DE60111302D1 - Laminiertes elektronisches Bauteil, Verfahren zur Herstellung und elektronische Einrichtung - Google Patents
Laminiertes elektronisches Bauteil, Verfahren zur Herstellung und elektronische EinrichtungInfo
- Publication number
- DE60111302D1 DE60111302D1 DE60111302T DE60111302T DE60111302D1 DE 60111302 D1 DE60111302 D1 DE 60111302D1 DE 60111302 T DE60111302 T DE 60111302T DE 60111302 T DE60111302 T DE 60111302T DE 60111302 D1 DE60111302 D1 DE 60111302D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- electronic device
- electronic component
- laminated
- laminated electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0352—Differences between the conductors of different layers of a multilayer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000149327 | 2000-05-22 | ||
JP2000149327A JP2001332859A (ja) | 2000-05-22 | 2000-05-22 | 積層型セラミック電子部品およびその製造方法ならびに電子装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60111302D1 true DE60111302D1 (de) | 2005-07-14 |
DE60111302T2 DE60111302T2 (de) | 2006-05-11 |
Family
ID=18655199
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60111302T Expired - Lifetime DE60111302T2 (de) | 2000-05-22 | 2001-04-27 | Laminiertes elektronisches Bauteil, Verfahren zur Herstellung und elektronische Einrichtung |
Country Status (4)
Country | Link |
---|---|
US (1) | US6974916B2 (de) |
EP (1) | EP1158844B1 (de) |
JP (1) | JP2001332859A (de) |
DE (1) | DE60111302T2 (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1324402C (zh) | 2001-10-30 | 2007-07-04 | 钟渊化学工业株式会社 | 感光性树脂组合物、使用该组合物的感光性薄膜及层压体 |
US6818985B1 (en) * | 2001-12-22 | 2004-11-16 | Skyworks Solutions, Inc. | Embedded antenna and semiconductor die on a substrate in a laminate package |
TWI237120B (en) * | 2002-10-09 | 2005-08-01 | Advanced Semiconductor Eng | Impedance standard substrate and method for calibrating vector network analyzer |
CN100468706C (zh) * | 2003-12-04 | 2009-03-11 | 松下电器产业株式会社 | 电路基板及其制造方法、半导体封装及部件内置模块 |
US7323887B2 (en) * | 2005-04-01 | 2008-01-29 | Rosemount Analytical Inc. | Conductivity sensor and manufacturing method therefor |
US20080297179A1 (en) * | 2007-05-29 | 2008-12-04 | Chang-Dong Feng | Multilayer manufacturing for conductivity sensor |
JP5201983B2 (ja) * | 2007-12-28 | 2013-06-05 | 富士通株式会社 | 電子部品 |
JP5133047B2 (ja) * | 2007-12-28 | 2013-01-30 | 太陽誘電株式会社 | 電子部品の製造方法 |
US8946904B2 (en) * | 2010-08-27 | 2015-02-03 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Substrate vias for heat removal from semiconductor die |
WO2017130462A1 (ja) * | 2016-01-27 | 2017-08-03 | 株式会社村田製作所 | インダクタ部品およびその製造方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3968193A (en) * | 1971-08-27 | 1976-07-06 | International Business Machines Corporation | Firing process for forming a multilayer glass-metal module |
US3922479A (en) * | 1971-09-15 | 1975-11-25 | Bunker Ramo | Coaxial circuit construction and method of making |
US4739448A (en) * | 1984-06-25 | 1988-04-19 | Magnavox Government And Industrial Electronics Company | Microwave multiport multilayered integrated circuit chip carrier |
JPS61148847A (ja) | 1984-12-21 | 1986-07-07 | Fujitsu Ltd | 半導体装置 |
JPH088417B2 (ja) | 1988-11-17 | 1996-01-29 | イビデン株式会社 | 多層プリント配線板 |
JPH02148889A (ja) | 1988-11-30 | 1990-06-07 | Toshiba Corp | セラミックス多層基板 |
US5061824A (en) * | 1989-08-23 | 1991-10-29 | Ncr Corporation | Backpanel having multiple logic family signal layers |
JP2739726B2 (ja) * | 1990-09-27 | 1998-04-15 | インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン | 多層プリント回路板 |
JP2996510B2 (ja) * | 1990-11-30 | 2000-01-11 | 株式会社日立製作所 | 電子回路基板 |
JPH06268369A (ja) | 1993-03-10 | 1994-09-22 | Asahi Glass Co Ltd | ビアホールの充填方法 |
US5408053A (en) * | 1993-11-30 | 1995-04-18 | Hughes Aircraft Company | Layered planar transmission lines |
JP2715911B2 (ja) | 1994-07-06 | 1998-02-18 | 日本電気株式会社 | 多層配線セラミック基板及びその製造方法 |
US5741729A (en) * | 1994-07-11 | 1998-04-21 | Sun Microsystems, Inc. | Ball grid array package for an integrated circuit |
DE69535391T2 (de) * | 1994-08-19 | 2007-10-31 | Hitachi, Ltd. | Mehrlagenschaltungssubstrat |
US5719749A (en) * | 1994-09-26 | 1998-02-17 | Sheldahl, Inc. | Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board |
EP0804806A1 (de) * | 1994-12-22 | 1997-11-05 | Benedict G. Pace | Invertiertes chip modul hoher packungsdichte |
DE19681758B4 (de) * | 1996-06-14 | 2006-09-14 | Ibiden Co., Ltd. | Einseitiges Schaltkreissubstrat für mehrlagige Schaltkreisplatine, mehrlagige Schaltkreisplatine und Verfahren zur Herstellung selbiger |
JP3961092B2 (ja) * | 1997-06-03 | 2007-08-15 | 株式会社東芝 | 複合配線基板、フレキシブル基板、半導体装置、および複合配線基板の製造方法 |
-
2000
- 2000-05-22 JP JP2000149327A patent/JP2001332859A/ja active Pending
-
2001
- 2001-04-17 US US09/836,081 patent/US6974916B2/en not_active Expired - Lifetime
- 2001-04-27 EP EP01110468A patent/EP1158844B1/de not_active Expired - Lifetime
- 2001-04-27 DE DE60111302T patent/DE60111302T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE60111302T2 (de) | 2006-05-11 |
EP1158844A3 (de) | 2003-10-15 |
EP1158844B1 (de) | 2005-06-08 |
US6974916B2 (en) | 2005-12-13 |
JP2001332859A (ja) | 2001-11-30 |
EP1158844A2 (de) | 2001-11-28 |
US20030030985A1 (en) | 2003-02-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |