DE3739585C1 - Cold plate for dissipating heat losses from large-scale-integrated electronic chips - Google Patents

Cold plate for dissipating heat losses from large-scale-integrated electronic chips

Info

Publication number
DE3739585C1
DE3739585C1 DE19873739585 DE3739585A DE3739585C1 DE 3739585 C1 DE3739585 C1 DE 3739585C1 DE 19873739585 DE19873739585 DE 19873739585 DE 3739585 A DE3739585 A DE 3739585A DE 3739585 C1 DE3739585 C1 DE 3739585C1
Authority
DE
Germany
Prior art keywords
cooling
integrated electronic
dissipating
cooling plate
scale
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE19873739585
Other languages
German (de)
Inventor
Otto Peternek
Dieter Schmalzl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Witzenmann GmbH
Original Assignee
Witzenmann GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Witzenmann GmbH filed Critical Witzenmann GmbH
Priority to DE19873739585 priority Critical patent/DE3739585C1/en
Application granted granted Critical
Publication of DE3739585C1 publication Critical patent/DE3739585C1/en
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/08—Tubular elements crimped or corrugated in longitudinal section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Rigid Pipes And Flexible Pipes (AREA)

Abstract

The invention relates to a cold plate for dissipating heat losses from large-scale-integrated electronic chips, into which meandering pipelines (cooling serpentine coils) are cast through which the coolant flows and which have points which cause turbulence. Such cooling serpentine coils have until now been produced from metal tubing. In consequence, the radius of curvature is limited and production is also complicated. For simplification, the invention proposes the use of a metal corrugated hose as the cooling serpentine coil. In consequence, the cooling serpentine coil now consists of only one part and the heat-dissipating surface of the meandering pipeline is at the same time considerably enlarged, so that, in consequence, manufacture is simplified and the cooling effect is enhanced. <IMAGE>

Description

Die Erfindung betrifft eine Kühlplatte zur Ableitung der Verlustwärme von hochintegrierten elektronischen Baustei­ nen, in die kühlmitteldurchflossene, mäanderförmige Lei­ tungen (Kühlschlangen) mit turbulenzverursachenden Stel­ len eingegossen sind. Solche Kühlplatten sind aus der EP 02 34 021 A1 bekannt.The invention relates to a cooling plate for deriving the Heat loss from highly integrated electronic components into the coolant-infused, meandering line lines (cooling coils) with turbulence-causing elements len are poured. Such cooling plates are from the EP 02 34 021 A1 known.

Für die Kühlung hochintegrierter elektronischer Bausteine werden zur Wärmeabführung der anfallenden Verlustleistung wasserdurchflossene Kühlplatten verwendet.For cooling highly integrated electronic components are used for heat dissipation of the power loss water-permeable cooling plates used.

Um einen hohen Wirkungsgrad der Wärmeabführung zu errei­ chen, soll auf engstem Raum innerhalb der Kühlplatte ein möglichst langes Leitungssystem (Kühlschlange) unterge­ bracht werden. Dabei ist von maßgeblicher Bedeutung, wie groß die mit der Kühlplatte verbundene Oberfläche der Kühlschlange ist. To achieve high heat dissipation efficiency Chen, should be in a confined space within the cooling plate pipe system (cooling coil) as long as possible be brought. It is essential how large the surface of the surface connected to the cooling plate Cooling coil is.  

Turbulenzen des Kühlmediums innerhalb der Kühlplatte wirken sich positiv aus und sollen deshalb bewußt verursacht werden. Derartige turbulenzverursachende Stellen können beispielsweise durch Einkerbungen der Rohrleitungen erzeugt werden.Turbulence of the cooling medium inside the cooling plate have a positive effect and should therefore be conscious caused. Such turbulence-causing Places can be created, for example, by indentations of the pipes are generated.

Bisher werden diese aus der Praxis bekannten Kühl­ platten durch in Metall eingegossene Kühlschlangen hergestellt. Diese Kühlschlangen sind wegen der en­ gen Aneinanderreihung aus vielen Einzelheiten, wie Rohren, Winkeln und Bogen aufgebaut. Die mit dem Gußmaterial in Verbindung tretende äußere Oberfläche ist maximal die gesamte Oberfläche der Rohre und Krümmer. Die Möglichkeiten zur Erzeugung von Turbu­ lenzen sind dabei begrenzt.So far, these are known from practice cooling plates through cooling coils cast in metal produced. These cooling coils are because of the order of many details, such as Pipes, angles and bends built up. The one with the Casting material contacting outer surface is a maximum of the entire surface of the pipes and Manifold. The possibilities of generating turbu Limits are limited.

Aufgabe der vorliegenden Erfindung ist es, eine Kühl­ platte zu schaffen, die bei optimaler Kühlwirkung eine einfache Fertigung gestattet.The object of the present invention is a cooling plate to create the optimal cooling effect simple manufacture allowed.

Zur Lösung dieser Aufgabe wird gemäß der Erfindung die Kühlplatte derart ausgebildet, daß die Kühl­ schlange aus einem Metallwellschlauch besteht.To solve this problem, according to the invention the cooling plate is designed such that the cooling snake consists of a corrugated metal hose.

Als Wellschläuche lassen sich dabei vorteilhaft Ring- oder Wendelwellschläuche verwenden.Can be advantageous as corrugated hoses Use ring or spiral corrugated hoses.

Durch diese Maßnahmen wird erreicht, daß die Kühl­ schlange aus einem einzigen Teil besteht und nicht mehr aus Einzelteilen zusammengesetzt werden muß. Sie kann zudem sehr eng gebogen werden. Die Ausschußrate verringert sich erheblich, und die gesamte Kühl­ platte ist dadurch einfacher herzustellen.These measures ensure that the cooling snake consists of a single part and not more must be assembled from individual parts. they can also be bent very closely. The reject rate  decreases significantly, and the overall cooling This makes plate easier to manufacture.

Da die Oberfläche der Kühlschlange wellenförmig ausgestaltet ist, ergibt sich eine erhebliche Ver­ größerung derselben, wodurch eine wesentlich bes­ sere Wärmeableitung möglich ist. Durch die balgför­ mige Faltung treten ohne zusätzliche Maßnahmen im Inneren der Kühlschlange Turbulenzen des Kühlmedi­ ums auf. Diese Turbulenzen tragen zu einer Verbes­ serung der Wärmeableitung bei.Because the surface of the cooling coil is wavy is designed, there is a considerable Ver enlargement of the same, whereby a substantially bes sere heat dissipation is possible. Through the bellows folding occur without additional measures in the Inside the cooling coil turbulence of the cooling medium around on. This turbulence contributes to a verb improvement of heat dissipation.

Ausführungsbeispiele der Erfindung werden anhand der Fig. 1 bis 5 näher erläutert. Es zeigt Embodiments of the invention are explained in more detail with reference to FIGS. 1 to 5. It shows

Fig. 1 eine Kühlplatte in schematischer Zeich­ nung; Fig. 1 is a cooling plate in a schematic drawing voltage;

Fig. 2 einen Ausschnitt aus einem Ringwellschlauch; Fig. 2 is a section of a corrugated hose;

Fig. 3 einen Ausschnitt aus einem Wendelwell­ schlauch; Fig. 3 shows a section of a Wendelwell hose;

Fig. 4 ein Ausführungsbeispiel der Kühl­ platte mit eingegossenen Buchsen für die Kühlmittelzu- bzw. -abführung; Figure 4 shows an embodiment of the cooling plate with cast bushings for the coolant supply and discharge.

Fig. 5 Einzelheiten an der Buchsenanbringstelle. Fig. 5 details at the socket attachment point.

In die Kühlplatte 1 nach Fig. 1 ist ein Wellenschlauch 2, der mäanderförmig geführt ist, eingegossen. An der Ein- und Ausflußstelle des Kühlmittels sind zudem später noch näher beschriebene Buchsen 4 angebracht. Die Kühlschlange ist dabei mit Gußmaterial 3 um­ geben.A corrugated hose 2 , which is guided in a meandering shape, is cast into the cooling plate 1 according to FIG. 1. At the point of inflow and outflow of the coolant, sleeves 4, which will be described later, are also attached. The cooling coil is with 3 to give cast material.

Fig. 2 zeigt einen Ringwellschlauch aus Metall, wobei die Vergrößerung der Oberfläche dieses Schlau­ ches durch seine Wellung deutlich zu erkennen ist. Fig. 2 shows a corrugated metal hose, the enlargement of the surface of this Schlau ches can be clearly recognized by its corrugation.

Ein weiteres Ausführungsbeispiel eines Metallwellschlauches ist in Fig. 3 in Form eines Wendelwellschlauches gezeigt, der ebenfalls eine Vergrößerung der Oberfläche ge­ gegenüber einem glatten Metallrohr erkennen läßt.Another embodiment of a corrugated metal hose is shown in Fig. 3 in the form of a spiral corrugated hose, which also shows an increase in the surface ge compared to a smooth metal tube.

Fig. 4 zeigt eine praktisch ausgeführte Platte. In ihrem Inneren nicht sichtbar befindet sich der mä­ anderförmig geführte Wellschlauch, der mit seinen beiden Enden an die Buchsen 4 geführt ist, die an den Eckseiten ebenfalls in die Platte eingegossen sind. Diese Buchsen bestehen, wie in Fig. 5 darge­ stellt, aus einem Anschlußteil 6, einem dahinter befindlichen Mehrkant, z. B. Vier- oder Sechskant­ teil 7, sowie einem Befestigungsteil für den Well­ schlauch 2. Durch die spezielle Konstruktion ist nach dem Eingießen der Buchse durch den Hinter­ schnitt aufgrund der Vier- bzw. Sechskantflächen eine formschlüssige Verbindung entstanden, welche das Einwirken von Kräften in jeder Richtung verhin­ dert. An dieser Buchse können sowohl der genannte Wellschlauch als auch die bereits bekannten Rohr­ leitungen angeschlossen werden. Fig. 4 shows a practical plate. Not visible in its interior is the meandering corrugated hose, which is guided with its two ends to the sockets 4 , which are also cast into the plate on the corner sides. These sockets consist, as shown in Fig. 5 Darge, from a connector 6 , a polygon behind it, z. B. square or hex part 7 , and a fastening part for the corrugated hose 2nd Due to the special construction, after the socket was poured in through the undercut, a positive connection was created due to the square or hexagonal surfaces, which prevented the action of forces in any direction. Both this corrugated hose and the already known pipe lines can be connected to this socket.

Claims (4)

1. Kühlplatte zur Ableitung der Verlustwärme von hochintegrierten elektronischen Bausteinen, in die kühlmitteldurchflossene, mäanderförmige Lei­ tungen (Kühlschlangen) mit turbulenzverursachenden Stellen eingegossen sind, dadurch ge­ kennzeichnet, daß die Kühlschlange aus einem Metallwellschlauch (2) besteht.1. Cooling plate for dissipating the heat loss from highly integrated electronic components, in the coolant-flow, meandering Lei lines (cooling coils) are poured with turbulence- causing points, characterized in that the cooling coil consists of a corrugated metal hose ( 2 ). 2. Kühlplatte zur Ableitung der Verlustwärme von hochintegrierten elektronischen Bausteinen nach An­ spruch 1, dadurch gekennzeich­ net, daß der Metallwellschlauch ein Ringwell­ schlauch ist.2. Cooling plate for dissipating the heat loss from highly integrated electronic components according to An saying 1, characterized net that the corrugated metal hose is a ring corrugation hose is. 3. Kühlplatte zur Ableitung der Verlustwärme von hochintegrierten elektronischen Bausteinen nach An­ spruch 1, dadurch gekennzeich­ net, daß der Metallwellschlauch ein Wendelwell­ schlauch ist. 3. Cooling plate for dissipating the heat loss from highly integrated electronic components according to An saying 1, characterized net that the corrugated metal hose is a spiral corrugation hose is.   4. Kühlplatte zur Ableitung der Verlustwärme von hochintegrierten elektronischen Bausteinen nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß an der Ein- bzw. Auslaßstelle des Kühlmittels in die Kühlplatte je­ weils eine Mehrkantbuchse (4) eingegossen ist, die an ihrer Vorderseite ein Anschlußventil (6) enthält und an ihrer Rückseite mit der Kühlschlange verbun­ den ist.4. Cooling plate for dissipating the heat loss from highly integrated electronic components according to one of the preceding claims, characterized in that a polygonal socket ( 4 ) is cast in each case at the inlet or outlet of the coolant in the cooling plate, which has a connection valve on its front side ( 6 ) contains and is connected to the cooling coil at the rear.
DE19873739585 1987-11-23 1987-11-23 Cold plate for dissipating heat losses from large-scale-integrated electronic chips Expired DE3739585C1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19873739585 DE3739585C1 (en) 1987-11-23 1987-11-23 Cold plate for dissipating heat losses from large-scale-integrated electronic chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19873739585 DE3739585C1 (en) 1987-11-23 1987-11-23 Cold plate for dissipating heat losses from large-scale-integrated electronic chips

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Publication Number Publication Date
DE3739585C1 true DE3739585C1 (en) 1989-05-11

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Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4322665A1 (en) * 1992-07-16 1994-01-20 Fuji Electric Co Ltd Cooling appts. for power semiconductor device e.g. in motor vehicle - has coolant passage contg. cooling plates which are alternately stacked with semiconductor elements and form coolant circuit
WO1997031512A1 (en) * 1996-02-24 1997-08-28 Daimler-Benz Aktiengesellschaft Cooling body for cooling power gates
WO2002023966A2 (en) * 2000-09-13 2002-03-21 Raytheon Company Method and apparatus for temperature gradient control in an electronic system
DE102007015859A1 (en) * 2007-04-02 2008-11-13 Reiner Dziadek Electronic assembly fluid cooling device, allows cooling medium to flow into closed system, which is hermetically sealed by jacket permanently, where cooling medium is conveyed by electromagnetic field
DE10108557B4 (en) * 2000-02-23 2009-01-15 Nec Corp. Semiconductor laser Cooler
DE102008050065A1 (en) 2008-10-01 2010-04-08 Reiner Dziadek Heat exchanger for cooling electrical component and modules or systems, particularly carrier plate or printed circuit board, is integrated in electrical printed circuit board
DE102010040582A1 (en) * 2010-09-10 2012-03-15 Continental Automotive Gmbh Housing for electronic circuit utilized for controlling e.g. occupant protection systems of motor car, has integrated coolant passages formed as cavities in base plates and/or slabs by injection molding method
DE102011076312A1 (en) * 2011-05-23 2012-11-29 Robert Bosch Gmbh Cooling device useful for housing, comprises a block of power electronics with a cooling structure to be encapsulated, which is supported by medium acting upon cooling structure to be encapsulated, and constitutes cooling surface of housing
EP2977705A1 (en) * 2014-07-22 2016-01-27 Hamilton Sundstrand Space Systems International, Inc. Heat transfer plate
WO2020058586A1 (en) * 2018-09-20 2020-03-26 Valeo Systemes Thermiques Compartment for a device for storing electrical energy for a motor vehicle
JP7333874B1 (en) 2021-10-11 2023-08-25 東芝三菱電機産業システム株式会社 electrical equipment
US11973238B2 (en) 2018-09-20 2024-04-30 Valeo Systemes Thermiques Compartment for a device for storing electrical energy for a motor vehicle

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0234021A1 (en) * 1986-01-16 1987-09-02 Siemens Aktiengesellschaft Liquid cooling device for an electric component, in particular semiconductor component

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0234021A1 (en) * 1986-01-16 1987-09-02 Siemens Aktiengesellschaft Liquid cooling device for an electric component, in particular semiconductor component

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4322665A1 (en) * 1992-07-16 1994-01-20 Fuji Electric Co Ltd Cooling appts. for power semiconductor device e.g. in motor vehicle - has coolant passage contg. cooling plates which are alternately stacked with semiconductor elements and form coolant circuit
WO1997031512A1 (en) * 1996-02-24 1997-08-28 Daimler-Benz Aktiengesellschaft Cooling body for cooling power gates
US6089314A (en) * 1996-02-24 2000-07-18 Daimler-Benz Aktiengesellschaft Cooling body for cooling power gates
DE10108557B4 (en) * 2000-02-23 2009-01-15 Nec Corp. Semiconductor laser Cooler
WO2002023966A2 (en) * 2000-09-13 2002-03-21 Raytheon Company Method and apparatus for temperature gradient control in an electronic system
WO2002023966A3 (en) * 2000-09-13 2002-05-30 Raytheon Co Method and apparatus for temperature gradient control in an electronic system
DE102007015859A1 (en) * 2007-04-02 2008-11-13 Reiner Dziadek Electronic assembly fluid cooling device, allows cooling medium to flow into closed system, which is hermetically sealed by jacket permanently, where cooling medium is conveyed by electromagnetic field
DE102007015859B4 (en) * 2007-04-02 2009-02-19 Reiner Dziadek Heat exchanger, a cooling arrangement with the heat exchanger, as well as its use and cooling method
DE102008050065A1 (en) 2008-10-01 2010-04-08 Reiner Dziadek Heat exchanger for cooling electrical component and modules or systems, particularly carrier plate or printed circuit board, is integrated in electrical printed circuit board
DE102010040582A1 (en) * 2010-09-10 2012-03-15 Continental Automotive Gmbh Housing for electronic circuit utilized for controlling e.g. occupant protection systems of motor car, has integrated coolant passages formed as cavities in base plates and/or slabs by injection molding method
DE102011076312A1 (en) * 2011-05-23 2012-11-29 Robert Bosch Gmbh Cooling device useful for housing, comprises a block of power electronics with a cooling structure to be encapsulated, which is supported by medium acting upon cooling structure to be encapsulated, and constitutes cooling surface of housing
EP2977705A1 (en) * 2014-07-22 2016-01-27 Hamilton Sundstrand Space Systems International, Inc. Heat transfer plate
WO2020058586A1 (en) * 2018-09-20 2020-03-26 Valeo Systemes Thermiques Compartment for a device for storing electrical energy for a motor vehicle
FR3086220A1 (en) * 2018-09-20 2020-03-27 Valeo Systemes Thermiques COMPARTMENT FOR ELECTRICAL ENERGY STORAGE DEVICE FOR MOTOR VEHICLE
CN112889177A (en) * 2018-09-20 2021-06-01 法雷奥热系统公司 Compartment for a device for storing electric energy for a motor vehicle
US11973238B2 (en) 2018-09-20 2024-04-30 Valeo Systemes Thermiques Compartment for a device for storing electrical energy for a motor vehicle
JP7333874B1 (en) 2021-10-11 2023-08-25 東芝三菱電機産業システム株式会社 electrical equipment

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