GB1176787A - Improvements in or relating to Methods of Electrolytically Plating a Substrate With Indium. - Google Patents
Improvements in or relating to Methods of Electrolytically Plating a Substrate With Indium.Info
- Publication number
- GB1176787A GB1176787A GB1683068A GB1683068A GB1176787A GB 1176787 A GB1176787 A GB 1176787A GB 1683068 A GB1683068 A GB 1683068A GB 1683068 A GB1683068 A GB 1683068A GB 1176787 A GB1176787 A GB 1176787A
- Authority
- GB
- United Kingdom
- Prior art keywords
- indium
- plating
- acid
- bath
- relating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/54—Electroplating: Baths therefor from solutions of metals not provided for in groups C25D3/04 - C25D3/50
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
1,176,787. Electro-plating with indium. VANDERVELL PRODUCTS Ltd. April 8, 1968 No.16830/68. Heading C7B. An indium electro-plating bath comprises an aqueous solution of #H 3 to 11, preferably 9.5 to 10À5, containing indium e.g. as the trichloride, and nitrilotriacetic acid in a mole ratio of this acid to indium compound of substantially 2À1 or more, and gluconic acid, glucono-delta-lactone or a salt of glyconic acid. Plating is effected using an indium anode of the same area as the cathode at 20 to 60‹ C., typically 20 to 30‹ C., with a current density of 20 to 60 amps/sq. ft. If it is desired to reduce plating on the back of an object, gelatine may be included in the bath to reduce the throwing power. The bath may be used for plating substrates used for bearings.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1683068A GB1176787A (en) | 1968-04-08 | 1968-04-08 | Improvements in or relating to Methods of Electrolytically Plating a Substrate With Indium. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1683068A GB1176787A (en) | 1968-04-08 | 1968-04-08 | Improvements in or relating to Methods of Electrolytically Plating a Substrate With Indium. |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1176787A true GB1176787A (en) | 1970-01-07 |
Family
ID=10084457
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1683068A Expired GB1176787A (en) | 1968-04-08 | 1968-04-08 | Improvements in or relating to Methods of Electrolytically Plating a Substrate With Indium. |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1176787A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1116804A2 (en) * | 2000-01-17 | 2001-07-18 | Nippon MacDermid Co., Ltd. | Tin-indium alloy electroplating solution |
CN100427647C (en) * | 2005-10-14 | 2008-10-22 | 田鹏 | Thin electroplating solution of metal indium chloride/1-methyl-3-ethyl imidazole chloride |
-
1968
- 1968-04-08 GB GB1683068A patent/GB1176787A/en not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1116804A2 (en) * | 2000-01-17 | 2001-07-18 | Nippon MacDermid Co., Ltd. | Tin-indium alloy electroplating solution |
EP1116804A3 (en) * | 2000-01-17 | 2004-01-28 | Nippon MacDermid Co., Ltd. | Tin-indium alloy electroplating solution |
CN100427647C (en) * | 2005-10-14 | 2008-10-22 | 田鹏 | Thin electroplating solution of metal indium chloride/1-methyl-3-ethyl imidazole chloride |
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