DE60011091T2 - Siebdruckvorrichtung - Google Patents

Siebdruckvorrichtung Download PDF

Info

Publication number
DE60011091T2
DE60011091T2 DE60011091T DE60011091T DE60011091T2 DE 60011091 T2 DE60011091 T2 DE 60011091T2 DE 60011091 T DE60011091 T DE 60011091T DE 60011091 T DE60011091 T DE 60011091T DE 60011091 T2 DE60011091 T2 DE 60011091T2
Authority
DE
Germany
Prior art keywords
screen printing
pasty product
chamber
flow
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60011091T
Other languages
German (de)
English (en)
Other versions
DE60011091D1 (de
Inventor
John Philip Weymouth LAMBERT
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASM Assembly Systems Switzerland GmbH
Original Assignee
DEK International GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DEK International GmbH filed Critical DEK International GmbH
Publication of DE60011091D1 publication Critical patent/DE60011091D1/de
Application granted granted Critical
Publication of DE60011091T2 publication Critical patent/DE60011091T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/40—Inking units
    • B41F15/42—Inking units comprising squeegees or doctors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Screen Printers (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Paper (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Dot-Matrix Printers And Others (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
DE60011091T 1999-07-19 2000-07-19 Siebdruckvorrichtung Expired - Lifetime DE60011091T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB9916906 1999-07-19
GB9916906A GB2352209A (en) 1999-07-19 1999-07-19 Improvements relating to screen printing
PCT/GB2000/002781 WO2001005592A1 (en) 1999-07-19 2000-07-19 Improvements relating to screen printing

Publications (2)

Publication Number Publication Date
DE60011091D1 DE60011091D1 (de) 2004-07-01
DE60011091T2 true DE60011091T2 (de) 2005-05-25

Family

ID=10857510

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60011091T Expired - Lifetime DE60011091T2 (de) 1999-07-19 2000-07-19 Siebdruckvorrichtung

Country Status (8)

Country Link
US (1) US6746710B1 (enExample)
EP (1) EP1202862B1 (enExample)
JP (1) JP4831904B2 (enExample)
AT (1) ATE267702T1 (enExample)
CA (1) CA2379904A1 (enExample)
DE (1) DE60011091T2 (enExample)
GB (1) GB2352209A (enExample)
WO (1) WO2001005592A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3646603B2 (ja) * 2000-02-17 2005-05-11 松下電器産業株式会社 スクリーン印刷装置およびスクリーン印刷方法
JP4156227B2 (ja) * 2001-11-02 2008-09-24 松下電器産業株式会社 スクリーン印刷装置
FR2881077B1 (fr) 2005-01-27 2007-06-29 Novatec Sa Sa Soc Dispositif de transfert par serigraphie
GB2437070B (en) * 2006-04-10 2011-12-14 Dek Int Gmbh Screen printing head and system
JP2010507913A (ja) * 2006-10-24 2010-03-11 コミサリア、ア、レネルジ、アトミク−セーエーアー メタライゼーション装置および方法
KR100861611B1 (ko) * 2006-11-14 2008-10-07 삼성전기주식회사 인쇄 장치
US7980445B2 (en) * 2008-01-23 2011-07-19 International Business Machines Corporation Fill head for full-field solder coverage with a rotatable member
GB2458313B (en) 2008-03-13 2012-05-23 Dek Int Gmbh Print head assembly, screen printing system and method
DE102008041423B4 (de) * 2008-08-21 2015-04-16 Fmp Technology Gmbh Fluid Measurements & Projects Beschichtungswerkzeug zum Auftragen eines Flüssigkeitsfilms auf ein Substrat
EP2571341A4 (en) * 2011-04-27 2013-12-11 Panasonic Corp REUSE PULP, AND METHOD FOR MANUFACTURING THE SAME
JP4973796B1 (ja) * 2011-04-27 2012-07-11 パナソニック株式会社 配線基板の製造方法
US20130153138A1 (en) * 2011-07-27 2013-06-20 Panasonic Corporation Method of manufacturing reuse paste, reuse paste and method of manufacturing circuit board using reuse paste
KR20130022184A (ko) * 2011-08-25 2013-03-06 삼성전자주식회사 스퀴즈장치
JP6251012B2 (ja) * 2013-11-18 2017-12-20 株式会社ケー・アイ・エス パターン形成装置
TWI558574B (zh) * 2014-12-05 2016-11-21 Metal Ind Res & Dev Ct Slit Scraper Structure
CN110421965A (zh) * 2019-08-14 2019-11-08 协鑫集成科技股份有限公司 刮刀装置和太阳能电池片丝网印刷机
EP3988312A1 (en) 2020-10-23 2022-04-27 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO Device and method of filling grooves

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1009740A (en) 1963-07-19 1965-11-10 Bradford Dyers Ass Ltd Stencil-printing machines
NL7403192A (nl) * 1974-03-08 1975-09-10 Stork Brabant Bv Verftoevoerelement voor een rotatie zeefdruk machine.
DE3238084A1 (de) * 1982-10-14 1984-04-26 Mathias 4815 Schloss Holte Mitter Vorrichtung zum gleichmaessigen zufuehren, verteilen und auftragen einer verschaeumten auftragsflotte auf eine vorzugsweise textile warenbahn od.dgl.
US4622239A (en) 1986-02-18 1986-11-11 At&T Technologies, Inc. Method and apparatus for dispensing viscous materials
JP3099447B2 (ja) * 1991-09-02 2000-10-16 松下電器産業株式会社 塗布装置及び方法並びに印刷装置及び方法
JPH0675747U (ja) * 1993-04-09 1994-10-25 オリンパス光学工業株式会社 ハンダ印刷用スキージ
DE69517824T2 (de) 1994-12-27 2001-02-22 Ford Motor Co. Ltd., Brentwood Verfahren und vorrichtung zum abgeben eines viskosen materials
US5824155A (en) * 1995-11-08 1998-10-20 Ford Motor Company Method and apparatus for dispensing viscous material
FR2754474B1 (fr) 1996-10-15 1999-04-30 Novatec Dispositif pour le depot d'un produit visqueux ou pateux sur un substrat a travers les ouvertures d'un pochoir
JP2000202988A (ja) * 1999-01-14 2000-07-25 Ricoh Microelectronics Co Ltd 印刷剤充填装置

Also Published As

Publication number Publication date
JP2003504249A (ja) 2003-02-04
JP4831904B2 (ja) 2011-12-07
EP1202862B1 (en) 2004-05-26
US6746710B1 (en) 2004-06-08
DE60011091D1 (de) 2004-07-01
WO2001005592A1 (en) 2001-01-25
GB2352209A (en) 2001-01-24
ATE267702T1 (de) 2004-06-15
EP1202862A1 (en) 2002-05-08
GB9916906D0 (en) 1999-09-22
CA2379904A1 (en) 2001-01-25

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