DE60027317D1 - Gehäuse für optische halbleiterelemente und herstellungsverfahren solcher gehäuse - Google Patents

Gehäuse für optische halbleiterelemente und herstellungsverfahren solcher gehäuse

Info

Publication number
DE60027317D1
DE60027317D1 DE60027317T DE60027317T DE60027317D1 DE 60027317 D1 DE60027317 D1 DE 60027317D1 DE 60027317 T DE60027317 T DE 60027317T DE 60027317 T DE60027317 T DE 60027317T DE 60027317 D1 DE60027317 D1 DE 60027317D1
Authority
DE
Germany
Prior art keywords
housing
manufacturing
semiconductor elements
optical semiconductor
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60027317T
Other languages
English (en)
Inventor
Julien Vittu
Remi Brechignac
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SA
Original Assignee
STMicroelectronics SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SA filed Critical STMicroelectronics SA
Application granted granted Critical
Publication of DE60027317D1 publication Critical patent/DE60027317D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Light Receiving Elements (AREA)
DE60027317T 1999-11-04 2000-10-30 Gehäuse für optische halbleiterelemente und herstellungsverfahren solcher gehäuse Expired - Lifetime DE60027317D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9913779A FR2800912B1 (fr) 1999-11-04 1999-11-04 Boitier semi-conducteur optique et procede de fabrication d'un tel boitier
PCT/FR2000/003022 WO2001033637A1 (fr) 1999-11-04 2000-10-30 Boitier semi-conducteur optique et procede de fabrication d'un tel boitier

Publications (1)

Publication Number Publication Date
DE60027317D1 true DE60027317D1 (de) 2006-05-24

Family

ID=9551692

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60027317T Expired - Lifetime DE60027317D1 (de) 1999-11-04 2000-10-30 Gehäuse für optische halbleiterelemente und herstellungsverfahren solcher gehäuse

Country Status (5)

Country Link
US (1) US6713876B1 (de)
EP (1) EP1226610B1 (de)
DE (1) DE60027317D1 (de)
FR (1) FR2800912B1 (de)
WO (1) WO2001033637A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7274094B2 (en) * 2002-08-28 2007-09-25 Micron Technology, Inc. Leadless packaging for image sensor devices
US6933493B2 (en) * 2003-04-07 2005-08-23 Kingpak Technology Inc. Image sensor having a photosensitive chip mounted to a metal sheet
US20060016973A1 (en) * 2004-07-21 2006-01-26 Advanced Semiconductor Engineering, Inc. Multi-chip image sensor package module
TWI449134B (zh) * 2004-12-10 2014-08-11 Nxp Bv 積體封裝
US8237256B2 (en) * 2004-12-10 2012-08-07 Ipdia Integrated package
JP4955349B2 (ja) * 2006-09-07 2012-06-20 新光電気工業株式会社 半導体装置
JP2017139258A (ja) * 2016-02-01 2017-08-10 ソニー株式会社 撮像素子パッケージ及び撮像装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3622419A (en) * 1969-10-08 1971-11-23 Motorola Inc Method of packaging an optoelectrical device
JPS6439048A (en) * 1987-08-05 1989-02-09 Hitachi Ltd Solid-state image sensing device
JPH02278872A (ja) * 1989-04-20 1990-11-15 Ibiden Co Ltd 画像センサー
US5952714A (en) * 1995-08-02 1999-09-14 Matsushita Electronics Corporation Solid-state image sensing apparatus and manufacturing method thereof
US6795120B2 (en) * 1996-05-17 2004-09-21 Sony Corporation Solid-state imaging apparatus and camera using the same
US5867368A (en) * 1997-09-09 1999-02-02 Amkor Technology, Inc. Mounting for a semiconductor integrated circuit device
JP2000349306A (ja) * 1999-06-02 2000-12-15 Mitsubishi Electric Corp 集光レンズ付き半導体装置
US6147389A (en) * 1999-06-04 2000-11-14 Silicon Film Technologies, Inc. Image sensor package with image plane reference
US6507082B2 (en) * 2000-02-22 2003-01-14 Texas Instruments Incorporated Flip-chip assembly of protected micromechanical devices
US6396116B1 (en) * 2000-02-25 2002-05-28 Agilent Technologies, Inc. Integrated circuit packaging for optical sensor devices
US6384473B1 (en) * 2000-05-16 2002-05-07 Sandia Corporation Microelectronic device package with an integral window

Also Published As

Publication number Publication date
FR2800912B1 (fr) 2003-07-25
FR2800912A1 (fr) 2001-05-11
WO2001033637A1 (fr) 2001-05-10
US6713876B1 (en) 2004-03-30
EP1226610A1 (de) 2002-07-31
EP1226610B1 (de) 2006-04-12

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Legal Events

Date Code Title Description
8332 No legal effect for de