DE60023597D1 - Leiterplattenanordnung mit integriertem Verbundkern mit metallischer Matrix - Google Patents

Leiterplattenanordnung mit integriertem Verbundkern mit metallischer Matrix

Info

Publication number
DE60023597D1
DE60023597D1 DE60023597T DE60023597T DE60023597D1 DE 60023597 D1 DE60023597 D1 DE 60023597D1 DE 60023597 T DE60023597 T DE 60023597T DE 60023597 T DE60023597 T DE 60023597T DE 60023597 D1 DE60023597 D1 DE 60023597D1
Authority
DE
Germany
Prior art keywords
circuit board
board assembly
composite core
metallic matrix
integrated composite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60023597T
Other languages
English (en)
Other versions
DE60023597T2 (de
Inventor
Carl R Smith
Jeffrey R Madura
Jesse J Kramer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Northrop Grumman Corp
Original Assignee
Northrop Grumman Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Northrop Grumman Corp filed Critical Northrop Grumman Corp
Application granted granted Critical
Publication of DE60023597D1 publication Critical patent/DE60023597D1/de
Publication of DE60023597T2 publication Critical patent/DE60023597T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0281—Conductive fibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24058—Structurally defined web or sheet [e.g., overall dimension, etc.] including grain, strips, or filamentary elements in respective layers or components in angular relation
    • Y10T428/24124—Fibers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24132—Structurally defined web or sheet [e.g., overall dimension, etc.] including grain, strips, or filamentary elements in different layers or components parallel

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
DE60023597T 1999-06-02 2000-05-31 Leiterplattenanordnung mit integriertem Verbundkern mit metallischer Matrix Expired - Lifetime DE60023597T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US324288 1999-06-02
US09/324,288 US6340796B1 (en) 1999-06-02 1999-06-02 Printed wiring board structure with integral metal matrix composite core

Publications (2)

Publication Number Publication Date
DE60023597D1 true DE60023597D1 (de) 2005-12-08
DE60023597T2 DE60023597T2 (de) 2006-07-20

Family

ID=23262946

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60023597T Expired - Lifetime DE60023597T2 (de) 1999-06-02 2000-05-31 Leiterplattenanordnung mit integriertem Verbundkern mit metallischer Matrix

Country Status (3)

Country Link
US (1) US6340796B1 (de)
EP (1) EP1058491B1 (de)
DE (1) DE60023597T2 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3812321B2 (ja) * 2000-10-25 2006-08-23 株式会社豊田自動織機 放熱板およびその製造方法
USRE44438E1 (en) 2001-02-27 2013-08-13 Stats Chippac, Ltd. Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate
US8143108B2 (en) 2004-10-07 2012-03-27 Stats Chippac, Ltd. Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate
US20020121707A1 (en) * 2001-02-27 2002-09-05 Chippac, Inc. Super-thin high speed flip chip package
US7038142B2 (en) * 2002-01-24 2006-05-02 Fujitsu Limited Circuit board and method for fabricating the same, and electronic device
KR20070015210A (ko) * 2004-05-15 2007-02-01 씨-코어 테크놀로지즈, 인코포레이티드 수지로 충전된 채널을 포함하는 전도성 억제 코어를 가지는인쇄 배선 기판
JP4556174B2 (ja) * 2004-12-15 2010-10-06 日本電気株式会社 携帯端末機器及び放熱方法
JP5491026B2 (ja) * 2005-03-15 2014-05-14 スタブルコー テクノロジー，インコーポレイティド プリント配線基板中に補強コア材料を構成する製造方法
US7730613B2 (en) * 2005-08-29 2010-06-08 Stablcor, Inc. Processes for manufacturing printed wiring boards
USRE45637E1 (en) 2005-08-29 2015-07-28 Stablcor Technology, Inc. Processes for manufacturing printed wiring boards
WO2008008552A2 (en) * 2006-07-14 2008-01-17 Stablcor, Inc. Build-up printed wiring board substrate having a core layer that is part of a circuit
JP2009088173A (ja) * 2007-09-28 2009-04-23 Fujitsu Ltd 配線基板
WO2009065105A2 (en) * 2007-11-16 2009-05-22 Continental Automotive Systems Us, Inc. Thermal packaging of transmission controller using carbon composite printed circuit board material
JP5170253B2 (ja) * 2008-11-20 2013-03-27 富士通株式会社 配線基板及び配線基板の製造方法
WO2010146652A1 (ja) * 2009-06-15 2010-12-23 富士通オプティカルコンポーネンツ株式会社 光モジュール
US9332632B2 (en) 2014-08-20 2016-05-03 Stablcor Technology, Inc. Graphene-based thermal management cores and systems and methods for constructing printed wiring boards
KR101841836B1 (ko) * 2016-07-05 2018-03-26 김구용 다면 방열구조를 갖는 pcb 모듈, 및 이 모듈에 사용되는 방열 플레이트, 다층 pcb 어셈블리, 및 모듈 케이스
CN111108594B (zh) * 2017-09-28 2024-03-19 京瓷株式会社 电子元件搭载用基板及电子装置
US10790241B2 (en) 2019-02-28 2020-09-29 Advanced Semiconductor Engineering, Inc. Wiring structure and method for manufacturing the same
US11171118B2 (en) * 2019-07-03 2021-11-09 Micron Technology, Inc. Semiconductor assemblies including thermal circuits and methods of manufacturing the same

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2206700B2 (de) 1972-02-12 1976-07-01 Sigri Elektrographit Gmbh, 8901 Meitingen Verfahren zur herstellung von faserverstaerkten verbundkoerpern
US4318954A (en) 1981-02-09 1982-03-09 Boeing Aerospace Company Printed wiring board substrates for ceramic chip carriers
FR2546878B1 (fr) * 1983-05-31 1988-04-08 Slonina Jean Pierre Plaque support d'un substrat ceramique, leger, a forte conductivite thermique et coefficient de dilatation adapte pour toutes applications dans le domaine electronique
US4609586A (en) 1984-08-02 1986-09-02 The Boeing Company Thermally conductive printed wiring board laminate
US4654248A (en) 1985-12-16 1987-03-31 Gte Communication Systems Corporation Printed wiring board with zones of controlled thermal coefficient of expansion
US4849858A (en) * 1986-10-20 1989-07-18 Westinghouse Electric Corp. Composite heat transfer means
US4867235A (en) 1986-10-20 1989-09-19 Westinghouse Electric Corp. Composite heat transfer means
US4791248A (en) 1987-01-22 1988-12-13 The Boeing Company Printed wire circuit board and its method of manufacture
US4806704A (en) * 1987-06-08 1989-02-21 General Electric Company Metal matrix composite and structure using metal matrix composites for electronic applications
US5002823A (en) 1987-06-12 1991-03-26 E. I. Du Pont De Nemours And Company Reinforced composites having improved flex fatigue life
US4882454A (en) 1988-02-12 1989-11-21 Texas Instruments Incorporated Thermal interface for a printed wiring board
US4963697A (en) 1988-02-12 1990-10-16 Texas Instruments Incorporated Advanced polymers on metal printed wiring board
DE8813093U1 (de) * 1988-10-18 1988-12-08 Teldix Gmbh, 6900 Heidelberg, De
US5224017A (en) * 1989-05-17 1993-06-29 The Charles Stark Draper Laboratory, Inc. Composite heat transfer device
US5716663A (en) 1990-02-09 1998-02-10 Toranaga Technologies Multilayer printed circuit
TW210422B (de) 1991-06-04 1993-08-01 Akzo Nv
JPH05110219A (ja) * 1991-10-17 1993-04-30 Mitsubishi Electric Corp 印刷配線基板
US5296310A (en) 1992-02-14 1994-03-22 Materials Science Corporation High conductivity hydrid material for thermal management
US5306571A (en) * 1992-03-06 1994-04-26 Bp Chemicals Inc., Advanced Materials Division Metal-matrix-composite
FR2694139B1 (fr) * 1992-07-21 1994-10-14 Aerospatiale Substrat d'interconnexion pour composants électroniques et son procédé de fabrication.
US5544017A (en) 1992-08-05 1996-08-06 Fujitsu Limited Multichip module substrate
US5309629A (en) 1992-09-01 1994-05-10 Rogers Corporation Method of manufacturing a multilayer circuit board
GB9225260D0 (en) 1992-12-03 1993-01-27 Int Computers Ltd Cooling electronic circuit assemblies
US5840402A (en) 1994-06-24 1998-11-24 Sheldahl, Inc. Metallized laminate material having ordered distribution of conductive through holes
US5571608A (en) 1994-07-15 1996-11-05 Dell Usa, L.P. Apparatus and method of making laminate an embedded conductive layer
US5699613A (en) 1995-09-25 1997-12-23 International Business Machines Corporation Fine dimension stacked vias for a multiple layer circuit board structure
JPH11145334A (ja) * 1997-09-02 1999-05-28 Eastern Co Ltd 配線基板

Also Published As

Publication number Publication date
US6340796B1 (en) 2002-01-22
DE60023597T2 (de) 2006-07-20
EP1058491A2 (de) 2000-12-06
EP1058491A3 (de) 2002-03-13
EP1058491B1 (de) 2005-11-02

Similar Documents

Publication Publication Date Title
DE60023597D1 (de) Leiterplattenanordnung mit integriertem Verbundkern mit metallischer Matrix
DE60020446D1 (de) Verbundstoff mit Metallschicht für eine Leiterplatte
DE69923126D1 (de) Integrierte Schaltung mit mehreren Prozessorkernen
DE69731719D1 (de) Steckverbinder mit integrierter Leiterplattenanordnung
DE69722403D1 (de) Banknote mit einer integrierten Schaltung
DE1089870T1 (de) Verstärkungslaminat
DE60004269D1 (de) Elektronische baugruppe mit hohem kühlungsvermögen
DE69942279D1 (de) Vielschichtig aufgebaute leiterplatte
DE69825713D1 (de) Elektromagnetischer Betätiger mit Verbundkernanordnung
DE69830987D1 (de) Elektronisches bauelement
DE60012824D1 (de) Leiterplattenanordnung mit integriertem Verbundkern mit organischer Matrix
DE69831467D1 (de) Mehrschicht-Schaltungsplatte
NO20012761D0 (no) Komposittlaminater
DE60007218D1 (de) Flipflop-Schaltung
DE69940590D1 (de) Integrierter Schaltkreis mit induktiven Elementen
DE60035917D1 (de) Elektronisches Bauteil
DE59810941D1 (de) Elektronische Baugruppe
DE69819877D1 (de) Elektronisches Mikrometer
DE69926896D1 (de) Elektrische komponente eingebettet in einer mehrschicht-leiterplattenanordnung
SG91855A1 (en) Circuit board assembly
DE59909275D1 (de) Schaltungsanordnung mit Strom-Digital-Analog-Konvertern
DE60107311D1 (de) Keramisches Elektronikbauteil mit Anschluss
DE69838631D1 (de) Leistungsauswahl in einer integrierten Schaltung
DE60211628D1 (de) Zusammengesetzte elektronische bauteile
DE50011005D1 (de) Zusammengesetztes Bauteil

Legal Events

Date Code Title Description
8364 No opposition during term of opposition