DE60018893D1 - Lösung zum galvanischen Abscheiden einer Zinn-Indium-Legierung - Google Patents

Lösung zum galvanischen Abscheiden einer Zinn-Indium-Legierung

Info

Publication number
DE60018893D1
DE60018893D1 DE60018893T DE60018893T DE60018893D1 DE 60018893 D1 DE60018893 D1 DE 60018893D1 DE 60018893 T DE60018893 T DE 60018893T DE 60018893 T DE60018893 T DE 60018893T DE 60018893 D1 DE60018893 D1 DE 60018893D1
Authority
DE
Germany
Prior art keywords
tin
indium alloy
solution
indium
alloy plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60018893T
Other languages
English (en)
Other versions
DE60018893T2 (de
Inventor
Takaaki Tamura
Kyoko Tsunoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon MacDermid Co Ltd
Original Assignee
Nippon MacDermid Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon MacDermid Co Ltd filed Critical Nippon MacDermid Co Ltd
Publication of DE60018893D1 publication Critical patent/DE60018893D1/de
Application granted granted Critical
Publication of DE60018893T2 publication Critical patent/DE60018893T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
DE60018893T 2000-01-17 2000-10-23 Lösung zum galvanischen Abscheiden einer Zinn-Indium-Legierung Expired - Lifetime DE60018893T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000010288 2000-01-17
JP2000010288A JP2001200387A (ja) 2000-01-17 2000-01-17 錫−インジウム合金電気めっき浴

Publications (2)

Publication Number Publication Date
DE60018893D1 true DE60018893D1 (de) 2005-04-28
DE60018893T2 DE60018893T2 (de) 2005-07-28

Family

ID=18538325

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60018893T Expired - Lifetime DE60018893T2 (de) 2000-01-17 2000-10-23 Lösung zum galvanischen Abscheiden einer Zinn-Indium-Legierung

Country Status (8)

Country Link
US (1) US6331240B1 (de)
EP (1) EP1116804B1 (de)
JP (1) JP2001200387A (de)
CN (1) CN1165639C (de)
AT (1) ATE291650T1 (de)
DE (1) DE60018893T2 (de)
ES (1) ES2235790T3 (de)
TW (1) TW538144B (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005060822A (ja) * 2003-08-08 2005-03-10 Rohm & Haas Electronic Materials Llc 複合基体の電気メッキ
JP5497261B2 (ja) 2006-12-15 2014-05-21 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． インジウム組成物
US20090188808A1 (en) * 2008-01-29 2009-07-30 Jiaxiong Wang Indium electroplating baths for thin layer deposition
EP2848714B1 (de) 2008-04-22 2016-11-23 Rohm and Haas Electronic Materials LLC Verfahren zum Nachfüllen von Indiumionen in Indium-Elektroplattierzusammensetzungen
RU2458188C1 (ru) * 2011-06-16 2012-08-10 Георгий Иосифович Медведев Способ электроосаждения сплава олово-индий
CN102424995A (zh) * 2011-12-17 2012-04-25 张家港舒马克电梯安装维修服务有限公司镀锌分公司 一种锡-铟合金电镀液
US10879156B2 (en) 2016-03-08 2020-12-29 Washington State University Mitigation of whisker growth in tin coatings by alloying with indium
US9809892B1 (en) 2016-07-18 2017-11-07 Rohm And Haas Electronic Materials Llc Indium electroplating compositions containing 1,10-phenanthroline compounds and methods of electroplating indium
WO2019125951A1 (en) 2017-12-18 2019-06-27 New Mexico Tech University Research Park Corporation Tin-indium alloy electroplating solution
RU2768620C1 (ru) * 2021-06-30 2022-03-24 Федеральное государственное бюджетное образовательное учреждение высшего образования "Чувашский государственный университет имени И.Н. Ульянова" Способ получения медной проволоки с покрытием на основе сплава олово-индий
RU2769855C1 (ru) * 2021-06-30 2022-04-07 Федеральное государственное бюджетное образовательное учреждение высшего образования "Чувашский государственный университет имени И.Н. Ульянова" Безфлюсовый способ получения луженой медной проволоки с покрытием сплавом на основе олова и индия

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1176787A (en) * 1968-04-08 1970-01-07 Vandervell Products Ltd Improvements in or relating to Methods of Electrolytically Plating a Substrate With Indium.
JP3279353B2 (ja) * 1992-09-25 2002-04-30 ディップソール株式会社 錫−亜鉛合金電気めっき浴
US6210556B1 (en) * 1998-02-12 2001-04-03 Learonal, Inc. Electrolyte and tin-silver electroplating process

Also Published As

Publication number Publication date
TW538144B (en) 2003-06-21
EP1116804A3 (de) 2004-01-28
DE60018893T2 (de) 2005-07-28
ATE291650T1 (de) 2005-04-15
JP2001200387A (ja) 2001-07-24
CN1165639C (zh) 2004-09-08
EP1116804B1 (de) 2005-03-23
CN1314501A (zh) 2001-09-26
US6331240B1 (en) 2001-12-18
EP1116804A2 (de) 2001-07-18
ES2235790T3 (es) 2005-07-16

Similar Documents

Publication Publication Date Title
DE60018893D1 (de) Lösung zum galvanischen Abscheiden einer Zinn-Indium-Legierung
US3475292A (en) Gold plating bath and process
ZA896403B (en) Plating
ATE356229T1 (de) Lösung zur stromlosen nickel-plattierung
ATE521734T1 (de) Cyanidfreies pyrophosphorsäure-bad zum elektrolytischen abscheiden von kupfer- zinnlegierungsüberzügen
CN101532152B (zh) 钴-钨-铁-镍合金电镀液
DE60029549D1 (de) Lösung für das Elektroplattieren einer glänzenden Zinn-Kupfer-Legierung
GB718574A (en) Bath for the deposit of gold alloys by electroplating
NO131468B (de)
ES472902A1 (es) Procedimiento de obtencion de una solucion acuosa de comple-jo sulfitico de oro monovalente y de amonio
BR0010358A (pt) Revestimento com liga
JPS56116894A (en) Neutral tin electroplating bath for obtaining dense plated coating
SE8002598L (sv) Silver- och silver/guld-pleteringsbad
SE7812869L (sv) Surt zinkelektropleteringsforfarande och komposition
GB1420578A (en) Selective stripping composition for metal coatings
ES472577A1 (es) Procedimiento para obtener depositos de galvanoplastia de cinc de lustrosos a brillantes
EP0384679B1 (de) Elektroplattierung von Gold enthaltenden Legierungen
GB1304424A (de)
ATE223979T1 (de) Wässrige lösung zur elektrolytischen abscheidung von zinn-zink-legierungen
GB1438552A (en) Electrodeposition of bright nickel-iron or nickel-cobalt- iron deposits
JPH06146058A (ja) パラジウム・インジウム合金めっき浴
JPS6169997A (ja) 金属塩水溶液
JPS5462933A (en) Nickel electroplating method
CN105463529A (zh) 一种装饰性铜锌合金镀液
GB621217A (en) Improvements in copper-tin alloy plating

Legal Events

Date Code Title Description
8364 No opposition during term of opposition