DE60112481D1 - Verfahren zur Herstellung von Material zur Herstellung von isolierenden Filmen - Google Patents
Verfahren zur Herstellung von Material zur Herstellung von isolierenden FilmenInfo
- Publication number
- DE60112481D1 DE60112481D1 DE60112481T DE60112481T DE60112481D1 DE 60112481 D1 DE60112481 D1 DE 60112481D1 DE 60112481 T DE60112481 T DE 60112481T DE 60112481 T DE60112481 T DE 60112481T DE 60112481 D1 DE60112481 D1 DE 60112481D1
- Authority
- DE
- Germany
- Prior art keywords
- production
- curable composition
- insulating films
- polymer compound
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/02—Organic and inorganic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/32—Post-polymerisation treatment
- C08G77/34—Purification
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/442—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from aromatic vinyl compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Paints Or Removers (AREA)
- Formation Of Insulating Films (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000007385A JP2001089661A (ja) | 1999-07-16 | 2000-01-17 | 硬化性組成物およびその製造方法 |
JP2000007385 | 2000-01-17 | ||
JP2000175684A JP3669250B2 (ja) | 2000-06-12 | 2000-06-12 | 膜形成用組成物の製造方法およびそれにより得られる膜形成用組成物 |
JP2000175684 | 2000-06-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60112481D1 true DE60112481D1 (de) | 2005-09-15 |
DE60112481T2 DE60112481T2 (de) | 2006-05-18 |
Family
ID=26583602
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60112481T Expired - Lifetime DE60112481T2 (de) | 2000-01-17 | 2001-01-16 | Verfahren zur Herstellung von Material zur Herstellung von isolierenden Filmen |
Country Status (6)
Country | Link |
---|---|
US (1) | US6642352B2 (de) |
EP (1) | EP1117102B1 (de) |
KR (1) | KR100677782B1 (de) |
AT (1) | ATE301866T1 (de) |
DE (1) | DE60112481T2 (de) |
TW (1) | TWI275606B (de) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002285086A (ja) * | 2001-03-26 | 2002-10-03 | Jsr Corp | 膜形成用組成物、膜の形成方法およびシリカ系膜 |
KR101227664B1 (ko) * | 2002-01-31 | 2013-01-29 | 도소 가부시키가이샤 | 유기실란화합물을 포함하여 구성되는 절연막용 재료, 그 제조방법 및 반도체장치 |
US7122880B2 (en) | 2002-05-30 | 2006-10-17 | Air Products And Chemicals, Inc. | Compositions for preparing low dielectric materials |
JP2004165613A (ja) * | 2002-06-03 | 2004-06-10 | Shipley Co Llc | 電子デバイスの製造 |
US7655365B2 (en) * | 2002-07-01 | 2010-02-02 | Dai Nippon Printing Co., Ltd. | Wettability variable substrate and wettability variable layer forming composition |
US7833957B2 (en) * | 2002-08-22 | 2010-11-16 | Daikin Industries, Ltd. | Removing solution |
WO2004087793A1 (ja) * | 2003-03-28 | 2004-10-14 | Pi R & D Co. Ltd. | 架橋ポリイミド、それを含む組成物及びその製造方法 |
US20050260420A1 (en) * | 2003-04-01 | 2005-11-24 | Collins Martha J | Low dielectric materials and methods for making same |
US7462678B2 (en) * | 2003-09-25 | 2008-12-09 | Jsr Corporation | Film forming composition, process for producing film forming composition, insulating film forming material, process for forming film, and silica-based film |
US20050089642A1 (en) * | 2003-10-28 | 2005-04-28 | Rohm And Haas Electronic Materials, L.L.C. | Dielectric materials preparation |
JP2005133060A (ja) * | 2003-10-29 | 2005-05-26 | Rohm & Haas Electronic Materials Llc | 多孔性材料 |
JP4894153B2 (ja) * | 2005-03-23 | 2012-03-14 | 株式会社アルバック | 多孔質膜の前駆体組成物及びその調製方法、多孔質膜及びその作製方法、並びに半導体装置 |
DE102005060649A1 (de) * | 2005-12-19 | 2007-06-21 | Wacker Chemie Ag | Vernetzbare Massen auf der Basis von Organosiliciumverbindungen |
JP5030478B2 (ja) * | 2006-06-02 | 2012-09-19 | 株式会社アルバック | 多孔質膜の前駆体組成物及びその調製方法、多孔質膜及びその作製方法、並びに半導体装置 |
JP2008013623A (ja) * | 2006-07-04 | 2008-01-24 | Shin Etsu Chem Co Ltd | 光関連デバイス封止用樹脂組成物およびその硬化物 |
WO2010050491A1 (ja) * | 2008-10-31 | 2010-05-06 | 宇部興産株式会社 | ポリイミド前駆体溶液組成物 |
KR101597478B1 (ko) * | 2012-01-20 | 2016-02-24 | 아사히 가세이 이-매터리얼즈 가부시키가이샤 | 수지 조성물, 적층체, 다층 프린트 배선판 및 다층 플렉시블 배선판 및 그 제조 방법 |
CN104487484B (zh) * | 2012-06-26 | 2020-07-31 | 三菱化学株式会社 | 高分子化合物的制造方法及高分子化合物 |
JP6526894B1 (ja) * | 2018-09-20 | 2019-06-05 | 日東電工株式会社 | 分離膜 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2802820A (en) | 1953-02-18 | 1957-08-13 | Atlas Powder Co | Condensation products of secondary hexityl amines, formaldehyde and phenols |
US2839506A (en) | 1953-11-16 | 1958-06-17 | American Cyanamid Co | Antistatic treatment for hydrophobic synthetic fiber-containing materials |
CA1044537A (en) | 1973-05-09 | 1978-12-19 | Amf Incorporated | Filter medium and process |
GB2098590B (en) * | 1979-03-01 | 1983-08-03 | Amf Inc | Filter aid |
US4684697A (en) * | 1985-04-30 | 1987-08-04 | Ppg Industries, Inc. | Compositions based on silane hydrolyzates and vinyl polymers containing hydrolyzable silyl groups |
JPS6317486A (ja) | 1986-07-09 | 1988-01-25 | 沖電気工業株式会社 | サンゴ型イルミネ−シヨン体の製造方法 |
US5236970A (en) * | 1987-02-05 | 1993-08-17 | Allergan, Inc. | Optically clear reinforced silicone elastomers of high optical refractive index and improved mechanical properties for use in intraocular lenses |
US5212050A (en) * | 1988-11-14 | 1993-05-18 | Mier Randall M | Method of forming a permselective layer |
US5128041A (en) * | 1991-05-15 | 1992-07-07 | Pall Corporation | Microporous membrane, method of manufacture, and method of use |
JPH06287303A (ja) * | 1993-03-31 | 1994-10-11 | Hitachi Chem Co Ltd | 高純度ラダーシリコーンポリマ溶液の製造法及び塗布液 |
JP3363051B2 (ja) * | 1997-02-21 | 2003-01-07 | 丸善石油化学株式会社 | ビニルフェノール系重合体の金属除去法 |
TW420770B (en) * | 1998-09-22 | 2001-02-01 | Mitsui Chemicals Inc | Pellicle film, method of preparing the same and exposure method |
DE60021476T2 (de) * | 1999-06-04 | 2006-05-24 | Jsr Corp. | Beschichtungszusammensetzung für die Filmherstellung und Material für isolierenden Schichten |
US6410150B1 (en) * | 1999-09-29 | 2002-06-25 | Jsr Corporation | Composition for film formation, method of film formation, and insulating film |
-
2001
- 2001-01-15 KR KR1020010002139A patent/KR100677782B1/ko not_active IP Right Cessation
- 2001-01-16 EP EP01100925A patent/EP1117102B1/de not_active Expired - Lifetime
- 2001-01-16 AT AT01100925T patent/ATE301866T1/de not_active IP Right Cessation
- 2001-01-16 DE DE60112481T patent/DE60112481T2/de not_active Expired - Lifetime
- 2001-01-17 US US09/760,784 patent/US6642352B2/en not_active Expired - Fee Related
- 2001-01-17 TW TW090101057A patent/TWI275606B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
ATE301866T1 (de) | 2005-08-15 |
US6642352B2 (en) | 2003-11-04 |
US20010009936A1 (en) | 2001-07-26 |
KR100677782B1 (ko) | 2007-02-05 |
EP1117102A3 (de) | 2002-05-22 |
KR20010086345A (ko) | 2001-09-10 |
EP1117102B1 (de) | 2005-08-10 |
TWI275606B (en) | 2007-03-11 |
DE60112481T2 (de) | 2006-05-18 |
EP1117102A2 (de) | 2001-07-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |