DE50310068D1 - Verfahren zur herstellung eines ptc-bauelements - Google Patents

Verfahren zur herstellung eines ptc-bauelements

Info

Publication number
DE50310068D1
DE50310068D1 DE50310068T DE50310068T DE50310068D1 DE 50310068 D1 DE50310068 D1 DE 50310068D1 DE 50310068 T DE50310068 T DE 50310068T DE 50310068 T DE50310068 T DE 50310068T DE 50310068 D1 DE50310068 D1 DE 50310068D1
Authority
DE
Germany
Prior art keywords
producing
ptc component
ptc
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE50310068T
Other languages
English (en)
Inventor
Lutz Kirsten
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Priority to DE50310068T priority Critical patent/DE50310068D1/de
Application granted granted Critical
Publication of DE50310068D1 publication Critical patent/DE50310068D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/021—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient formed as one or more layers or coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermistors And Varistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
DE50310068T 2002-04-23 2003-04-14 Verfahren zur herstellung eines ptc-bauelements Expired - Lifetime DE50310068D1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE50310068T DE50310068D1 (de) 2002-04-23 2003-04-14 Verfahren zur herstellung eines ptc-bauelements

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10218154A DE10218154A1 (de) 2002-04-23 2002-04-23 PTC-Bauelement und Verfahren zu dessen Herstellung
PCT/DE2003/001264 WO2003092019A1 (de) 2002-04-23 2003-04-14 Ptc-bauelement und verfahren zu dessen herstellung
DE50310068T DE50310068D1 (de) 2002-04-23 2003-04-14 Verfahren zur herstellung eines ptc-bauelements

Publications (1)

Publication Number Publication Date
DE50310068D1 true DE50310068D1 (de) 2008-08-14

Family

ID=29224698

Family Applications (2)

Application Number Title Priority Date Filing Date
DE10218154A Withdrawn DE10218154A1 (de) 2002-04-23 2002-04-23 PTC-Bauelement und Verfahren zu dessen Herstellung
DE50310068T Expired - Lifetime DE50310068D1 (de) 2002-04-23 2003-04-14 Verfahren zur herstellung eines ptc-bauelements

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE10218154A Withdrawn DE10218154A1 (de) 2002-04-23 2002-04-23 PTC-Bauelement und Verfahren zu dessen Herstellung

Country Status (5)

Country Link
US (1) US7633374B2 (de)
EP (1) EP1497838B1 (de)
JP (1) JP4302054B2 (de)
DE (2) DE10218154A1 (de)
WO (1) WO2003092019A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10218154A1 (de) 2002-04-23 2003-11-13 Epcos Ag PTC-Bauelement und Verfahren zu dessen Herstellung
JP3831363B2 (ja) * 2003-06-24 2006-10-11 Ｔｄｋ株式会社 有機質正特性サーミスタ及びその製造方法並びにその酸素含有量の測定方法
DE102006017796A1 (de) * 2006-04-18 2007-10-25 Epcos Ag Elektrisches Kaltleiter-Bauelement
TW200834612A (en) * 2007-02-05 2008-08-16 Du Pont Polymeric positive temperature coefficient thermistor and process for preparing the same
US8568647B2 (en) * 2007-11-09 2013-10-29 Bae Systems Plc Methods of fabricating structural elements
DE102008029426A1 (de) * 2008-06-23 2010-01-07 Epcos Ag Verfahren zur Herstellung eines Vielschichtbauelements, Vielschichtbauelement und Schablone
JP5293971B2 (ja) * 2009-09-30 2013-09-18 株式会社村田製作所 積層セラミック電子部品、および積層セラミック電子部品の製造方法
CN102810372A (zh) * 2012-08-10 2012-12-05 深圳顺络电子股份有限公司 负温度系数热敏电阻及其制备方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3533966A (en) * 1966-02-11 1970-10-13 Westinghouse Electric Corp Process for making current limiting devices
GB1186116A (en) 1966-12-19 1970-04-02 Nippon Telegraph & Telephone Improvements in or relating to the Production of High Dielectric Ceramics
JPS5823722B2 (ja) 1978-12-25 1983-05-17 ティーディーケイ株式会社 電圧非直線性抵抗体磁器の製造法
JPS5814044B2 (ja) 1978-12-26 1983-03-17 ティーディーケイ株式会社 正特性磁器
DE3019098C2 (de) 1980-05-19 1983-02-10 Siemens AG, 1000 Berlin und 8000 München Keramisches Kaltleitermaterial und Verfahren zu dessen Herstellung
JPS5760802A (en) 1980-09-30 1982-04-13 Tokyo Shibaura Electric Co Current limiting resistance element
JPH01186601A (ja) 1988-01-14 1989-07-26 Murata Mfg Co Ltd Ｖ↓２ｏ↓３系セラミクス抵抗体素子
JPH01233702A (ja) 1988-03-14 1989-09-19 Murata Mfg Co Ltd Ｖ↓２ｏ↓３系セラミクス抵抗体素子
JPH0547508A (ja) 1991-08-08 1993-02-26 Murata Mfg Co Ltd 積層型半導体磁器及びその製造方法
JPH06302403A (ja) 1993-04-16 1994-10-28 Murata Mfg Co Ltd 積層型半導体セラミック素子
US5879812A (en) 1995-06-06 1999-03-09 Murata Manufacturing Co., Ltd. Monolithic ceramic capacitor and method of producing the same
DE19719174A1 (de) 1997-05-06 1998-11-12 Siemens Matsushita Components Elektrisches Vielschichtbauelement
JP2000095562A (ja) 1998-07-24 2000-04-04 Murata Mfg Co Ltd 正特性サ―ミスタ用原料組成物、正特性サ―ミスタ用磁器、および正特性サ―ミスタ用磁器の製造方法
TW487742B (en) * 1999-05-10 2002-05-21 Matsushita Electric Ind Co Ltd Electrode for PTC thermistor, manufacture thereof, and PTC thermistor
JP2001126946A (ja) 1999-10-28 2001-05-11 Murata Mfg Co Ltd 積層セラミック電子部品及びその製造方法
DE10018377C1 (de) 2000-04-13 2001-12-06 Epcos Ag Keramisches Vielschichtbauelement und Verfahren zur Herstellung
JP3636075B2 (ja) * 2001-01-18 2005-04-06 株式会社村田製作所 積層ｐｔｃサーミスタ
DE10120517B4 (de) 2001-04-26 2013-06-06 Epcos Ag Elektrischer Vielschicht-Kaltleiter und Verfahren zu dessen Herstellung
EP1386334A1 (de) 2001-05-08 2004-02-04 Epcos Ag Keramisches vielschichtbauelement und verfahren zur herstellung
US20030198892A1 (en) 2002-04-22 2003-10-23 General Electric Company Limited play data storage media and method for limiting access to data thereon
DE10218154A1 (de) 2002-04-23 2003-11-13 Epcos Ag PTC-Bauelement und Verfahren zu dessen Herstellung

Also Published As

Publication number Publication date
JP4302054B2 (ja) 2009-07-22
EP1497838A1 (de) 2005-01-19
DE10218154A1 (de) 2003-11-13
WO2003092019A1 (de) 2003-11-06
JP2005524226A (ja) 2005-08-11
US7633374B2 (en) 2009-12-15
US20060132280A1 (en) 2006-06-22
EP1497838B1 (de) 2008-07-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition