WO2001018623A1 - Real-time fault detection - Google Patents

Real-time fault detection Download PDF

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Publication number
WO2001018623A1
WO2001018623A1 PCT/US2000/013724 US0013724W WO0118623A1 WO 2001018623 A1 WO2001018623 A1 WO 2001018623A1 US 0013724 W US0013724 W US 0013724W WO 0118623 A1 WO0118623 A1 WO 0118623A1
Authority
WO
WIPO (PCT)
Prior art keywords
interface
fault detection
data
operational data
detection unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2000/013724
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English (en)
French (fr)
Inventor
Michael Lee Miller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Priority to EP00932585A priority Critical patent/EP1218807B1/en
Priority to DE60009324T priority patent/DE60009324T2/de
Priority to JP2001522153A priority patent/JP4768942B2/ja
Publication of WO2001018623A1 publication Critical patent/WO2001018623A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/04—Programme control other than numerical control, i.e. in sequence controllers or logic controllers
    • G05B19/042—Programme control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4184—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by fault tolerance, reliability of production system
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/20—Pc systems
    • G05B2219/24—Pc safety
    • G05B2219/24042—Signature analysis, compare recorded with current data, if error then alarm
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/20—Pc systems
    • G05B2219/24—Pc safety
    • G05B2219/24053—Diagnostic of controlled machine
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/20—Pc systems
    • G05B2219/24—Pc safety
    • G05B2219/24065—Real time diagnostics
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32181—Monitor production, assembly apparatus with multiple sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Definitions

  • TECHNICAL FIELD This invention relates generally to semiconductor fabrication technology, and, more particularly, to a method and apparatus for integrating near real-time fault detection capability into an Advanced Process Control (APC) framework.
  • API Advanced Process Control
  • the present invention is directed to overcoming, or at least reducing the effects of, one or more of the problems set forth above.
  • a method for fault detection in a manufacturing process.
  • the method comprises receiving operational data from a processing tool related to the manufacture of a processing piece at a first interface, sending the operational data from the first interface to a fault detection unit as the data is received by the first interface, and determining if a fault condition exists with the processing tool at the fault detection unit.
  • a system for fault detection in a manufacturing process.
  • the system comprises a processing tool adapted to manufacture a processing piece.
  • a first interface coupled to the processing tool, is adapted to receive operational data from the processing tool related to the manufacture of the processing piece.
  • a fault detection unit is provided to determine if a fault condition exists with the processing tool.
  • the system further includes a framework adapted to receive the operational data from the first interface, and to send the data to the fault detection unit as the data is received by the first interface.
  • Figure 1 illustrates a manufacturing system, including an APC framework, for providing near real-time fault detection of a processing tool in accordance with one embodiment
  • Figure 2 depicts the detail of the APC framework of Figure 1
  • Figure 3 shows a process for providing fault detection in near real-time for the manufacturing system of Figure 1
  • the system 100 includes a processing tool 105, which in the illustrated embodiment is in the form of semiconductor fabrication equipment used to produce a processing piece, such as a silicon wafer, for example It will be appreciated, however, that the processing tool 105 need not necessarily be limited to the production of silicon wafers, but could include other types of manufacturing equipment for producing a variety of different types of commercial products without departing from the spirit and scope of the present invention
  • the processing tool 105 is coupled to an equipment interface (El) 1 10, which retrieves various operational data from the tool 105, and communicates this data to an Advanced Process Control (APC) framework 120 to determine whether the tool 105 is experiencing a faulty operation
  • the equipment interface 1 10 further may receive control signals from the APC framework 120 that could be used to control the tool 105
  • the control signal from the APC framework 120 could be used to shut down the tool 105 if the operational data that was sent by the equipment interface 1 10 was deemed faulty by the APC framework 120
  • An add-on sensor 1 15 could also be coupled to the tool 105 to measure additional operational data that is not ascertained by the tool 105 itself
  • the add-on sensor 1 15 could be used to determine whether the silicon wafer was produced within acceptable operational limits by the tool 105 Such acceptable operational limits of the tool 105 may be to produce the wafer within a certain temperature range, for example
  • the add-on sensor 1 15 may be used to record various other operational parameters, and thus, need not be limited to the aforementioned example
  • the sensor 115 may be embodied as a simple data acquisition program, such as a C++ standalone program acquiring data from a thermocouple vure for example
  • the sensor 1 15 may be embodied as a full fledged LABVIEW application, acquiring data through multiple transducers (not shown) It will further be appreciated that the sensor 1 15 need not be used at all, and the APC framework 120 could rely solely upon the operational data forwarded from the equipment interface 1 10 If used, however, the sensor 115 forwards the additional operational data
  • the fault detection unit 125 compares the received operational data from the APC framework 120 to fault model data
  • the fault model data includes operational data of other similar-type tools, where it was previously known that such tools have operated within acceptable operational limits
  • the types of faults that could be detected by the fault detection unit 125 include processing and/or operational faults in silicon wafer fabrication Examples of processing faults may include, but are not necessarily limited to, non-optimal preheating of the chamber, catastrophic failure where a broken wafer is detected, abnormal N2 flow rate, temperature overshoots at the top of a ramp, tube temperature measurement drifts, etc.
  • Some examples of operational faults detected by the fault detection unit 125 may include interrupted/resumed processing, no wafer sleuth or improper wafer sleuth prior to Rapid Thermal Anneal (RTA), etc
  • the fault detection unit 125 upon evaluating the operational data sent from the APC framework 120 sends the results of potential faults and/or proper operation of the tool 105 to the APC framework 120
  • the APC framework 120 may send control signals to the equipment interface 1 10 to control the processing tool 105 based upon the results forwarded from the fault detection unit 125
  • the control signal from the APC framework 120 may be to shut down the tool 105 to prevent any additional faulty production of wafers (providing this was determined by the fault detection unit 125)
  • Data could also be sent from the APC framework 120 to inform a "fab" technician on how to rectify a faulty condition of the tool 105, if so desired
  • FIG. 2 a more detailed representation of the APC framework 120 is provided The
  • APC framework 120 is a component-based architecture comprised of interchangeable, standardized software components enabling run-to-run control and fault detection of the processing tool 105
  • the APC framework 120 includes a machine interface (Ml) 210 for communication with the tool 103 and the framework 120 to collect operational data therefrom
  • the APC framework 120 further includes a sensor interface (SI) 220 for communication between the add-on sensor 1 15 and the framework 120 The sensor interface 220 also collects operational data of the processing tool 105 through the sensor 1 15
  • a plan executor (PE) 230 (l e a process controller) manages the APC framework 120 and provides possible solutions to problems found with the operational data that was determined by the fault detection unit 125
  • the framework 120 further includes an applications interface (Al) 240 for interfacing with third-party applications that run on the fault detection unit 125 to analyze the operational data received via the machine and sensor interfaces 210, 220
  • the third-party application is the fault detection unit 125
  • a data channel 250 is further provided to allow for communication of
  • the machine interface (MI) 210 couples to the equipment interface 1 10 to serve as an interface between the processing tool 105 and the APC framework 120
  • the machine interface 210 supports the setup, activation monitoring, and data collection of the tool 105
  • the machine interface 210 receives commands, status events and collected data from the equipment interface 1 10 and forwards this information to other components of the APC framework 120, namely the plan executor 230 and applications interface 240 Any responses that are received by the machine interface 210 from the other components of the APC framework 120 are routed to the equipment interface 1 10 for delivery to the processing tool 105 As previously discussed, this may include a control signal from the plan executor 230 to manipulate the tool 105 if a faulty condition is detected
  • the machine interface 210 also reformats and restructures the messages between the specific communications protocol utilized by the equipment interface 1 10 and the Common Object Request Broker Architecture Interface Definition Language (CORBA IDL) communications protocol used by the components of the APC framework 120
  • CORBA IDL Common Object Request Broker Architecture Interface Definition Language
  • the sensor interface 220 couples the add-on sensor 115 to serve as an interface between the add-on sensor 1 15 and the APC framework 120
  • the sensor interface 220 provides setup activation, monitoring, and data collection for the add-on sensor 1 15 Similar to the machine interface 210, the sensor interface 220 also reformats and restructures the messages between the specific communications protocol utilized by the sensor 115 and the CORBA IDL protocol used by the components of the APC framework 120
  • the applications interface 240 supports the integration of third-party tools (e g , commercial software packages, such as Model Ware, MatLab, and Mathematica, for example) to the APC framework 120 Typically, these third-party tools do not provide the standard CORBA IDL protocol known to the APC framework 120, accordingly, the applications interface 240 provides the necessary translation between the communications protocol utilized by the third-party tool and the CORBA protocol used by the APC framework 120
  • third-party tools e g , commercial software packages, such as Model Ware, MatLab, and Mathematica, for example
  • the third-party tool is the fault detection unit 125 for analyzing the operational data of the processing tool 105 that is supplied via the machine interface 210 and the sensor interface 220
  • the fault detection unit 125 includes ModelWare software for providing fault detection, however, it will be appreciated that other commercially available fault detection software could also be used without departing from the spirit and scope of the present invention
  • the plan executor 230 performs control functions based upon the results determined by the fault detection unit 125
  • the applications interface 240 receives the results from the fault detection unit 125, it forwards a copy of the results (usually in the form of an alarm signal) to the plan executor 230
  • the plan executor 230 Upon inspection of the results, the plan executor 230 will attempt to rectify any fault conditions with the tool 105 in a manner well known to those of ordinary skill in the art
  • the solution to a fault condition may be for the plan executor 230 to send a control signal to the machine interface 210 to shut down the tool 105 so as to prevent further manufacturing of faulty silicon wafers
  • the plan executor 230 in addition to shutting down the tool 105, may also apprise a "fab" technician of any potential solutions to rectify the fault condition through an operator interface (not shown), for example
  • the machine interface 210 and the sensor interface 220 usually forward the operational data obtained from the equipment interface 1 10 and sensor 1 15, respectively, to the plan executor 230
  • the plan executor 230 then buffers this operational data until a batch (/ e wafer-to-wafer or lot-to-lot) is completed by the processing tool 105
  • the plan executor 230 sends the accumulated operational data of the processing tool 105 to the applications interface 240 which then sends the data to the fault detection unit 125.
  • the fault detection unit 125 subsequently analyzes the received data and forwards the results back to the applications interface 240, which then forwards the results to the plan executor 230 for appropriate action.
  • a drawback with this typical operation is that the results output from the fault detection unit 125 are usually determined after the batch is completed by the processing tool 105. Accordingly, the plan executor 230 cannot take immediate action to rectify the fault condition, and, thus, numerous faulty wafers could be produced as a result of this delay.
  • the process 300 commences at block 305, where the machine interface 210 and the sensor interface 220 receive operational data of the processing tool 105.
  • the machine interface 210 receives the operational data from the equipment interface 1 10
  • the sensor interface 220 receives the operational data from the add-on sensor 115.
  • the sensor 115 could be omitted, if so desired, in which case the operational data would then come solely from the equipment interface 1 10.
  • the machine and sensor interfaces 210, 220 translate the operational data into a format that is recognizable to the plan executor 230 and application interface 240 of the APC framework 120 in a manner well established in the art. In accordance with one embodiment, this translation involves the reformatting and restructuring of messages between the specific communications protocol used by the equipment interface 1 10 and sensor 1 15 and the CORBA IDL protocol of the APC framework 120. Subsequent to receiving this translated data, the machine and sensor interfaces 210, 220 send the data via the data channel 250 to both the plan executor 230 and the applications interface 240 at block 315.
  • the applications interface 240 As the applications interface 240 receives the operational data in near real-time, it translates the data into a protocol used by the fault detection unit 125, and subsequently sends the data to the fault detection unit 125 at block 320. As previously discussed, the manner in which the applications interface 240 translates the data into the proper communications protocol is well known to those of ordinary skill in the art, and will differ depending on the particular type of fault detection software used.
  • the fault detection unit 125 after receiving the operational data from the applications interface 240, compares the operational data to a fault model at block 325.
  • the fault model includes operational data from other similar-type tools in which it was previously known that such tools manufactured silicon wafers within acceptable operational limits.
  • the fault detection unit 125 sends the results of the comparison to the applications interface 240 at block 330.
  • the applications interface 240 then translates the received results from the fault detection unit 125 into the CORBA IDL protocol used by the APC framework 120 at block 335.
  • the applications interface 240 then forwards the results to the plan executor 230 at block 340, which is typically done in the form of an alarm signal.
  • the plan executor 230 after receiving the alarm signal from the application interface 240, determines how to rectify the fault condition of the tool 105 at block 345 (providing that the tool 105 was actually deemed faulty).
  • Rectifying the fault condition by the plan executor 230 may include a control signal being sent to the equipment interface 1 10 to shut down the tool 105, and to provide instructions to a "fab" technician on how to clear the fault, for example.
  • the process in which the fault detection unit 125 determines how to rectify the fault condition is well within the knowledge of one of ordinary skill in the art. Accordingly, such process will not be discussed herein to avoid unnecessarily obscuring the present invention.
  • the operational data of the tool 105 is received in near real-time at the fault detection unit 250 before the batch processed by the tool 105 is complete.

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Quality & Reliability (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • General Factory Administration (AREA)
  • Numerical Control (AREA)
PCT/US2000/013724 1999-09-09 2000-05-19 Real-time fault detection Ceased WO2001018623A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP00932585A EP1218807B1 (en) 1999-09-09 2000-05-19 Real-time fault detection
DE60009324T DE60009324T2 (de) 1999-09-09 2000-05-19 Echtzeit-fehlererkennung
JP2001522153A JP4768942B2 (ja) 1999-09-09 2000-05-19 ほぼリアルタイムの欠陥検出をａｐｃフレームワークに統合するための方法および装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/393,176 US6556881B1 (en) 1999-09-09 1999-09-09 Method and apparatus for integrating near real-time fault detection in an APC framework
US09/393,176 1999-09-09

Publications (1)

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WO2001018623A1 true WO2001018623A1 (en) 2001-03-15

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US (1) US6556881B1 (enExample)
EP (1) EP1218807B1 (enExample)
JP (1) JP4768942B2 (enExample)
KR (1) KR100626859B1 (enExample)
DE (1) DE60009324T2 (enExample)
WO (1) WO2001018623A1 (enExample)

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US6556881B1 (en) 2003-04-29
JP2003508935A (ja) 2003-03-04
DE60009324T2 (de) 2005-02-24
KR20020063161A (ko) 2002-08-01
KR100626859B1 (ko) 2006-09-22
JP4768942B2 (ja) 2011-09-07
DE60009324D1 (de) 2004-04-29
EP1218807B1 (en) 2004-03-24

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