DE60016060D1 - Licht sendendes/empfangendes Modul - Google Patents

Licht sendendes/empfangendes Modul

Info

Publication number
DE60016060D1
DE60016060D1 DE60016060T DE60016060T DE60016060D1 DE 60016060 D1 DE60016060 D1 DE 60016060D1 DE 60016060 T DE60016060 T DE 60016060T DE 60016060 T DE60016060 T DE 60016060T DE 60016060 D1 DE60016060 D1 DE 60016060D1
Authority
DE
Germany
Prior art keywords
receiving module
light sending
sending
light
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60016060T
Other languages
English (en)
Inventor
Hiromi Nakanishi
Yoshiki Kuhara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NHK Spring Co Ltd
Sumitomo Electric Industries Ltd
Original Assignee
NHK Spring Co Ltd
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NHK Spring Co Ltd, Sumitomo Electric Industries Ltd filed Critical NHK Spring Co Ltd
Application granted granted Critical
Publication of DE60016060D1 publication Critical patent/DE60016060D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12133—Functions
    • G02B2006/12164—Multiplexing; Demultiplexing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
DE60016060T 1999-02-09 2000-02-04 Licht sendendes/empfangendes Modul Expired - Lifetime DE60016060D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP03085599A JP3637228B2 (ja) 1999-02-09 1999-02-09 光送受信モジュール

Publications (1)

Publication Number Publication Date
DE60016060D1 true DE60016060D1 (de) 2004-12-30

Family

ID=12315339

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60016060T Expired - Lifetime DE60016060D1 (de) 1999-02-09 2000-02-04 Licht sendendes/empfangendes Modul

Country Status (5)

Country Link
US (1) US6318908B1 (de)
EP (1) EP1028339B1 (de)
JP (1) JP3637228B2 (de)
CA (1) CA2297522A1 (de)
DE (1) DE60016060D1 (de)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001028459A (ja) * 1999-05-13 2001-01-30 Sumitomo Electric Ind Ltd 発光装置およびその製造方法
JP2001021775A (ja) * 1999-07-09 2001-01-26 Sumitomo Electric Ind Ltd 光学装置
JP2001133645A (ja) * 1999-11-04 2001-05-18 Nec Corp 光導波路モジュールにおける迷光遮光構造及びそれを用いた光送受信モジュール
JP2001264593A (ja) * 2000-03-22 2001-09-26 Sumitomo Electric Ind Ltd 光装置
JP3769180B2 (ja) * 2000-09-26 2006-04-19 株式会社東芝 発光ダイオード駆動回路およびそれを用いた光送信モジュール
US6535683B1 (en) 2000-10-06 2003-03-18 Adc Telecommunications, Inc. Cable exit trough with cover
US6712529B2 (en) * 2000-12-11 2004-03-30 Rohm Co., Ltd. Infrared data communication module and method of making the same
JP2002277676A (ja) * 2001-03-16 2002-09-25 Nippon Sheet Glass Co Ltd 光モジュール及びその組み立て方法
US7072590B2 (en) * 2001-03-26 2006-07-04 Avago Technologies General Ip Pte. Ltd. Fiber optic receiver with an adjustable bandwidth post-amplifier
JP2002299699A (ja) * 2001-03-30 2002-10-11 Sumitomo Electric Ind Ltd 発光装置およびその製造方法
US6837627B2 (en) 2001-04-25 2005-01-04 Sumitomo Electric Industries, Ltd. Optical communication module
JP3822080B2 (ja) * 2001-09-27 2006-09-13 富士通株式会社 レセプタクル型光モジュール及びその生産方法
JP2003142699A (ja) * 2001-11-06 2003-05-16 Sumitomo Electric Ind Ltd サブマウント及びこれを用いた光受信器
JP3862559B2 (ja) * 2001-11-30 2006-12-27 シャープ株式会社 光送受信モジュールおよび電子機器
JP3750649B2 (ja) * 2001-12-25 2006-03-01 住友電気工業株式会社 光通信装置
JP3937911B2 (ja) * 2002-05-10 2007-06-27 住友電気工業株式会社 光送受信モジュール及びこれを用いた光通信システム
TW561719B (en) * 2002-05-31 2003-11-11 Gigno Technology Co Ltd Electric apparatus
JP3896905B2 (ja) * 2002-06-18 2007-03-22 住友電気工業株式会社 光通信装置
JP2004031573A (ja) * 2002-06-25 2004-01-29 Oki Electric Ind Co Ltd 光送受信モジュール
JP4352661B2 (ja) * 2002-07-25 2009-10-28 住友電気工業株式会社 光モジュール
US6822879B2 (en) 2002-08-06 2004-11-23 Emcore Corporation Embedded electromagnetic interference shield
JP4007118B2 (ja) * 2002-08-12 2007-11-14 住友電気工業株式会社 発光デバイス、光モジュール、およびグレーティングチップ
JPWO2004042444A1 (ja) * 2002-11-08 2006-03-09 Tdk株式会社 光モジュール及びその製造方法
JP2004198719A (ja) * 2002-12-18 2004-07-15 Tdk Corp 光モジュール及びその製造方法
JP4153914B2 (ja) * 2003-01-27 2008-09-24 日本碍子株式会社 光デバイス
DE50310240D1 (de) * 2003-02-04 2008-09-11 Avago Tech Fiber Ip Sg Pte Ltd Modulares optoelektronisches Bauelement
JP3979396B2 (ja) * 2003-03-07 2007-09-19 住友電気工業株式会社 光モジュール及びその製造方法
US6856717B2 (en) * 2003-03-24 2005-02-15 Hymite A/S Package with a light emitting device
KR20050025387A (ko) * 2003-09-06 2005-03-14 한국전자통신연구원 전기적 혼신이 감소된 광송수신기
TWM241892U (en) * 2003-10-03 2004-08-21 Foci Fiber Optic Communication A silicon optical bench based bi-directional transceiver module
US7111994B2 (en) * 2004-03-24 2006-09-26 Avago Technologies Fiber Ip (Singapore) Ptd. Ltd. Integral insert molded fiber optic transceiver electromagnetic interference shield
US7447439B2 (en) * 2004-05-07 2008-11-04 Enablence Inc. Optical duplexer and optical triplexer
US20050278936A1 (en) * 2004-06-18 2005-12-22 Nikolaus Schunk Optoelectronic apparatus with a shielding cage, and methods for production of an optoelectronic apparatus with a shielding cage.
JP4828103B2 (ja) * 2004-07-28 2011-11-30 三菱電機株式会社 光送受信モジュール
WO2006090847A1 (ja) * 2005-02-25 2006-08-31 Fujitsu Limited 光送受信装置
JP2007294615A (ja) * 2006-04-24 2007-11-08 Rohm Co Ltd 光通信モジュール
JP5261715B2 (ja) * 2008-03-24 2013-08-14 独立行政法人産業技術総合研究所 光導波路基板の製造方法
WO2016041179A1 (zh) * 2014-09-18 2016-03-24 华为技术有限公司 用于阻断串扰的材料、光组件和所述材料的制作方法
US9857542B2 (en) 2015-04-24 2018-01-02 Nanoprecision Products, Inc. Bidirectional optical transceiver module
CN111869136B (zh) * 2018-03-15 2022-03-29 华为技术有限公司 光接收、组合收发组件、组合光模块、olt及pon系统
JP2019181583A (ja) * 2018-04-03 2019-10-24 セイコーエプソン株式会社 ロボット、プリンターおよび光信号伝送装置
CN111865429B (zh) * 2019-04-30 2022-05-27 深圳市聚飞光电股份有限公司 光电接收器及光电接收器的制作方法
US20230420909A1 (en) * 2020-11-13 2023-12-28 Rohm Co., Ltd. Semiconductor light-emitting device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4904036A (en) * 1988-03-03 1990-02-27 American Telephone And Telegraph Company, At&T Bell Laboratories Subassemblies for optoelectronic hybrid integrated circuits
US5309321A (en) * 1992-09-22 1994-05-03 Microelectronics And Computer Technology Corporation Thermally conductive screen mesh for encapsulated integrated circuit packages
DE69620515T2 (de) * 1995-07-26 2002-08-14 Sumitomo Electric Industries Photodioden/Diodenlaser-Baustein und Photodioden-Baustein
US5838551A (en) * 1996-08-01 1998-11-17 Northern Telecom Limited Electronic package carrying an electronic component and assembly of mother board and electronic package
US5937114A (en) * 1997-07-21 1999-08-10 Hewlett-Packard Company Micro-photonics module with a partition wall
JPH11125731A (ja) * 1997-10-22 1999-05-11 Nec Corp 単芯アレイ変換光装置
JP3767156B2 (ja) 1998-02-23 2006-04-19 住友電気工業株式会社 光送受信モジュ−ル

Also Published As

Publication number Publication date
JP3637228B2 (ja) 2005-04-13
EP1028339A2 (de) 2000-08-16
CA2297522A1 (en) 2000-08-09
EP1028339B1 (de) 2004-11-24
JP2000228555A (ja) 2000-08-15
US6318908B1 (en) 2001-11-20
EP1028339A3 (de) 2002-01-23

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Legal Events

Date Code Title Description
8332 No legal effect for de