DE60023416D1 - Weichlotverbindung mit hoher Festigkeit - Google Patents

Weichlotverbindung mit hoher Festigkeit

Info

Publication number
DE60023416D1
DE60023416D1 DE60023416T DE60023416T DE60023416D1 DE 60023416 D1 DE60023416 D1 DE 60023416D1 DE 60023416 T DE60023416 T DE 60023416T DE 60023416 T DE60023416 T DE 60023416T DE 60023416 D1 DE60023416 D1 DE 60023416D1
Authority
DE
Germany
Prior art keywords
high strength
solder joint
soft solder
soft
joint
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60023416T
Other languages
English (en)
Other versions
DE60023416T2 (de
Inventor
Kazuyuki Kawashima
Yasunori Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Application granted granted Critical
Publication of DE60023416D1 publication Critical patent/DE60023416D1/de
Publication of DE60023416T2 publication Critical patent/DE60023416T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15182—Fan-in arrangement of the internal vias
    • H01L2924/15183—Fan-in arrangement of the internal vias in a single layer of the multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/125—Deflectable by temperature change [e.g., thermostat element]
    • Y10T428/12507—More than two components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/125—Deflectable by temperature change [e.g., thermostat element]
    • Y10T428/12514—One component Cu-based
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12736—Al-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/1291—Next to Co-, Cu-, or Ni-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12944—Ni-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12993—Surface feature [e.g., rough, mirror]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Chemically Coating (AREA)
  • Wire Bonding (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE60023416T 1999-09-03 2000-09-01 Weichlotverbindung mit hoher Festigkeit Expired - Lifetime DE60023416T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP25015299A JP3444245B2 (ja) 1999-09-03 1999-09-03 無電解ニッケル／金メッキへのはんだ付け方法、配線構造体、回路装置及びその製造方法
JP25015299 1999-09-03

Publications (2)

Publication Number Publication Date
DE60023416D1 true DE60023416D1 (de) 2005-12-01
DE60023416T2 DE60023416T2 (de) 2006-07-27

Family

ID=17203605

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60023416T Expired - Lifetime DE60023416T2 (de) 1999-09-03 2000-09-01 Weichlotverbindung mit hoher Festigkeit

Country Status (6)

Country Link
US (2) US6669077B1 (de)
EP (1) EP1080823B1 (de)
JP (1) JP3444245B2 (de)
CN (1) CN1151008C (de)
AU (1) AU770552B2 (de)
DE (1) DE60023416T2 (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7007378B2 (en) * 1999-06-24 2006-03-07 International Business Machines Corporation Process for manufacturing a printed wiring board
KR100856610B1 (ko) 2001-03-27 2008-09-03 가부시키가이샤 네오맥스 마테리아르 전자부품용 팩키지 및 그 제조방법
JP2002359459A (ja) * 2001-06-01 2002-12-13 Nec Corp 電子部品の実装方法、プリント配線基板および実装構造体
JP4136641B2 (ja) 2002-02-28 2008-08-20 株式会社ルネサステクノロジ 半導体装置の接続条件の算出方法
JP2003303842A (ja) * 2002-04-12 2003-10-24 Nec Electronics Corp 半導体装置およびその製造方法
DE10251658B4 (de) * 2002-11-01 2005-08-25 Atotech Deutschland Gmbh Verfahren zum Verbinden von zur Herstellung von Mikrostrukturbauteilen geeigneten, mikrostrukturierten Bauteillagen sowie Mikrostrukturbauteil
US7325716B2 (en) * 2004-08-24 2008-02-05 Intel Corporation Dense intermetallic compound layer
US20060068218A1 (en) * 2004-09-28 2006-03-30 Hooghan Kultaransingh N Whisker-free lead frames
KR100718169B1 (ko) * 2006-01-12 2007-05-15 한국과학기술원 니켈 표면 처리된 전자부품과 무전해 니켈 표면 처리된전자부품의 접합방법
KR100744930B1 (ko) * 2006-02-01 2007-08-01 삼성전기주식회사 Ｌｔｃｃ 모듈의 제조 방법
KR101317019B1 (ko) * 2007-09-21 2013-10-11 에이저 시스템즈 인크 전자 디바이스 및 납땜 방법
JP2009099589A (ja) * 2007-10-12 2009-05-07 Elpida Memory Inc ウエハまたは回路基板およびその接続構造体
US7847399B2 (en) * 2007-12-07 2010-12-07 Texas Instruments Incorporated Semiconductor device having solder-free gold bump contacts for stability in repeated temperature cycles
US8367244B2 (en) * 2008-04-17 2013-02-05 Enovix Corporation Anode material having a uniform metal-semiconductor alloy layer
JP5065978B2 (ja) * 2008-04-21 2012-11-07 Ｄｏｗａメタルテック株式会社 Ｐｂレス半田の半田付け方法及びその半田付け品
US8592995B2 (en) * 2009-07-02 2013-11-26 Taiwan Semiconductor Manufacturing Company, Ltd. Method and structure for adhesion of intermetallic compound (IMC) on Cu pillar bump
JP5680342B2 (ja) 2009-09-02 2015-03-04 Tdk株式会社 めっき膜、プリント配線板及びモジュール基板
TW201113993A (en) * 2009-10-01 2011-04-16 Anpec Electronics Corp Pre-packaged structure
DE102009054068A1 (de) * 2009-11-20 2011-05-26 Epcos Ag Lotmaterial zur Befestigung einer Außenelektrode bei einem piezoelektrischen Bauelement und piezoelektrisches Bauelement mit einem Lotmaterial
US8698306B2 (en) 2010-05-20 2014-04-15 Taiwan Semiconductor Manufacturing Company, Ltd. Substrate contact opening
CN102248241B (zh) * 2011-05-18 2013-12-04 清华大学 含Co基薄膜的凸点底部金属层与无铅焊点连接的方法
JP6046406B2 (ja) * 2011-07-26 2016-12-14 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ 高温耐性銀コート基体
US9786622B2 (en) * 2011-10-20 2017-10-10 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor package
JP6061369B2 (ja) 2012-01-30 2017-01-18 凸版印刷株式会社 配線基板およびその製造方法、ならびにはんだ付き配線基板の製造方法
US20150041183A1 (en) * 2013-08-06 2015-02-12 Kinsus Interconnect Technology Corp. Chip board package structure
WO2017086324A1 (ja) * 2015-11-16 2017-05-26 株式会社豊田中央研究所 接合構造体およびその製造方法
CN110099522A (zh) * 2018-01-31 2019-08-06 嘉联益电子(昆山)有限公司 卷对卷柔性线路板及其快速加工方法
US10604169B1 (en) * 2019-03-21 2020-03-31 Shinn Fu Company Of America, Inc. Multi-configuration mechanical apparatus

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53122766A (en) * 1977-04-01 1978-10-26 Hitachi Ltd Method of producing printed circuit board
US4824009A (en) * 1981-12-31 1989-04-25 International Business Machines Corporation Process for braze attachment of electronic package members
US4871108A (en) * 1985-01-17 1989-10-03 Stemcor Corporation Silicon carbide-to-metal joint and method of making same
JPS6283844A (ja) * 1985-10-08 1987-04-17 Meiji Milk Prod Co Ltd チ−ズ食品およびその製造法
JP2762672B2 (ja) * 1990-04-09 1998-06-04 富士通株式会社 半田接続用パッドとその形成方法
US5260234A (en) * 1990-12-20 1993-11-09 Vlsi Technology, Inc. Method for bonding a lead to a die pad using an electroless plating solution
US5199487A (en) * 1991-05-31 1993-04-06 Hughes Aircraft Company Electroformed high efficiency heat exchanger and method for making
JP3353960B2 (ja) * 1993-04-23 2002-12-09 イビデン株式会社 プリント配線板のボンディングパッド及び導体パターンの無電解金メッキ方法
US5492863A (en) * 1994-10-19 1996-02-20 Motorola, Inc. Method for forming conductive bumps on a semiconductor device
US6224690B1 (en) * 1995-12-22 2001-05-01 International Business Machines Corporation Flip-Chip interconnections using lead-free solders
JPH09326554A (ja) 1996-06-06 1997-12-16 Matsushita Electric Ind Co Ltd 電子部品接合用電極のはんだ合金及びはんだ付け方法
US5973932A (en) * 1997-02-14 1999-10-26 Pulse Engineering, Inc. Soldered component bonding in a printed circuit assembly
EP1009202B1 (de) * 1997-06-04 2007-10-17 Ibiden Co., Ltd. Lötelement für gedruckte leiterplatten
JP3339384B2 (ja) 1997-07-14 2002-10-28 イビデン株式会社 半田材料並びにプリント配線板及びその製造方法
US6137690A (en) * 1997-08-18 2000-10-24 Motorola Electronic assembly
JPH11307565A (ja) * 1998-04-24 1999-11-05 Mitsubishi Electric Corp 半導体装置の電極およびその製造方法ならびに半導体装置
US6175152B1 (en) * 1998-06-25 2001-01-16 Citizen Watch Co., Ltd. Semiconductor device
KR100398716B1 (ko) * 2000-06-12 2003-09-19 가부시키가이샤 히타치세이사쿠쇼 반도체 모듈 및 반도체 장치를 접속한 회로 기판
JP3910363B2 (ja) * 2000-12-28 2007-04-25 富士通株式会社 外部接続端子

Also Published As

Publication number Publication date
EP1080823B1 (de) 2005-10-26
EP1080823A3 (de) 2004-01-21
EP1080823A2 (de) 2001-03-07
CN1151008C (zh) 2004-05-26
JP3444245B2 (ja) 2003-09-08
DE60023416T2 (de) 2006-07-27
JP2001077528A (ja) 2001-03-23
US6919137B2 (en) 2005-07-19
US20040058192A1 (en) 2004-03-25
US6669077B1 (en) 2003-12-30
AU770552B2 (en) 2004-02-26
AU5645000A (en) 2001-03-08
CN1287035A (zh) 2001-03-14

Similar Documents

Publication Publication Date Title
DE60023416D1 (de) Weichlotverbindung mit hoher Festigkeit
DE60020148D1 (de) Kugelgelenk
FR2800817B1 (fr) Joint homocinetique tripode
IT1313881B1 (it) Giunto omocinetico
DE69918758D1 (de) Bleifreies lot
DE60004380D1 (de) Gelenkanordnung
DE60040731D1 (de) Verbindungspanel mit hoher dichte
DE60011594D1 (de) Anschlussprofil
DE60017010D1 (de) Schraube mit hoher Festigkeit
DE60038769D1 (de) Optoelektronisches bauelement
DE60011555D1 (de) Lötmaschine
DE50011568D1 (de) Endoskop mit verstellbarem bauelement
NO20021815D0 (no) Forbindelse
FR2796684B1 (fr) Joint de transmission
DE50009975D1 (de) Kugelgelenk
DE60009043D1 (de) Umwandler mit resonanten schaltungselementen
ATA188599A (de) Fugenschiene
DE60045904D1 (de) Pastikverpacktes optoelektronisches Bauelement
DE50011005D1 (de) Zusammengesetztes Bauteil
DE60031553D1 (de) Optsche mediaplatten mit hoher datendichte
DE10084565T1 (de) Verbindungsorgan
DE69931486D1 (de) Homokinetisches gelenk
ATA131698A (de) Gelenkanordnung
DE29910237U1 (de) Gelenkpfanne
GB0008534D0 (en) Bridge gantry with swing beam

Legal Events

Date Code Title Description
8364 No opposition during term of opposition