DE69926896D1 - Elektrische komponente eingebettet in einer mehrschicht-leiterplattenanordnung - Google Patents

Elektrische komponente eingebettet in einer mehrschicht-leiterplattenanordnung

Info

Publication number
DE69926896D1
DE69926896D1 DE69926896T DE69926896T DE69926896D1 DE 69926896 D1 DE69926896 D1 DE 69926896D1 DE 69926896 T DE69926896 T DE 69926896T DE 69926896 T DE69926896 T DE 69926896T DE 69926896 D1 DE69926896 D1 DE 69926896D1
Authority
DE
Germany
Prior art keywords
electrical component
pcb assembly
multilayer pcb
component embedded
multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69926896T
Other languages
English (en)
Other versions
DE69926896T2 (de
Inventor
Leif Bergstedt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Application granted granted Critical
Publication of DE69926896D1 publication Critical patent/DE69926896D1/de
Publication of DE69926896T2 publication Critical patent/DE69926896T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Laminated Bodies (AREA)
DE69926896T 1998-06-15 1999-06-15 Elektrische komponente eingebettet in einer mehrschicht-leiterplattenanordnung Expired - Lifetime DE69926896T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE9802157A SE513875C2 (sv) 1998-06-15 1998-06-15 Elektrisk komponent samt ett flerlagrigt kretskort
SE9802157 1998-06-15
PCT/SE1999/001063 WO1999066518A1 (en) 1998-06-15 1999-06-15 Electric component

Publications (2)

Publication Number Publication Date
DE69926896D1 true DE69926896D1 (de) 2005-09-29
DE69926896T2 DE69926896T2 (de) 2006-03-30

Family

ID=20411738

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69926896T Expired - Lifetime DE69926896T2 (de) 1998-06-15 1999-06-15 Elektrische komponente eingebettet in einer mehrschicht-leiterplattenanordnung

Country Status (6)

Country Link
US (1) US6421225B2 (de)
EP (1) EP1095385B1 (de)
AU (1) AU4813999A (de)
DE (1) DE69926896T2 (de)
SE (1) SE513875C2 (de)
WO (1) WO1999066518A1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6909054B2 (en) 2000-02-25 2005-06-21 Ibiden Co., Ltd. Multilayer printed wiring board and method for producing multilayer printed wiring board
KR100797422B1 (ko) * 2000-09-25 2008-01-23 이비덴 가부시키가이샤 반도체소자, 반도체소자의 제조방법, 다층프린트배선판 및다층프린트배선판의 제조방법
US7038143B2 (en) * 2002-05-16 2006-05-02 Mitsubishi Denki Kabushiki Kaisha Wiring board, fabrication method of wiring board, and semiconductor device
US6900708B2 (en) * 2002-06-26 2005-05-31 Georgia Tech Research Corporation Integrated passive devices fabricated utilizing multi-layer, organic laminates
US7260890B2 (en) * 2002-06-26 2007-08-28 Georgia Tech Research Corporation Methods for fabricating three-dimensional all organic interconnect structures
US6987307B2 (en) * 2002-06-26 2006-01-17 Georgia Tech Research Corporation Stand-alone organic-based passive devices
US7489914B2 (en) * 2003-03-28 2009-02-10 Georgia Tech Research Corporation Multi-band RF transceiver with passive reuse in organic substrates
US7054599B2 (en) * 2003-05-08 2006-05-30 Lockheed Martin Corporation High density interconnect structure for use on software defined radio
TWI314745B (en) * 2004-02-02 2009-09-11 Ind Tech Res Inst Method and apparatus of non-symmetrical electrode of build-in capacitor
US8345433B2 (en) * 2004-07-08 2013-01-01 Avx Corporation Heterogeneous organic laminate stack ups for high frequency applications
US20060011376A1 (en) * 2004-07-16 2006-01-19 General Electric Company Multi-axial electrically conductive cable with multi-layered core and method of manufacture and use
JP2007142109A (ja) * 2005-11-17 2007-06-07 Tdk Corp 電子部品
US7439840B2 (en) 2006-06-27 2008-10-21 Jacket Micro Devices, Inc. Methods and apparatuses for high-performing multi-layer inductors
US7808434B2 (en) * 2006-08-09 2010-10-05 Avx Corporation Systems and methods for integrated antennae structures in multilayer organic-based printed circuit devices
US7989895B2 (en) 2006-11-15 2011-08-02 Avx Corporation Integration using package stacking with multi-layer organic substrates
US8325461B2 (en) * 2008-08-08 2012-12-04 Hamilton Sundstrand Corporation Printed wiring board feed-through capacitor
US10372213B2 (en) * 2016-09-20 2019-08-06 Facebook Technologies, Llc Composite ribbon in a virtual reality device
US10993333B2 (en) * 2017-07-15 2021-04-27 Sanmina Corporation Methods of manufacturing ultra thin dielectric printed circuit boards with thin laminates

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL267988A (de) * 1960-08-15 1900-01-01
US3886415A (en) * 1968-04-01 1975-05-27 Itek Corp Capacitor with photo-conductive dielectric
US3806775A (en) * 1971-10-19 1974-04-23 Du Pont Polyolefin capacitor construction
US3778689A (en) * 1972-05-22 1973-12-11 Hewlett Packard Co Thin film capacitors and method for manufacture
JPS6040383B2 (ja) * 1978-07-05 1985-09-10 東レ株式会社 ポリプロピレン複合二軸延伸フイルム
DE2851557C2 (de) 1978-11-29 1982-04-01 Hoechst Ag, 6000 Frankfurt Biaxial gestreckte Polypropylenverbundfolie zur Verwendung als Elektroisolierfolie
JPS60214941A (ja) * 1984-04-10 1985-10-28 株式会社　潤工社 プリント基板
US5065253A (en) 1987-12-25 1991-11-12 Pioneer Electronic Corporation Disk player with disk tilt or pickup position responsive noise reduction
US5065284A (en) 1988-08-01 1991-11-12 Rogers Corporation Multilayer printed wiring board
JP3019541B2 (ja) * 1990-11-22 2000-03-13 株式会社村田製作所 コンデンサ内蔵型配線基板およびその製造方法
FR2684333B1 (fr) 1991-12-03 1999-07-16 Bollore Technologies Film plastique bicouche bi-etire.
US5800575A (en) * 1992-04-06 1998-09-01 Zycon Corporation In situ method of forming a bypass capacitor element internally within a capacitive PCB
US5625528A (en) 1992-10-21 1997-04-29 Devoe; Daniel F. Monolithic, buried-substrate, ceramic multiple capacitors isolated, one to the next, by dual-dielectric-constant, three-layer-laminate isolation layers
US5625655A (en) 1994-07-29 1997-04-29 Combustion Engineering, Inc. Fuel transfer tube quick operating remote closure device
US5796587A (en) 1996-06-12 1998-08-18 International Business Machines Corporation Printed circut board with embedded decoupling capacitance and method for producing same

Also Published As

Publication number Publication date
EP1095385B1 (de) 2005-08-24
EP1095385A1 (de) 2001-05-02
WO1999066518A1 (en) 1999-12-23
US6421225B2 (en) 2002-07-16
US20010011606A1 (en) 2001-08-09
SE9802157D0 (sv) 1998-06-15
AU4813999A (en) 2000-01-05
DE69926896T2 (de) 2006-03-30
SE513875C2 (sv) 2000-11-20
SE9802157L (sv) 1999-12-16

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