Temperature control for phased array antenna
US10215504B2 (en) * 2015-04-06 2019-02-26 International Business Machines Corporation Flexible cold plate with enhanced flexibility
US10222125B2 (en) 2015-04-06 2019-03-05 International Business Machines Corporation Burst resistant thin wall heat sink
US10955199B2 (en) 2016-05-30 2021-03-23 Saab Ab Cooling device with evenly distributed and directed cooling effect for high heat flux and deaeration functionality
US20180023895A1 (en) * 2016-07-22 2018-01-25 Trane International Inc. Enhanced Tubular Heat Exchanger
US20180106500A1 (en) * 2016-10-18 2018-04-19 Trane International Inc. Enhanced Tubular Heat Exchanger
US9894801B1 (en) * 2016-10-31 2018-02-13 International Business Machines Corporation Cold plate
US10539371B2 (en) * 2017-01-18 2020-01-21 Qorvo Us, Inc. Heat transfer device incorporating a helical flow element within a fluid conduit
JP2019160831A (en) * 2018-03-07 2019-09-19 富士通株式会社 Cooling plate and information processing apparatus
US11686539B2 (en) 2020-03-09 2023-06-27 Raytheon Company Coldplate with heat transfer module
JP7140988B2 (en) * 2020-07-17 2022-09-22 ダイキン工業株式会社 Heat exchanger
KR20230114272A (en) * 2020-12-09 2023-08-01 사브 에이비 Cooling system for electronic modules with leakage control

Family Cites Families (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE240986C (en) *
CA587174A (en) * 1959-11-17 T. Booth Harry Heat transfer method and apparatus
DE967450C (en) * 1952-08-27 1957-11-14 Siemens Ag Cooling device for dry rectifier with cooling ducts
US2688467A (en) * 1953-04-10 1954-09-07 Robert W Leatzow Device for cooling beverages and the like
NL291309A (en) * 1962-08-29
US3360032A (en) * 1965-09-20 1967-12-26 Globe Union Inc Temperature controlling system
US3826304A (en) * 1967-10-11 1974-07-30 Universal Oil Prod Co Advantageous configuration of tubing for internal boiling
US3631819A (en) * 1969-07-10 1972-01-04 Boleslaw Houchman Baking ovens
US3779312A (en) * 1972-03-07 1973-12-18 Universal Oil Prod Co Internally ridged heat transfer tube
US4103737A (en) 1976-12-16 1978-08-01 Marantz Company, Inc. Heat exchanger structure for electronic apparatus
US4188996A (en) * 1977-05-04 1980-02-19 Ckd Praha, Oborovy Podnik Liquid cooler for semiconductor power elements
DE2814828C3 (en) * 1978-04-06 1981-07-09 Metallgesellschaft Ag, 6000 Frankfurt Gas cooler with internally ribbed lead pipes
US4222434A (en) * 1978-04-27 1980-09-16 Clyde Robert A Ceramic sponge heat-exchanger member
DE2926342C2 (en) * 1979-06-29 1982-10-28 Siemens AG, 1000 Berlin und 8000 München Cooling box for disk-shaped semiconductor components
US4353350A (en) * 1981-03-11 1982-10-12 Helmut Albrecht Fireplace heat exchanger
SU989301A1 (en) 1981-06-04 1983-01-15 Всесоюзный Научно-Исследовательский И Экспериментально-Конструкторский Институт Торгового Машиностроения Heat exchanging element
EP0114640B1 (en) * 1983-01-25 1988-03-02 Wickes Products, Inc. Finned heat exchanger tube having optimized heat transfer characteristics
JPS60185095A (en) * 1984-02-29 1985-09-20 Matsushita Electric Ind Co Ltd Heat exchanger of layer type
JPS60185094A (en) * 1984-03-02 1985-09-20 Satoru Fujii Heat transfer pipe of uniform heat flow type
GB2159265B (en) * 1984-05-22 1987-05-28 Eric Smith Heat exchangers
SU1245851A1 (en) * 1984-09-18 1986-07-23 Белгородский завод энергетического машиностроения им.60-летия Союза ССР Heat-exchange pipe
JPS61265499A (en) * 1985-05-17 1986-11-25 Furukawa Electric Co Ltd:The Heat transfer tube
SU1288483A2 (en) * 1985-07-18 1987-02-07 Voblikov Veniamin A Heat-exchanging pipe
JPS62242795A (en) * 1986-04-15 1987-10-23 Sumitomo Light Metal Ind Ltd Heat transfer tube
DE3739585C1 (en) * 1987-11-23 1989-05-11 Witzenmann Metallschlauchfab Cold plate for dissipating heat losses from large-scale-integrated electronic chips
US4851856A (en) * 1988-02-16 1989-07-25 Westinghouse Electric Corp. Flexible diaphragm cooling device for microwave antennas
US5111280A (en) * 1988-11-10 1992-05-05 Iversen Arthur H Thermal management of power conditioning systems
GB2225170B (en) * 1988-11-22 1992-12-16 Marconi Gec Ltd Antenna
GB2236841B (en) * 1989-08-09 1993-09-01 James Wing Ho Wong Heat exchangers
US5140335A (en) * 1990-10-26 1992-08-18 Westinghouse Electric Corp. Back-to-back ridged branch manifold structure for a radar frequency antenna
US5271376A (en) * 1991-08-12 1993-12-21 Rheem Manufacturing Company Serpentined tubular heat exchanger apparatus for a fuel-fired forced air heating furnace
US5269372A (en) * 1992-12-21 1993-12-14 International Business Machines Corporation Intersecting flow network for a cold plate cooling system
US5573062A (en) * 1992-12-30 1996-11-12 The Furukawa Electric Co., Ltd. Heat transfer tube for absorption refrigerating machine
US5375654A (en) * 1993-11-16 1994-12-27 Fr Mfg. Corporation Turbulating heat exchange tube and system
US5829516A (en) * 1993-12-15 1998-11-03 Aavid Thermal Products, Inc. Liquid cooled heat sink for cooling electronic components
US6067712A (en) * 1993-12-15 2000-05-30 Olin Corporation Heat exchange tube with embossed enhancement
JPH07211832A (en) * 1994-01-03 1995-08-11 Motorola Inc Power radiating device and manufacture thereof
DE19541266A1 (en) * 1995-11-06 1997-05-07 Bayer Ag Method and device for carrying out chemical reactions using a microstructure lamella mixer
DE19541922C2 (en) * 1995-11-10 1997-11-27 Ws Waermeprozesstechnik Gmbh Ceramic recuperator for a recuperator burner
JPH09152290A (en) * 1995-11-29 1997-06-10 Sanyo Electric Co Ltd Absorption refrigerating machine
US5915463A (en) * 1996-03-23 1999-06-29 Motorola, Inc. Heat dissipation apparatus and method
US6184832B1 (en) * 1996-05-17 2001-02-06 Raytheon Company Phased array antenna
US5812372A (en) * 1996-06-07 1998-09-22 International Business Machines Corporation Tube in plate heat sink
US5839505A (en) * 1996-07-26 1998-11-24 Aaon, Inc. Dimpled heat exchange tube
US5835345A (en) * 1996-10-02 1998-11-10 Sdl, Inc. Cooler for removing heat from a heated region
US5983997A (en) * 1996-10-17 1999-11-16 Brazonics, Inc. Cold plate having uniform pressure drop and uniform flow rate
JP3268734B2 (en) 1996-11-15 2002-03-25 古河電気工業株式会社 Method of manufacturing electronic device heat radiation unit using heat pipe
JP3082738B2 (en) * 1998-03-13 2000-08-28 日本電気株式会社 High efficiency liquid cooling device
JPH11317618A (en) * 1998-04-30 1999-11-16 Japan Radio Co Ltd Phased-array antenna radiation system
DE19860415A1 (en) 1998-12-28 2000-06-29 Abb Research Ltd Power semiconductor module, e.g. a diode or IGBT chip module, has a semiconductor element on a base element containing an electrically insulating element which forms a coolant channel
US6330153B1 (en) * 1999-01-14 2001-12-11 Nokia Telecommunications Oy Method and system for efficiently removing heat generated from an electronic device
JP2001041675A (en) * 1999-07-28 2001-02-16 Mitsubishi Heavy Ind Ltd Tube for heat exchanger and heat exchanger
US6366461B1 (en) * 1999-09-29 2002-04-02 Silicon Graphics, Inc. System and method for cooling electronic components
SE522799C2 (en) 2000-02-23 2004-03-09 Teracom Ab Apparatus for the removal of heat from heated elements and a method of manufacturing the apparatus
US6257320B1 (en) * 2000-03-28 2001-07-10 Alec Wargo Heat sink device for power semiconductors
US6292364B1 (en) * 2000-04-28 2001-09-18 Raytheon Company Liquid spray cooled module
US6469671B1 (en) * 2001-07-13 2002-10-22 Lockheed Martin Corporation Low-temperature-difference TR module mounting, and antenna array using such mounting

Also Published As

Publication number Publication date
DE60114859T2 (en) 2006-06-01
US7017651B1 (en) 2006-03-28
DE60114859D1 (en) 2005-12-15
EP1317774A2 (en) 2003-06-11
WO2002023966A2 (en) 2002-03-21
EP1317774B1 (en) 2005-11-09
WO2002023966A3 (en) 2002-05-30

Similar Documents

Publication Publication Date Title
AU2001290974A1 (en) Method and apparatus for temperature gradient control in an electronic system
AU2002327551A1 (en) Method and apparatus for managing components in an it system
WO2002022264A8 (en) Method and apparatus for gradient generation
AU2001233140A1 (en) System and method for efficiently performing scheduling operations in an electronic device
AU2001275970A1 (en) Method and apparatus for performing final critical dimension control
EP0726576A3 (en) Method and apparatus for pipelining data in an integrated circuit
AU2001249286A1 (en) Method and apparatus for cooling electronic enclosures
AU2001285399A1 (en) Method and apparatus for secure electronic payments
AU8336501A (en) Method and apparatus for controlling an electrochromic device
AU2568199A (en) System and method for dynamically updating features in an electronic imaging device
AU5222399A (en) Method and apparatus for three-dimensional input entry
AU2001267232A1 (en) Method and apparatus for improved process control in combustion applications
AU2216301A (en) Temperature controlling apparatus and method
AU2001255440A1 (en) Method and apparatus for making density gradients
AU2001272527A1 (en) Method and apparatus for ordering electronic data
AU2002359329A1 (en) Method and apparatus for temperature gradient microfluidics
AU2001231293A1 (en) System and method for drawing electronic images
AU2002243077A1 (en) Method and device for heater control in drying apparatus
AU2001260830A1 (en) Method and apparatus for providing an integrated loyalty system
GB2366628B (en) Method and apparatus for temperature control
AU2581501A (en) Method and apparatus for device input identification
EP1249987A4 (en) Data distribution control device and data distribution control method
AU2001259278A1 (en) Method and apparatus for diet control
AU7119998A (en) Method and apparatus for measuring temperature with an integrated circuit device
HK1034779A1 (en) Electronic apparatus and method for controlling electronic apparatus