DE102015205332A1 - Translucent boards equipped with LED and / or heat sinks - Google Patents
Translucent boards equipped with LED and / or heat sinks Download PDFInfo
- Publication number
- DE102015205332A1 DE102015205332A1 DE102015205332.6A DE102015205332A DE102015205332A1 DE 102015205332 A1 DE102015205332 A1 DE 102015205332A1 DE 102015205332 A DE102015205332 A DE 102015205332A DE 102015205332 A1 DE102015205332 A1 DE 102015205332A1
- Authority
- DE
- Germany
- Prior art keywords
- carrier body
- led
- ceramic
- translucent
- heat sinks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/86—Ceramics or glass
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2109/00—Light sources with light-generating elements disposed on transparent or translucent supports or substrates
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
Die Erfindung betrifft einen keramischen Trägerkörper (1) auf dessen Oberfläche einseitig oder mehrseitig versinterte Metallisierungsbereiche (2) als Leiterbahnen aufgebracht sind und der Trägerkörper (1) eine Platine ist, wobei auf dem Trägerkörper (1) zumindest eine LED (3) und gegebenfalls andere elektrische oder elektronische Bauelemente angeordnet sind. Damit der Trägerkörper (1) das Licht der LED´s (3) in allen Raumrichtungen abstrahlt, im Hochleistungsbereich (ab etwa 0,8 W pro LED) einsetzbar ist und eine Wärmeleitfähigkeit größer als 10 W/mK aufweist, wird vorgeschlagen, dass der keramische Trägerkörper (1) eine transluzente Keramik ist.The invention relates to a ceramic carrier body (1) on the surface of one or more sides sintered metallization regions (2) are applied as conductor tracks and the carrier body (1) is a circuit board, wherein on the carrier body (1) at least one LED (3) and optionally other electrical or electronic components are arranged. So that the carrier body (1) emits the light of the LEDs (3) in all spatial directions, in the high power range (from about 0.8 W per LED) can be used and has a thermal conductivity greater than 10 W / mK, it is proposed that the ceramic carrier body (1) is a translucent ceramic.
Description
Die Erfindung betrifft einen keramischen Trägerkörper auf dessen Oberfläche einseitig oder mehrseitig versinterte Metallisierungsbereiche als Leiterbahnen aufgebracht sind und der Trägerkörper eine Platine ist, wobei auf dem Trägerkörper zumindest eine LED und gegebenfalls andere elektrische oder elektronische Bauelemente angeordnet sind, deren Anschlusselemente mit den Leiterbahnen elektrisch verbunden sind.The invention relates to a ceramic carrier body on whose surface single-sided or multi-sided sintered metallization regions are applied as conductor tracks and the carrier body is a circuit board, wherein on the carrier body at least one LED and optionally other electrical or electronic components are arranged, the connection elements are electrically connected to the conductor tracks ,
Ein derartiger Trägerkörper ist in der
Der Erfindung liegt die Aufgabe zugrunde, einen Trägerkörper nach dem Oberbegriff des Anspruchs 1 so weiterzubilden, dass er das Licht der LED´s in allen Raumrichtungen abstrahlt, im Hochleistungsbereich (ab etwa 0,8 W pro LED) einsetzbar ist und eine Wärmeleitfähigkeit größer als 10 W/mK aufweist. Transluzente Gläser eignen sich nicht als Trägerkörper, da deren Wärmeleitfähigkeiten zu niedrig sind.The invention has the object of developing a carrier body according to the preamble of claim 1 so that it emits the light of the LED's in all directions, in the high power range (from about 0.8 W per LED) can be used and a thermal conductivity greater than 10 W / mK. Translucent glasses are not suitable as carrier bodies because their thermal conductivities are too low.
Erfindungsgemäß wird diese Aufgabe durch die Merkmale des Anspruchs 1 gelöst.According to the invention, this object is solved by the features of claim 1.
Dadurch, dass der keramische Trägerkörper eine transluzente Keramik ist, strahlt er das Licht der LED´s in allen Raumrichtungen ab, ist im Hochleistungsbereich (ab etwa 0,8 W pro LED) einsetzbar und weist eine Wärmeleitfähigkeit größer als 10 W/mK auf.Because the ceramic carrier body is a translucent ceramic, it emits the light of the LEDs in all spatial directions, can be used in the high-power range (from about 0.8 W per LED) and has a thermal conductivity greater than 10 W / mK.
Transluzente Keramiken werden zum Beispiel beschrieben in
In einer Ausführungsform kann der Trägerkörper einstückig mit Kühlrippen verbunden sein oder aber plattenförmig ausgebildet sein. Wenn der Trägerkörper einstückig mit Kühlrippen verbunden ist, spricht man auch von einem dreidimensionalen Trägerkörper im Gegensatz zu einem plattenförmigen, zweidimensionalen Trägerkörper.In one embodiment, the carrier body may be integrally connected to cooling fins or formed plate-shaped. When the carrier body is integrally connected with cooling fins, one speaks of a three-dimensional carrier body in contrast to a plate-shaped, two-dimensional carrier body.
Bevorzugt bestehen die Metallisierungsbereiche aus Silber-Platin.The metallization regions preferably consist of silver-platinum.
Zur Abführung der von den LED´s erzeugten Wärme ist in einer Ausführungsvariante der Trägerkörper flüssigkeitsgekühlt oder wird über natürliche oder erzwungene Konvektion gekühlt. So ist zum Beispiel eine Kühlung mit Heatpipes vorteilhaft.In order to dissipate the heat generated by the LEDs, in one embodiment the carrier body is liquid-cooled or is cooled by natural or forced convection. For example, cooling with heat pipes is advantageous.
Eine erfindungsgemäße Verwendung zeichnet sich dadurch aus, dass eine transluzente Keramik für einen erfindungsgemäßen Trägerkörper verwendet wird.A use according to the invention is characterized in that a translucent ceramic is used for a carrier body according to the invention.
Die Erfindung beschreibt somit zwei- oder dreidimensionale keramische Trägerkörper, auch Boards genannt, auf Basis transluzenter Keramik (auch bekannt unter der Bezeichnung PERLUCOR). Diese können direkt einseitig oder mehrseitig metallisiert werden (z.B. mit Silber-Piatin-Leiterbahnen im Siebdruck, mit nachfolgendem Einbrand). Anschließend erfolgt die Bestückung mit elektrischen oder elektronischen Komponenten oder Bauteilen, darunter LED´s. Die Boards können flüssigkeitsgekühlt oder über natürliche oder erzwungene Konvektion gekühlt sein. The invention thus describes two- or three-dimensional ceramic carrier bodies, also called boards, based on translucent ceramic (also known as PERLUCOR). These can be metallized directly on one side or on several sides (for example with silver-platinum printed conductors with screen printing, with subsequent penetration). Subsequently, the assembly is carried out with electrical or electronic components or components, including LEDs. The boards may be liquid cooled or cooled by natural or forced convection.
Diese Boards sind natürlich für jede Leistungsklasse von LED´s verwendbar.These boards are of course usable for every power class of LEDs.
Nachfolgend wird die Erfindung anhand einer Figur weiter erläutert.The invention will be further explained with reference to a figure.
Durch die versinterten Metallisierungsbereiche
Durch die Verwendung von transluzenter Keramik als Werkstoff für den Trägerkörper
ZITATE ENTHALTEN IN DER BESCHREIBUNG QUOTES INCLUDE IN THE DESCRIPTION
Diese Liste der vom Anmelder aufgeführten Dokumente wurde automatisiert erzeugt und ist ausschließlich zur besseren Information des Lesers aufgenommen. Die Liste ist nicht Bestandteil der deutschen Patent- bzw. Gebrauchsmusteranmeldung. Das DPMA übernimmt keinerlei Haftung für etwaige Fehler oder Auslassungen.This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.
Zitierte PatentliteraturCited patent literature
- WO 2007107601 A1 [0002] WO 2007107601 A1 [0002]
- DE 102013226579 A [0006] DE 102013226579 A [0006]
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015205332.6A DE102015205332A1 (en) | 2014-03-28 | 2015-03-24 | Translucent boards equipped with LED and / or heat sinks |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102014205834 | 2014-03-28 | ||
DE102014205834.1 | 2014-03-28 | ||
DE102015205332.6A DE102015205332A1 (en) | 2014-03-28 | 2015-03-24 | Translucent boards equipped with LED and / or heat sinks |
Publications (1)
Publication Number | Publication Date |
---|---|
DE102015205332A1 true DE102015205332A1 (en) | 2015-10-01 |
Family
ID=52807789
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102015205332.6A Withdrawn DE102015205332A1 (en) | 2014-03-28 | 2015-03-24 | Translucent boards equipped with LED and / or heat sinks |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP3123841A1 (en) |
DE (1) | DE102015205332A1 (en) |
TW (1) | TW201601264A (en) |
WO (1) | WO2015144717A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102019135408B3 (en) * | 2019-12-20 | 2021-01-07 | Audi Ag | Light arrangement for a motor vehicle and motor vehicle |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007107601A2 (en) | 2006-03-23 | 2007-09-27 | Ceramtec Ag | Carrier body for components or circuits |
DE102013226579A1 (en) | 2012-12-19 | 2014-06-26 | Ceramtec-Etec Gmbh | Ceramic material |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005013884A1 (en) * | 2005-03-24 | 2006-09-28 | Irlbacher Blickpunkt Glas Gmbh | control panel |
US8541805B2 (en) * | 2010-05-13 | 2013-09-24 | Panasonic Corporation | Mounting substrate and manufacturing method thereof, light-emitting module and illumination device |
CN103069593A (en) * | 2010-10-22 | 2013-04-24 | 松下电器产业株式会社 | Mounting board, light emitting device and lamp |
JP2012094678A (en) * | 2010-10-27 | 2012-05-17 | Kyocera Corp | Light emitting device |
-
2015
- 2015-03-24 WO PCT/EP2015/056278 patent/WO2015144717A1/en active Application Filing
- 2015-03-24 DE DE102015205332.6A patent/DE102015205332A1/en not_active Withdrawn
- 2015-03-24 EP EP15712345.6A patent/EP3123841A1/en not_active Withdrawn
- 2015-03-27 TW TW104109878A patent/TW201601264A/en unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007107601A2 (en) | 2006-03-23 | 2007-09-27 | Ceramtec Ag | Carrier body for components or circuits |
DE102013226579A1 (en) | 2012-12-19 | 2014-06-26 | Ceramtec-Etec Gmbh | Ceramic material |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102019135408B3 (en) * | 2019-12-20 | 2021-01-07 | Audi Ag | Light arrangement for a motor vehicle and motor vehicle |
US11267390B2 (en) | 2019-12-20 | 2022-03-08 | Audi Ag | Lamp arrangement for a motor vehicle, and motor vehicle |
Also Published As
Publication number | Publication date |
---|---|
TW201601264A (en) | 2016-01-01 |
WO2015144717A1 (en) | 2015-10-01 |
EP3123841A1 (en) | 2017-02-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |