DE50207747D1 - Bleifreies weichlot - Google Patents

Bleifreies weichlot

Info

Publication number
DE50207747D1
DE50207747D1 DE50207747T DE50207747T DE50207747D1 DE 50207747 D1 DE50207747 D1 DE 50207747D1 DE 50207747 T DE50207747 T DE 50207747T DE 50207747 T DE50207747 T DE 50207747T DE 50207747 D1 DE50207747 D1 DE 50207747D1
Authority
DE
Germany
Prior art keywords
weight
lead
free soft
free
aim
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE50207747T
Other languages
German (de)
English (en)
Inventor
Roland Pfarr
Herrmann Walter
Hermann Wald
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PFARR STANZTECHNIK GmbH
Original Assignee
PFARR STANZTECHNIK GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PFARR STANZTECHNIK GmbH filed Critical PFARR STANZTECHNIK GmbH
Priority to DE50207747T priority Critical patent/DE50207747D1/de
Application granted granted Critical
Publication of DE50207747D1 publication Critical patent/DE50207747D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Battery Electrode And Active Subsutance (AREA)
  • Organic Insulating Materials (AREA)
DE50207747T 2001-12-15 2002-12-10 Bleifreies weichlot Expired - Lifetime DE50207747D1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE50207747T DE50207747D1 (de) 2001-12-15 2002-12-10 Bleifreies weichlot

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10161826 2001-12-15
DE50207747T DE50207747D1 (de) 2001-12-15 2002-12-10 Bleifreies weichlot
PCT/DE2002/004525 WO2003051572A1 (de) 2001-12-15 2002-12-10 Bleifreies weichlot

Publications (1)

Publication Number Publication Date
DE50207747D1 true DE50207747D1 (de) 2006-09-14

Family

ID=7709452

Family Applications (1)

Application Number Title Priority Date Filing Date
DE50207747T Expired - Lifetime DE50207747D1 (de) 2001-12-15 2002-12-10 Bleifreies weichlot

Country Status (11)

Country Link
US (1) US20050008525A1 (https=)
EP (1) EP1453636B1 (https=)
JP (1) JP2005512813A (https=)
KR (1) KR20040063990A (https=)
CN (1) CN1310736C (https=)
AT (1) ATE334775T1 (https=)
BR (1) BR0215041A (https=)
DE (1) DE50207747D1 (https=)
HU (1) HUP0402010A2 (https=)
MX (1) MXPA04005835A (https=)
WO (1) WO2003051572A1 (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4791685B2 (ja) * 2003-05-22 2011-10-12 シャープ株式会社 導電性ボール、電極構造、電子部品の電極の形成方法、電子部品ならびに電子機器
DE102004038280B4 (de) 2004-08-03 2006-07-27 W.C. Heraeus Gmbh Verfahren zum Herstellen von Feinstlotpulvern
CN1314512C (zh) * 2005-01-28 2007-05-09 于大全 无铅钎料合金添加剂及无铅合金钎料
JP4322844B2 (ja) * 2005-06-10 2009-09-02 シャープ株式会社 半導体装置および積層型半導体装置
RU2302932C2 (ru) * 2005-07-11 2007-07-20 Тольяттинский государственный университет Способ изготовления припоя
TWI465312B (zh) * 2005-07-19 2014-12-21 日本斯倍利亞股份有限公司 追加供應用無鉛焊料及焊浴中之Ｃｕ濃度及Ｎｉ濃度之調整方法
JP4040644B2 (ja) * 2005-07-28 2008-01-30 シャープ株式会社 半田付け実装構造の製造方法および半田付け実装方法
DE102006047764A1 (de) * 2006-10-06 2008-04-10 W.C. Heraeus Gmbh Bleifreies Weichlot mit verbesserten Eigenschaften bei Temperaturen >150°C
DE202006015429U1 (de) * 2006-10-09 2008-02-21 Innowatec Dipl.-Ing. Grieger & Englert Gmbh & Co. Kg Vorrichtung zum Reinigen eines Druckzylinders
WO2008084603A1 (ja) * 2007-01-11 2008-07-17 Topy Kogyo Kabushiki Kaisha マニュアルソルダリング用無鉛はんだ合金
WO2009110458A1 (ja) * 2008-03-05 2009-09-11 千住金属工業株式会社 鉛フリーはんだ接続構造体およびはんだボール
US8395051B2 (en) * 2008-12-23 2013-03-12 Intel Corporation Doping of lead-free solder alloys and structures formed thereby
US8509731B2 (en) * 2009-11-06 2013-08-13 Research In Motion Limited Location determination for mobile devices in emergency situations
CN101885119B (zh) * 2010-06-25 2012-01-11 常熟市华银焊料有限公司 含V、Nd和Ge的Sn-Cu-Ni无铅钎料
RU2541249C2 (ru) * 2013-02-20 2015-02-10 Открытое акционерное общество "АВТОВАЗ" Способ изготовления припоя на основе олова
CN105750758A (zh) * 2016-04-29 2016-07-13 广东中实金属有限公司 一种高可靠性的低温无铅焊料及其制备方法
CN107502782B (zh) * 2017-10-24 2019-06-21 河南科技大学 铜合金热镀用稀土锡基合金及其制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5527628A (en) * 1993-07-20 1996-06-18 Iowa State University Research Foudation, Inc. Pb-free Sn-Ag-Cu ternary eutectic solder
US6224690B1 (en) * 1995-12-22 2001-05-01 International Business Machines Corporation Flip-Chip interconnections using lead-free solders
US6231691B1 (en) * 1997-02-10 2001-05-15 Iowa State University Research Foundation, Inc. Lead-free solder
US6231639B1 (en) * 1997-03-07 2001-05-15 Metaullics Systems Co., L.P. Modular filter for molten metal
DE19729545A1 (de) * 1997-07-10 1999-01-14 Euromat Gmbh Lotlegierung
US20020155024A1 (en) * 2000-10-27 2002-10-24 H-Technologies Group, Inc. Lead-free solder compositions
US6689488B2 (en) * 2001-02-09 2004-02-10 Taiho Kogyo Co., Ltd. Lead-free solder and solder joint
CN1346728A (zh) * 2001-09-19 2002-05-01 大连理工大学 含稀土多合金组元无铅钎料合金

Also Published As

Publication number Publication date
WO2003051572A1 (de) 2003-06-26
HUP0402010A2 (hu) 2005-01-28
MXPA04005835A (es) 2005-03-31
CN1310736C (zh) 2007-04-18
ATE334775T1 (de) 2006-08-15
CN1604832A (zh) 2005-04-06
US20050008525A1 (en) 2005-01-13
EP1453636A1 (de) 2004-09-08
JP2005512813A (ja) 2005-05-12
KR20040063990A (ko) 2004-07-15
BR0215041A (pt) 2004-11-03
EP1453636B1 (de) 2006-08-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition