DE60037188D1 - Verfahren zum Betreiben eines Suszeptors für Halbleiterscheiben - Google Patents

Verfahren zum Betreiben eines Suszeptors für Halbleiterscheiben

Info

Publication number
DE60037188D1
DE60037188D1 DE60037188T DE60037188T DE60037188D1 DE 60037188 D1 DE60037188 D1 DE 60037188D1 DE 60037188 T DE60037188 T DE 60037188T DE 60037188 T DE60037188 T DE 60037188T DE 60037188 D1 DE60037188 D1 DE 60037188D1
Authority
DE
Germany
Prior art keywords
susceptor
operating
semiconductor wafers
wafers
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60037188T
Other languages
English (en)
Other versions
DE60037188T2 (de
Inventor
Olaf Storbeck
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qimonda Dresden GmbH and Co OHG
Original Assignee
Qimonda Dresden GmbH and Co OHG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qimonda Dresden GmbH and Co OHG filed Critical Qimonda Dresden GmbH and Co OHG
Application granted granted Critical
Publication of DE60037188D1 publication Critical patent/DE60037188D1/de
Publication of DE60037188T2 publication Critical patent/DE60037188T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE60037188T 2000-08-29 2000-08-29 Verfahren zum Betreiben eines Suszeptors für Halbleiterscheiben Expired - Lifetime DE60037188T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP00118670A EP1184894B1 (de) 2000-08-29 2000-08-29 Verfahren zum Betreiben eines Suszeptors für Halbleiterscheiben

Publications (2)

Publication Number Publication Date
DE60037188D1 true DE60037188D1 (de) 2008-01-03
DE60037188T2 DE60037188T2 (de) 2008-10-02

Family

ID=8169684

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60037188T Expired - Lifetime DE60037188T2 (de) 2000-08-29 2000-08-29 Verfahren zum Betreiben eines Suszeptors für Halbleiterscheiben

Country Status (4)

Country Link
US (1) US20020023590A1 (de)
EP (1) EP1184894B1 (de)
JP (1) JP2002134591A (de)
DE (1) DE60037188T2 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3595853B2 (ja) * 1999-03-18 2004-12-02 日本エー・エス・エム株式会社 プラズマｃｖｄ成膜装置
US7070660B2 (en) * 2002-05-03 2006-07-04 Asm America, Inc. Wafer holder with stiffening rib
JP2004146568A (ja) * 2002-10-24 2004-05-20 Sumitomo Electric Ind Ltd 半導体製造装置用セラミックスヒーター
US7560144B2 (en) * 2005-03-22 2009-07-14 Asm Japan K.K. Method of stabilizing film quality of low-dielectric constant film
US10896842B2 (en) 2009-10-20 2021-01-19 Tokyo Electron Limited Manufacturing method of sample table
US11085112B2 (en) 2011-10-28 2021-08-10 Asm Ip Holding B.V. Susceptor with ring to limit backside deposition
US9576830B2 (en) * 2012-05-18 2017-02-21 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for adjusting wafer warpage
WO2014024216A1 (ja) * 2012-08-06 2014-02-13 パイオニア株式会社 ドライエッチング装置およびドライエッチング方法
US9022392B2 (en) * 2012-08-31 2015-05-05 United Microelectronics Corporation Chuck and semiconductor process using the same
US10361097B2 (en) 2012-12-31 2019-07-23 Globalwafers Co., Ltd. Apparatus for stressing semiconductor substrates
WO2015119744A1 (en) * 2014-02-07 2015-08-13 Applied Materials, Inc. Chucking capability for bowed wafers on dsa
JP5927260B2 (ja) * 2014-10-02 2016-06-01 東京エレクトロン株式会社 試料台及びマイクロ波プラズマ処理装置
US10068787B2 (en) * 2016-12-30 2018-09-04 Sunpower Corporation Bowing semiconductor wafers
TW202129832A (zh) 2020-01-21 2021-08-01 荷蘭商Ａｓｍ Ｉｐ 控股公司 用於均勻沉積之具有側壁隆起的基座及處理結晶基材之方法
TWI786408B (zh) * 2020-05-28 2022-12-11 環球晶圓股份有限公司 晶圓承載台及晶圓鑲埋結構的形成方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100294062B1 (ko) * 1992-10-27 2001-10-24 조셉 제이. 스위니 웨이퍼 처리 챔버에서의 돔형 페데스탈용 클램프 링
US5580388A (en) * 1993-01-21 1996-12-03 Moore Epitaxial, Inc. Multi-layer susceptor for rapid thermal process reactors
US6025099A (en) * 1994-04-29 2000-02-15 Slonaker; Steven Douglas Field curvature correction utilizing smoothly curved chuck for substrate exposure in electronics manufacturing
JP3586031B2 (ja) * 1996-03-27 2004-11-10 株式会社東芝 サセプタおよび熱処理装置および熱処理方法
US5872694A (en) * 1997-12-23 1999-02-16 Siemens Aktiengesellschaft Method and apparatus for determining wafer warpage for optimized electrostatic chuck clamping voltage

Also Published As

Publication number Publication date
DE60037188T2 (de) 2008-10-02
EP1184894A1 (de) 2002-03-06
EP1184894B1 (de) 2007-11-21
US20020023590A1 (en) 2002-02-28
JP2002134591A (ja) 2002-05-10

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Legal Events

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