DE60009324T2 - Echtzeit-fehlererkennung - Google Patents

Echtzeit-fehlererkennung Download PDF

Info

Publication number
DE60009324T2
DE60009324T2 DE60009324T DE60009324T DE60009324T2 DE 60009324 T2 DE60009324 T2 DE 60009324T2 DE 60009324 T DE60009324 T DE 60009324T DE 60009324 T DE60009324 T DE 60009324T DE 60009324 T2 DE60009324 T2 DE 60009324T2
Authority
DE
Germany
Prior art keywords
interface
error detection
detection unit
data
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60009324T
Other languages
German (de)
English (en)
Other versions
DE60009324D1 (de
Inventor
Lee Michael MILLER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GlobalFoundries Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of DE60009324D1 publication Critical patent/DE60009324D1/de
Application granted granted Critical
Publication of DE60009324T2 publication Critical patent/DE60009324T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/04—Programme control other than numerical control, i.e. in sequence controllers or logic controllers
    • G05B19/042—Programme control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4184—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by fault tolerance, reliability of production system
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/20—Pc systems
    • G05B2219/24—Pc safety
    • G05B2219/24042—Signature analysis, compare recorded with current data, if error then alarm
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/20—Pc systems
    • G05B2219/24—Pc safety
    • G05B2219/24053—Diagnostic of controlled machine
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/20—Pc systems
    • G05B2219/24—Pc safety
    • G05B2219/24065—Real time diagnostics
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32181—Monitor production, assembly apparatus with multiple sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Quality & Reliability (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • General Factory Administration (AREA)
  • Numerical Control (AREA)
DE60009324T 1999-09-09 2000-05-19 Echtzeit-fehlererkennung Expired - Lifetime DE60009324T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US393176 1995-02-23
US09/393,176 US6556881B1 (en) 1999-09-09 1999-09-09 Method and apparatus for integrating near real-time fault detection in an APC framework
PCT/US2000/013724 WO2001018623A1 (en) 1999-09-09 2000-05-19 Real-time fault detection

Publications (2)

Publication Number Publication Date
DE60009324D1 DE60009324D1 (de) 2004-04-29
DE60009324T2 true DE60009324T2 (de) 2005-02-24

Family

ID=23553601

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60009324T Expired - Lifetime DE60009324T2 (de) 1999-09-09 2000-05-19 Echtzeit-fehlererkennung

Country Status (6)

Country Link
US (1) US6556881B1 (enExample)
EP (1) EP1218807B1 (enExample)
JP (1) JP4768942B2 (enExample)
KR (1) KR100626859B1 (enExample)
DE (1) DE60009324T2 (enExample)
WO (1) WO2001018623A1 (enExample)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7069101B1 (en) * 1999-07-29 2006-06-27 Applied Materials, Inc. Computer integrated manufacturing techniques
US6697691B1 (en) * 2000-01-03 2004-02-24 Advanced Micro Devices, Inc. Method and apparatus for fault model analysis in manufacturing tools
US6725402B1 (en) * 2000-07-31 2004-04-20 Advanced Micro Devices, Inc. Method and apparatus for fault detection of a processing tool and control thereof using an advanced process control (APC) framework
US7188142B2 (en) 2000-11-30 2007-03-06 Applied Materials, Inc. Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility
US20020192966A1 (en) * 2001-06-19 2002-12-19 Shanmugasundram Arulkumar P. In situ sensor based control of semiconductor processing procedure
US7160739B2 (en) 2001-06-19 2007-01-09 Applied Materials, Inc. Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
US7201936B2 (en) 2001-06-19 2007-04-10 Applied Materials, Inc. Method of feedback control of sub-atmospheric chemical vapor deposition processes
US7698012B2 (en) 2001-06-19 2010-04-13 Applied Materials, Inc. Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
US7082345B2 (en) * 2001-06-19 2006-07-25 Applied Materials, Inc. Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities
US6913938B2 (en) 2001-06-19 2005-07-05 Applied Materials, Inc. Feedback control of plasma-enhanced chemical vapor deposition processes
US7101799B2 (en) 2001-06-19 2006-09-05 Applied Materials, Inc. Feedforward and feedback control for conditioning of chemical mechanical polishing pad
US6910947B2 (en) * 2001-06-19 2005-06-28 Applied Materials, Inc. Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life
US7047099B2 (en) * 2001-06-19 2006-05-16 Applied Materials Inc. Integrating tool, module, and fab level control
US7337019B2 (en) 2001-07-16 2008-02-26 Applied Materials, Inc. Integration of fault detection with run-to-run control
US6950716B2 (en) * 2001-08-13 2005-09-27 Applied Materials, Inc. Dynamic control of wafer processing paths in semiconductor manufacturing processes
US6984198B2 (en) * 2001-08-14 2006-01-10 Applied Materials, Inc. Experiment management system, method and medium
US20030037090A1 (en) * 2001-08-14 2003-02-20 Koh Horne L. Tool services layer for providing tool service functions in conjunction with tool functions
US6732006B2 (en) 2002-02-06 2004-05-04 Asm International Nv Method and system to process semiconductor wafers
US8180587B2 (en) * 2002-03-08 2012-05-15 Globalfoundries Inc. System for brokering fault detection data
US7225047B2 (en) 2002-03-19 2007-05-29 Applied Materials, Inc. Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements
US7668702B2 (en) * 2002-07-19 2010-02-23 Applied Materials, Inc. Method, system and medium for controlling manufacturing process using adaptive models based on empirical data
US6999836B2 (en) * 2002-08-01 2006-02-14 Applied Materials, Inc. Method, system, and medium for handling misrepresentative metrology data within an advanced process control system
US20040063224A1 (en) * 2002-09-18 2004-04-01 Applied Materials, Inc. Feedback control of a chemical mechanical polishing process for multi-layered films
AU2003290932A1 (en) 2002-11-15 2004-06-15 Applied Materials, Inc. Method, system and medium for controlling manufacture process having multivariate input parameters
US6912433B1 (en) * 2002-12-18 2005-06-28 Advanced Mirco Devices, Inc. Determining a next tool state based on fault detection information
US8359494B2 (en) 2002-12-18 2013-01-22 Globalfoundries Inc. Parallel fault detection
TWI284846B (en) * 2002-12-24 2007-08-01 Powerchip Semiconductor Corp Semiconductor automation system for a daily check and method thereof
US7333871B2 (en) 2003-01-21 2008-02-19 Applied Materials, Inc. Automated design and execution of experiments with integrated model creation for semiconductor manufacturing tools
US7205228B2 (en) * 2003-06-03 2007-04-17 Applied Materials, Inc. Selective metal encapsulation schemes
US7354332B2 (en) 2003-08-04 2008-04-08 Applied Materials, Inc. Technique for process-qualifying a semiconductor manufacturing tool using metrology data
US7138897B2 (en) * 2003-10-15 2006-11-21 Schlumberger Technology Corporation Induction measurements with reduced borehole effects
US7356377B2 (en) 2004-01-29 2008-04-08 Applied Materials, Inc. System, method, and medium for monitoring performance of an advanced process control system
US6980873B2 (en) 2004-04-23 2005-12-27 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for real-time fault detection, classification, and correction in a semiconductor manufacturing environment
US7437404B2 (en) * 2004-05-20 2008-10-14 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for improving equipment communication in semiconductor manufacturing equipment
US6961626B1 (en) 2004-05-28 2005-11-01 Applied Materials, Inc Dynamic offset and feedback threshold
US7096085B2 (en) 2004-05-28 2006-08-22 Applied Materials Process control by distinguishing a white noise component of a process variance
US7680556B2 (en) * 2004-11-15 2010-03-16 Tech Semiconductor Singapore Pte. Ltd. Method for data collection during manufacturing processes
US7477960B2 (en) * 2005-02-16 2009-01-13 Tokyo Electron Limited Fault detection and classification (FDC) using a run-to-run controller
KR100699856B1 (ko) * 2005-07-29 2007-03-27 삼성전자주식회사 반도체소자를 제조하는 공정의 제어시스템 및 이를 이용한제어방법
US8276159B2 (en) 2009-09-23 2012-09-25 Microsoft Corporation Message communication of sensor and other data
CN103630852B (zh) * 2013-12-17 2016-05-18 奇瑞汽车股份有限公司 一种智能前照灯系统故障处理方法及装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4849088A (enExample) * 1971-10-22 1973-07-11
DE3043827A1 (de) * 1980-11-20 1982-06-03 Gildemeister Ag, 4800 Bielefeld Verfahren und vorrichtung zum ueberwachen der bearbeitungsbedinungen an einer werkzeugmaschine
JPH0745489A (ja) * 1993-08-02 1995-02-14 Hitachi Ltd 半導体製造システム及びネットワークアダプタ
US5526293A (en) 1993-12-17 1996-06-11 Texas Instruments Inc. System and method for controlling semiconductor wafer processing
US5563798A (en) 1994-04-05 1996-10-08 Applied Materials, Inc. Wafer positioning system
JPH08203867A (ja) * 1995-01-23 1996-08-09 Hitachi Ltd ワークの処理方法および処理装置
DE19616827C1 (de) * 1996-04-26 1998-01-08 Siemens Ag Verfahren und Applikationseinrichtung zur Anzeige und Alarmierung von Meßwerten an Kommunikationsendgeräten
US5726912A (en) * 1996-09-06 1998-03-10 Honeywell Iac Control system monitor
US5859964A (en) 1996-10-25 1999-01-12 Advanced Micro Devices, Inc. System and method for performing real time data acquisition, process modeling and fault detection of wafer fabrication processes
JPH10141870A (ja) * 1996-11-05 1998-05-29 Kokusai Electric Co Ltd 処理炉の温度監視装置
US5847529A (en) 1997-04-18 1998-12-08 Taiwan Semiconductor Manufacturing Co. Ltd. Robot protection system
US6192287B1 (en) 1997-09-23 2001-02-20 On-Line Technologies, Inc. Method and apparatus for fault detection and control
US6263255B1 (en) * 1998-05-18 2001-07-17 Advanced Micro Devices, Inc. Advanced process control for semiconductor manufacturing
US6195621B1 (en) * 1999-02-09 2001-02-27 Roger L. Bottomfield Non-invasive system and method for diagnosing potential malfunctions of semiconductor equipment components

Also Published As

Publication number Publication date
DE60009324D1 (de) 2004-04-29
EP1218807A1 (en) 2002-07-03
WO2001018623A1 (en) 2001-03-15
JP4768942B2 (ja) 2011-09-07
EP1218807B1 (en) 2004-03-24
US6556881B1 (en) 2003-04-29
JP2003508935A (ja) 2003-03-04
KR100626859B1 (ko) 2006-09-22
KR20020063161A (ko) 2002-08-01

Similar Documents

Publication Publication Date Title
DE60009324T2 (de) Echtzeit-fehlererkennung
DE60127267T2 (de) Verfahren und gerät zur fehlerentdeckung für ein bearbeitungswerkzeug und steuerung dafür mit einer forgeschrittenen prozesssteuerungsstruktur (apc)
DE10007972B4 (de) Diagnosevorrichtung und -verfahren in einem Prozeßsteuersystem
DE112010001370B4 (de) Signalübertragungsvorrichtung für einen Aufzug
EP2364466B1 (de) Integriertes leit- und kontrollsystem für fertigungs- und qualitätssicherungsprozesse in produktionslinien mit bearbeitungsstationen und/oder werkzeugen
DE60005837T2 (de) Herstellungsverfahren einer gedruckten schaltung
DE69402877T2 (de) Verfahren und vorrichtung zur statistischen echtzeitprozessüberwachung eines standpressvorganges
DE10007971A1 (de) Diagnoseexpertensystem zum Einsatz in der Prozesssteuerung
DE4115825A1 (de) Architektur zur werkzeugzustandueberwachung
DE10003462A1 (de) Verfahren und System zum Überwachen einer Industriemaschine
DE112017005867T5 (de) Steuerungsvorrichtung und Motorsteuerungssystem
DE112008000225B4 (de) Netzwerküberwachung mit Kontrollsystemen
DE102022110119B3 (de) Verfahren zur Überprüfung der Funktionsfähigkeit wenigstens einer Prüfvorrichtung zur Prüfung von Schraubwerkzeugen sowie eine Anordnung umfassend wenigstens zwei Prüfvorrichtungen
DE69621078T2 (de) Verfahren und Vorrichtung für ein prüfpunktbasiertes Kommunikationsverarbeitungssystem
EP2394400B1 (de) Konfigurierbare statusverarbeitungseinheit für sensor-aktor-systeme
EP3803727B1 (de) Verfahren und system zum bereitstellen von prozessprotokollen für physische objekte
EP1198103B1 (de) Verfahren zur Adaption von Bussystemen
DE60132719T2 (de) Computersystem zur ferdiagnostik und konfiguration eines feldgerätes
DE102006010779A1 (de) Informationsverarbeitungssystem, bei dem einen aktuellen Zeitpunkt beschreibende Information von einem Computer zu einem anderen Übetragen wird, um bei der Berechnung eines Verzögerungsbetrags der Datenübertragung zwischen den Computern verwendet zu werden
WO2024133521A1 (de) Verfahren, diagnoseeinrichtung und system zum überwachen eines betriebs einer brennkraftmaschine
DE102006056637A1 (de) Ansteuereinheit für Elektromotor
DE102017001171B4 (de) Numerische Steuervorrichtung
WO2022122686A1 (de) Fertigungslinie zur herstellung von halbleiterbauelementen
DE4039013A1 (de) Vorrichtung zur erfassung von informationen ueber fehlfunktionen in einem multiprozessor
DE60100007T2 (de) Verfahren zum Analysieren einer Test-Software

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: GLOBALFOUNDRIES INC. MAPLES CORPORATE SERVICES, KY