DE102008050065A1 - Heat exchanger for cooling electrical component and modules or systems, particularly carrier plate or printed circuit board, is integrated in electrical printed circuit board - Google Patents

Heat exchanger for cooling electrical component and modules or systems, particularly carrier plate or printed circuit board, is integrated in electrical printed circuit board Download PDF

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Publication number
DE102008050065A1
DE102008050065A1 DE200810050065 DE102008050065A DE102008050065A1 DE 102008050065 A1 DE102008050065 A1 DE 102008050065A1 DE 200810050065 DE200810050065 DE 200810050065 DE 102008050065 A DE102008050065 A DE 102008050065A DE 102008050065 A1 DE102008050065 A1 DE 102008050065A1
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DE
Germany
Prior art keywords
heat exchanger
circuit board
printed circuit
cooling
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE200810050065
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German (de)
Inventor
Reiner Dziadek
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Individual
Original Assignee
Individual
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Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE200810050065 priority Critical patent/DE102008050065A1/en
Publication of DE102008050065A1 publication Critical patent/DE102008050065A1/en
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The heat exchanger (1) is integrated in an electrical printed circuit board, and is conducted in a laminar manner. A surface is utilized as a thermal contact surface, which is connected with a heating source (6) that has to be cooled. A base body is provided with channels for guiding a cooling medium (11).

Description

Die Erfindung betrifft eine Anordnung zur Entwärmung elektrischer und/oder elektronischer Baugruppen und Bausystemen, welches ein IT-System, ein Telekommunikationssystem, ein leistungselektronisches System, ein nachrichtentechnisches System, ein medizintechnisches System oder ein medientechnisches System sein kann. Weiterhin betrifft sie einen Wärmetauscher sowie dessen Verwendung und ein Kühlverfahren.The The invention relates to an arrangement for cooling electrical and / or electronic assemblies and building systems, which include IT system, a telecommunication system, a power electronic System, a telecommunications system, a medical device System or a media technology system. Furthermore They have a heat exchanger and its use and a Cooling methods.

Vorrichtungen zur Entwärmung von elektrischen und/oder elektronischen Baugruppen und Bausystemen sind aus DE 44 27 947 A1 , DE 10 2004 019 382 A1 , DE 696 26 662 T2 , DE 37 39 585 C1 , DE 202 00 484 U1 bekannt.Devices for cooling of electrical and / or electronic assemblies and building systems are out DE 44 27 947 A1 . DE 10 2004 019 382 A1 . DE 696 26 662 T2 . DE 37 39 585 C1 . DE 202 00 484 U1 known.

Die hier beschriebene Erfindung unterscheidet sich auf Grund folgender Merkmale. Der Wärmetauscher ist vorgefertigt und wir vollständig in die Leiterplatte integriert. Weiterhin ist er durch Bauart und Ausführung mit der nach Stand der Technik angewandten Fertigungstechnologie kompatibel.The The invention described herein differs based on the following Characteristics. The heat exchanger is prefabricated and we complete integrated into the printed circuit board. Furthermore, he is by design and execution with the state-of-the-art manufacturing technology compatible.

Auf Grund dieser Merkmale weist die vorliegende Erfindung bezüglich der Integration und der Leistungseffizienz gegenüber üblichen Kühlanordnungen Vorteile auf.On Reason of these features, the present invention with respect the integration and the power efficiency compared to usual Cooling arrangements advantages.

Die Erfindung wird anhand des folgenden Ausführungsbeispiels erläutert.The Invention will become apparent from the following embodiment explained.

Der Wärmetauscher 1 besteht aus einem Grundkörper, welcher mit Kanälen für die Führung des Kühlmediums 11 versehen ist. Dadurch wird der Grundkörper zu einem Kühlkörper. Der Kühlkörper übernimmt nun die Funktion des Wärmetauschers 1. Die Oberfläche des Kühlkörpers 1 dient als thermische Kontaktfläche für die zu kühlenden Wärmequellen 6. Der Wärmefluss erfolgt durch Wärmeleitung von der Wärmequelle 6 über das Kupfer zur Wärmespreizung zum Bauelement 5, die Lötverbindung 4, das Kupfer der Leiterplatte, sowie über das Basismaterial 2 und/oder Prepreg 10 zur Oberfläche des Wärmetauschers 1.The heat exchanger 1 consists of a body, which with channels for the guidance of the cooling medium 11 is provided. As a result, the main body becomes a heat sink. The heat sink now takes over the function of the heat exchanger 1 , The surface of the heat sink 1 serves as a thermal contact surface for the heat sources to be cooled 6 , The heat flow takes place by heat conduction from the heat source 6 over the copper for heat spreading to the component 5 , the solder joint 4 , the copper of the circuit board, as well as the base material 2 and / or prepreg 10 to the surface of the heat exchanger 1 ,

Durch Einsatz von so genannten thermischen Durchkontaktierungen 9 kann die Wärmeanbindung mit verbessert werden. Weiterhin kann der Wärmetauscher perforiert ausgeführt werden. Dies erlaubt die Herstellung von elektrischen Durchkontaktierungen 12. Je nach Anwendung kann die Perforierung so gestaltet werden, dass die thermische Anbindung der Wärmequelle 6 mittels den thermischen Durchkontaktierungen 9 optimal ist, bei gleichzeitiger Beibehaltung der Realisierungsmöglichkeiten für die Herstellung der elektrischen Durchkontaktierungen 12.By use of so-called thermal vias 9 the heat connection can be improved with. Furthermore, the heat exchanger can be perforated. This allows the production of electrical feedthroughs 12 , Depending on the application, the perforation can be designed so that the thermal connection of the heat source 6 by means of the thermal vias 9 is optimal, while maintaining the implementation options for the production of electrical feedthroughs 12 ,

Das Kühlmedium 11 transportiert die aufgenommene Wärme der Wärmequelle 6 über ein Rohr- oder Schlauchsystem zu einem räumlich entfernten Sekundärwärmetauscher. Dieses Rohr- oder Schlauchsystem wird nach Fertigung der Einheit Kühlkörper Leiterplatte durch hierzu vorgesehene Anbindungspunkte hergestellt. Anwendungsabhängig gibt der Sekundärwärmetauscher die Wärme an die Umgebung oder an einen sekundären Kühlkreislauf ab.The cooling medium 11 transports the absorbed heat of the heat source 6 via a pipe or hose system to a remote secondary heat exchanger. This tube or tube system is made by manufacturing the unit heatsink PCB through connection points provided for this purpose. Depending on the application, the secondary heat exchanger releases the heat to the environment or to a secondary cooling circuit.

11
Wärmetauschergehäuseheat exchanger housing
22
Leiterplatten BasismaterialPCBs base material
33
Kupferkaschierung sowie galvanisch hergestellte Aufkupferungcopper cladding as well as electroplated copper
44
Lötverbindungsolder
55
Kupfer zur Wärmespreizung im Bauelement (Cu)copper for heat dissipation in the component (Cu)
66
Wärmequelleheat source
77
Bauelementgehäusecomponent housing
88th
Anschlussginconnection pin
99
Galvanisch hergestellte Durchkontaktierung zur Herstellung eines thermischen Kontaktsgalvanic produced through-hole for the production of a thermal contact
1010
Prepregprepreg
1111
Kühlmediumcooling medium
1212
Galvanisch hergestellte Durchkontaktierung zur Herstellung eines elektrischen Kontaktsgalvanic manufactured via for the production of an electrical contact

ZITATE ENTHALTEN IN DER BESCHREIBUNGQUOTES INCLUDE IN THE DESCRIPTION

Diese Liste der vom Anmelder aufgeführten Dokumente wurde automatisiert erzeugt und ist ausschließlich zur besseren Information des Lesers aufgenommen. Die Liste ist nicht Bestandteil der deutschen Patent- bzw. Gebrauchsmusteranmeldung. Das DPMA übernimmt keinerlei Haftung für etwaige Fehler oder Auslassungen.This list The documents listed by the applicant have been automated generated and is solely for better information recorded by the reader. The list is not part of the German Patent or utility model application. The DPMA takes over no liability for any errors or omissions.

Zitierte PatentliteraturCited patent literature

  • - DE 4427947 A1 [0002] - DE 4427947 A1 [0002]
  • - DE 102004019382 A1 [0002] DE 102004019382 A1 [0002]
  • - DE 69626662 T2 [0002] - DE 69626662 T2 [0002]
  • - DE 3739585 C1 [0002] - DE 3739585 C1 [0002]
  • - DE 20200484 U1 [0002] - DE 20200484 U1 [0002]

Claims (10)

Ein in eine elektrische Leiterplatte vollständig integrierter Wärmetauscher zum Kühlen von elektrischen Bauelementen. wobei der Wärmetauscher (1) flächig ausgeführt ist und zumindest eine Fläche als thermische Kontaktfläche genutzt wird, die mit den zu kühlenden Wärmequellen (6) verbunden ist; wobei der Grundkörper mit Kanälen für die Führung des Kühlmediums (11) versehen ist;A fully integrated in an electrical circuit board heat exchanger for cooling electrical components. the heat exchanger ( 1 ) is executed flat and at least one area is used as a thermal contact surface with the heat sources to be cooled ( 6 ) connected is; wherein the main body with channels for the guidance of the cooling medium ( 11 ) is provided; Wärmetauscher (1) nach Anspruch 1 dadurch gekennzeichnet, dass der Wärmetauscher (1) aus wärmeleitenden Material gebildet ist.Heat exchanger ( 1 ) according to claim 1, characterized in that the heat exchanger ( 1 ) is formed of thermally conductive material. Wärmetauscher nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass der Wärmetauscher (1) aus Kupfer ausgebildet ist.Heat exchanger according to one of the preceding claims, characterized in that the heat exchanger ( 1 ) is formed of copper. Wärmetauscher nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die thermische Anbindung durch Verwendung so genannter thermischer Durchkontaktierungen (9) verbessert wird.Heat exchanger according to one of the preceding claims, characterized in that the thermal connection by use of so-called thermal vias ( 9 ) is improved. Wärmetauscher nach Anspruch 3, dadurch gekennzeichnet, dass das Kühlmedium führende System (11) ein Rohr ist.Heat exchanger according to claim 3, characterized in that the cooling medium leading system ( 11 ) is a pipe. Wärmetauscher nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Kühlmedium führende System (11) aus zusammengesetzten Flachprofilen gebildet ist.Heat exchanger according to one of the preceding claims, characterized in that the cooling medium leading system ( 11 ) is formed from composite flat profiles. Wärmetauscher nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass dieser perforiert ausgeführt ist.Heat exchanger according to one of the preceding Claims, characterized in that this perforated is executed. Verwendung des Wärmetauschers nach einem der Ansprüche 1 bis 7, zum Kühlen von elektrischen Bauelementen, Baugruppen oder Systemen.Use of the heat exchanger after one of claims 1 to 7, for cooling electrical Components, assemblies or systems. Verwendung nach Anspruch 8 dadurch gekennzeichnet, dass das zu kühlende System eine Trägerplatte für wärmeemittierende Elemente ist. Use according to claim 8, characterized that the system to be cooled is a carrier plate for heat emitting elements. Verwendung nach Anspruch 8 dadurch gekennzeichnet, dass das zu kühlende System eine Leiterplatte für elektrische Bauelemente ist.Use according to claim 8, characterized that the system to be cooled a circuit board for electrical components is.
DE200810050065 2008-10-01 2008-10-01 Heat exchanger for cooling electrical component and modules or systems, particularly carrier plate or printed circuit board, is integrated in electrical printed circuit board Ceased DE102008050065A1 (en)

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DE200810050065 DE102008050065A1 (en) 2008-10-01 2008-10-01 Heat exchanger for cooling electrical component and modules or systems, particularly carrier plate or printed circuit board, is integrated in electrical printed circuit board

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DE200810050065 DE102008050065A1 (en) 2008-10-01 2008-10-01 Heat exchanger for cooling electrical component and modules or systems, particularly carrier plate or printed circuit board, is integrated in electrical printed circuit board

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11602044B2 (en) 2020-07-30 2023-03-07 Toyota Motor Engineering & Manufacturing North America, Inc. Driver board assemblies and methods of forming the same

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3739585C1 (en) 1987-11-23 1989-05-11 Witzenmann Metallschlauchfab Cold plate for dissipating heat losses from large-scale-integrated electronic chips
US4938280A (en) * 1988-11-07 1990-07-03 Clark William E Liquid-cooled, flat plate heat exchanger
DE4427947A1 (en) 1994-08-06 1996-02-08 Nickel Gmbh Heinrich Electronic and electrical racking system for heat removal from digital data processing system
DE20200484U1 (en) 2002-01-14 2002-06-20 Mueller Arnold Gmbh Co Kg Cooling device for components, in particular for electrical or electronic components, such as converters or the like.
US20020185718A1 (en) * 2001-03-13 2002-12-12 Kazuyuki Mikubo Semiconductor device packaging structure
DE69626662T2 (en) 1995-10-24 2004-04-22 Aavid Thermal Products, Inc. LIQUID-COOLED HEAT SINK FOR COOLING ELECTRONIC COMPONENTS
DE102004019382A1 (en) 2004-04-19 2005-11-03 Rittal Gmbh & Co. Kg Mounting plate for electronic components

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3739585C1 (en) 1987-11-23 1989-05-11 Witzenmann Metallschlauchfab Cold plate for dissipating heat losses from large-scale-integrated electronic chips
US4938280A (en) * 1988-11-07 1990-07-03 Clark William E Liquid-cooled, flat plate heat exchanger
DE4427947A1 (en) 1994-08-06 1996-02-08 Nickel Gmbh Heinrich Electronic and electrical racking system for heat removal from digital data processing system
DE69626662T2 (en) 1995-10-24 2004-04-22 Aavid Thermal Products, Inc. LIQUID-COOLED HEAT SINK FOR COOLING ELECTRONIC COMPONENTS
US20020185718A1 (en) * 2001-03-13 2002-12-12 Kazuyuki Mikubo Semiconductor device packaging structure
DE20200484U1 (en) 2002-01-14 2002-06-20 Mueller Arnold Gmbh Co Kg Cooling device for components, in particular for electrical or electronic components, such as converters or the like.
DE102004019382A1 (en) 2004-04-19 2005-11-03 Rittal Gmbh & Co. Kg Mounting plate for electronic components

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11602044B2 (en) 2020-07-30 2023-03-07 Toyota Motor Engineering & Manufacturing North America, Inc. Driver board assemblies and methods of forming the same

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