DE60027297T2 - Übergang zwischen einem symetrischen und einem asymetrischen streifenleiter - Google Patents

Übergang zwischen einem symetrischen und einem asymetrischen streifenleiter Download PDF

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Publication number
DE60027297T2
DE60027297T2 DE60027297T DE60027297T DE60027297T2 DE 60027297 T2 DE60027297 T2 DE 60027297T2 DE 60027297 T DE60027297 T DE 60027297T DE 60027297 T DE60027297 T DE 60027297T DE 60027297 T2 DE60027297 T2 DE 60027297T2
Authority
DE
Germany
Prior art keywords
section
transition
ground plane
stripline
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60027297T
Other languages
German (de)
English (en)
Other versions
DE60027297D1 (de
Inventor
Björn ALBINSSON
Thomas Harju
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Publication of DE60027297D1 publication Critical patent/DE60027297D1/de
Application granted granted Critical
Publication of DE60027297T2 publication Critical patent/DE60027297T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Waveguide Connection Structure (AREA)
DE60027297T 1999-06-17 2000-06-13 Übergang zwischen einem symetrischen und einem asymetrischen streifenleiter Expired - Lifetime DE60027297T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE9902302 1999-06-17
SE9902302A SE514424C2 (sv) 1999-06-17 1999-06-17 Övergång mellan symmetrisk och asymmetrisk stripline i ett flerlagers mönsterkort
PCT/SE2000/001012 WO2000079846A1 (en) 1999-06-17 2000-06-13 Transition between symmetric stripline and asymmetric stripline

Publications (2)

Publication Number Publication Date
DE60027297D1 DE60027297D1 (de) 2006-05-24
DE60027297T2 true DE60027297T2 (de) 2007-03-29

Family

ID=20416131

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60027297T Expired - Lifetime DE60027297T2 (de) 1999-06-17 2000-06-13 Übergang zwischen einem symetrischen und einem asymetrischen streifenleiter

Country Status (8)

Country Link
US (1) US6348844B1 (https=)
EP (1) EP1195080B1 (https=)
JP (1) JP4198912B2 (https=)
AU (1) AU5856900A (https=)
DE (1) DE60027297T2 (https=)
IL (1) IL146908A (https=)
SE (1) SE514424C2 (https=)
WO (1) WO2000079846A1 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6483404B1 (en) * 2001-08-20 2002-11-19 Xytrans, Inc. Millimeter wave filter for surface mount applications
US6881895B1 (en) 2003-09-30 2005-04-19 National Semiconductor Corporation Radio frequency (RF) filter within multilayered low temperature co-fired ceramic (LTCC) substrate
US6872962B1 (en) 2003-09-30 2005-03-29 National Semiconductor Corporation Radio frequency (RF) filter within multilayered low temperature co-fired ceramic (LTCC) substrate
US6873228B1 (en) 2003-09-30 2005-03-29 National Semiconductor Corporation Buried self-resonant bypass capacitors within multilayered low temperature co-fired ceramic (LTCC) substrate
US20050088258A1 (en) * 2003-10-27 2005-04-28 Xytrans, Inc. Millimeter wave surface mount filter
DE102006047427B4 (de) * 2006-10-06 2012-10-25 Epcos Ag Substrat mit HF-tauglicher Leitung
DE102007038514A1 (de) * 2007-08-16 2009-02-19 Robert Bosch Gmbh Elektrische Schaltungsanordnung und Verfahren zur Herstellung einer elektrischen Schaltungsanordnung
US8248183B2 (en) * 2009-07-30 2012-08-21 Sierra Wireless, Inc. Circuit board pad having impedance matched to a transmission line and method for providing same
GB201113131D0 (en) * 2011-07-29 2011-09-14 Bae Systems Plc Radio frequency communication
US11342647B2 (en) 2019-11-26 2022-05-24 Raytheon Company Free-form dual dual-conductor integrated radio frequency media
US12456808B2 (en) 2021-10-01 2025-10-28 The Boeing Company High isolation ring slot patch radiator for phased array antennas
EP4576420A1 (en) * 2023-12-18 2025-06-25 The Boeing Company High isolation ring slot patch radiator for phased array antennas

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69318879T2 (de) * 1992-04-03 1998-10-08 Matsushita Electric Ind Co Ltd Keramisches Mehrschicht-Substrat für hohe Frequenzen
JP3023265B2 (ja) * 1992-09-26 2000-03-21 日本特殊陶業株式会社 集積回路用パッケージ本体
JPH06334449A (ja) * 1993-05-25 1994-12-02 Matsushita Electric Ind Co Ltd 高周波増幅器回路多層基板

Also Published As

Publication number Publication date
DE60027297D1 (de) 2006-05-24
EP1195080B1 (en) 2006-04-12
IL146908A (en) 2005-11-20
IL146908A0 (en) 2002-08-14
JP4198912B2 (ja) 2008-12-17
US6348844B1 (en) 2002-02-19
SE9902302D0 (sv) 1999-06-17
EP1195080A1 (en) 2002-04-10
JP2003502968A (ja) 2003-01-21
SE9902302L (sv) 2000-12-18
WO2000079846A1 (en) 2000-12-28
SE514424C2 (sv) 2001-02-19
AU5856900A (en) 2001-01-09

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