DE60034386D1 - Lösung zur stromlosen Plattierung von Kompositen und Verfahren zur stromlosen Plattierung von Kompositen - Google Patents

Lösung zur stromlosen Plattierung von Kompositen und Verfahren zur stromlosen Plattierung von Kompositen

Info

Publication number
DE60034386D1
DE60034386D1 DE60034386T DE60034386T DE60034386D1 DE 60034386 D1 DE60034386 D1 DE 60034386D1 DE 60034386 T DE60034386 T DE 60034386T DE 60034386 T DE60034386 T DE 60034386T DE 60034386 D1 DE60034386 D1 DE 60034386D1
Authority
DE
Germany
Prior art keywords
composites
electroless plating
solution
electroless
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60034386T
Other languages
English (en)
Other versions
DE60034386T2 (de
Inventor
Tadashi Chiba
Koji Monden
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
C Uyemura and Co Ltd
Original Assignee
C Uyemura and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by C Uyemura and Co Ltd filed Critical C Uyemura and Co Ltd
Application granted granted Critical
Publication of DE60034386D1 publication Critical patent/DE60034386D1/de
Publication of DE60034386T2 publication Critical patent/DE60034386T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1662—Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Chemically Coating (AREA)
DE60034386T 1999-01-12 2000-01-10 Lösung zur stromlosen Plattierung von Kompositen und Verfahren zur stromlosen Plattierung von Kompositen Expired - Lifetime DE60034386T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP00491699A JP3687722B2 (ja) 1999-01-12 1999-01-12 無電解複合めっき液及び無電解複合めっき方法
JP491699 1999-01-12

Publications (2)

Publication Number Publication Date
DE60034386D1 true DE60034386D1 (de) 2007-05-31
DE60034386T2 DE60034386T2 (de) 2008-01-03

Family

ID=11596965

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60034386T Expired - Lifetime DE60034386T2 (de) 1999-01-12 2000-01-10 Lösung zur stromlosen Plattierung von Kompositen und Verfahren zur stromlosen Plattierung von Kompositen

Country Status (6)

Country Link
US (1) US6273943B1 (de)
EP (1) EP1020542B1 (de)
JP (1) JP3687722B2 (de)
KR (1) KR100540102B1 (de)
DE (1) DE60034386T2 (de)
TW (1) TW559631B (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG86346A1 (en) * 1999-05-06 2002-02-19 Inst Materials Research & Eng Method and composition for bright electroless nickel deposition
EP1197584A1 (de) * 2000-10-10 2002-04-17 BTG Eclépens S.A. Beschichtigungsklinge und Verfahren zur Herstellung
EP1306465B1 (de) * 2001-10-24 2011-03-16 Rohm and Haas Electronic Materials LLC Stabilisatoren für Lösungen zur stromlosen Metallisierung und Verfahren zu deren Anwendung
KR20030039708A (ko) * 2001-11-14 2003-05-22 엄태인 무전해 Ｎｉ-Ｗ/Ｍｏ/란탄계 혼합희토류 금속 도금액 및이를 이용한 도금방법
DE10222962A1 (de) * 2002-05-23 2003-12-11 Atotech Deutschland Gmbh Saurer galvanischer Badelektrolyt und Verfahren zur elektrolytischen Abscheidung satinglänzender Nickelniederschläge
JP4294589B2 (ja) * 2002-09-11 2009-07-15 エスペック株式会社 無電解メッキ液、及びこれを用いた無電解メッキ方法及び無電解メッキ被処理物
US6837923B2 (en) * 2003-05-07 2005-01-04 David Crotty Polytetrafluoroethylene dispersion for electroless nickel plating applications
US20050119723A1 (en) * 2003-11-28 2005-06-02 Medlogics Device Corporation Medical device with porous surface containing bioerodable bioactive composites and related methods
DE102004047423C5 (de) * 2004-09-28 2011-04-21 AHC-Oberflächentechnik GmbH & Co. OHG Außenstromlos aufgebrachte Nickellegierung und ihre Verwendung
CN100376347C (zh) * 2005-02-16 2008-03-26 龙清勇 高效能运动副表面覆层的制造方法
US20060251910A1 (en) * 2005-05-06 2006-11-09 Lancsek Thomas S Composite electroless plating
US20090011136A1 (en) * 2005-05-06 2009-01-08 Thomas Steven Lancsek Composite electroless plating
KR100961011B1 (ko) * 2005-10-07 2010-06-01 닛코킨조쿠 가부시키가이샤 무전해 니켈 도금액
US7842403B2 (en) * 2006-02-23 2010-11-30 Atotech Deutschland Gmbh Antifriction coatings, methods of producing such coatings and articles including such coatings
JP5297171B2 (ja) 2008-12-03 2013-09-25 上村工業株式会社 無電解ニッケルめっき浴及び無電解ニッケルめっき方法
JP5839407B2 (ja) * 2009-06-29 2016-01-06 オークランド ユニサービシズ リミテッド 基板上に金属−セラミックコーティングを製造するめっき又はコーティング方法
US8518826B2 (en) 2010-07-13 2013-08-27 Lam Research Corporation Metallization processes, mixtures, and electronic devices
US20130216720A1 (en) * 2012-02-16 2013-08-22 Trevor Pearson Coatings Having Enhanced Corrosion Performance and Method of Using the Same
US8936672B1 (en) * 2012-06-22 2015-01-20 Accu-Labs, Inc. Polishing and electroless nickel compositions, kits, and methods
JP6193137B2 (ja) * 2014-01-22 2017-09-06 株式会社クオルテック 無電解Ｎｉ−Ｐめっき液及び無電解Ｎｉ−Ｐめっき方法
KR20150096132A (ko) * 2014-02-14 2015-08-24 영남대학교 산학협력단 니켈-피티에프이 복합 도금 방법
CN106086827A (zh) * 2016-07-25 2016-11-09 上海理工大学 一种在不锈钢上化学镀Ni‑P‑PTFE复合涂层前的预镀镍处理方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL148957B (nl) 1972-03-20 1976-03-15 Akzo Nv Werkwijze voor het langs elektrolytische weg aanbrengen van een metaaldeklaag, waarin kunststofdeeltjes zijn opgenomen.
JPS526252B2 (de) 1972-07-04 1977-02-21
CH623851A5 (de) 1975-10-04 1981-06-30 Akzo Nv
NL176436C (nl) 1975-10-04 1985-04-16 Akzo Nv Werkwijze voor de bereiding van positief geladen, stabiele suspensies van polyfluorkoolstofverbindingen.
NL7604399A (nl) 1976-04-26 1977-10-28 Akzo Nv Werkwijze voor het aanbrengen van een kunststof bevattende deklagen.
US4222828A (en) 1978-06-06 1980-09-16 Akzo N.V. Process for electro-codepositing inorganic particles and a metal on a surface
EP0005890B1 (de) 1978-06-06 1981-11-25 Akzo N.V. Verfahren zum Absetzen von anorganische Partikel enthaltenden zusammengesetzten Schichten aus einem elektrolytischen Bad
JPS59170254A (ja) * 1983-03-17 1984-09-26 Nec Corp 無電解めっき方法
US4997686A (en) * 1987-12-23 1991-03-05 Surface Technology, Inc. Composite electroless plating-solutions, processes, and articles thereof
US5232744A (en) * 1991-02-21 1993-08-03 C. Uyemura & Co., Ltd. Electroless composite plating bath and method
US5266103A (en) * 1991-07-04 1993-11-30 C. Uyemura & Co., Ltd. Bath and method for the electroless plating of tin and tin-lead alloy
JPH05163581A (ja) 1991-12-12 1993-06-29 Okuno Seiyaku Kogyo Kk 複合無電解ニッケルめっき液
JPH05163580A (ja) 1991-12-12 1993-06-29 Okuno Seiyaku Kogyo Kk ポリテトラフルオロエチレン複合無電解ニッケルめっき液
US6054173A (en) * 1997-08-22 2000-04-25 Micron Technology, Inc. Copper electroless deposition on a titanium-containing surface

Also Published As

Publication number Publication date
EP1020542A3 (de) 2002-11-27
KR20000053456A (ko) 2000-08-25
US6273943B1 (en) 2001-08-14
JP3687722B2 (ja) 2005-08-24
DE60034386T2 (de) 2008-01-03
EP1020542A2 (de) 2000-07-19
TW559631B (en) 2003-11-01
EP1020542B1 (de) 2007-04-18
KR100540102B1 (ko) 2005-12-29
JP2000204482A (ja) 2000-07-25

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