DE4025144C2 - - Google Patents

Info

Publication number
DE4025144C2
DE4025144C2 DE4025144A DE4025144A DE4025144C2 DE 4025144 C2 DE4025144 C2 DE 4025144C2 DE 4025144 A DE4025144 A DE 4025144A DE 4025144 A DE4025144 A DE 4025144A DE 4025144 C2 DE4025144 C2 DE 4025144C2
Authority
DE
Germany
Prior art keywords
light
channel
emitting
side wall
front surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE4025144A
Other languages
German (de)
English (en)
Other versions
DE4025144A1 (de
Inventor
Toshitaka Aoyagi
Kimio Itami Hyogo Jp Shigihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE4025144A1 publication Critical patent/DE4025144A1/de
Application granted granted Critical
Publication of DE4025144C2 publication Critical patent/DE4025144C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4031—Edge-emitting structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S2301/00—Functional characteristics
    • H01S2301/16—Semiconductor lasers with special structural design to influence the modes, e.g. specific multimode
    • H01S2301/166—Single transverse or lateral mode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/0201—Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
    • H01S5/0203—Etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
    • H01S5/0286—Coatings with a reflectivity that is not constant over the facets, e.g. apertures
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/095—Laser devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/099—LED, multicolor

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Lasers (AREA)
  • Led Devices (AREA)
DE4025144A 1989-08-17 1990-08-08 Verfahren zum selektiven beschichten lichtemittierender halbleitereinrichtungen Granted DE4025144A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1212743A JP2768988B2 (ja) 1989-08-17 1989-08-17 端面部分コーティング方法

Publications (2)

Publication Number Publication Date
DE4025144A1 DE4025144A1 (de) 1991-02-28
DE4025144C2 true DE4025144C2 (US06524379-20030225-C00019.png) 1993-05-06

Family

ID=16627692

Family Applications (1)

Application Number Title Priority Date Filing Date
DE4025144A Granted DE4025144A1 (de) 1989-08-17 1990-08-08 Verfahren zum selektiven beschichten lichtemittierender halbleitereinrichtungen

Country Status (3)

Country Link
US (1) US5185290A (US06524379-20030225-C00019.png)
JP (1) JP2768988B2 (US06524379-20030225-C00019.png)
DE (1) DE4025144A1 (US06524379-20030225-C00019.png)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5328854A (en) * 1993-03-31 1994-07-12 At&T Bell Laboratories Fabrication of electronic devices with an internal window
IL106892A0 (en) * 1993-09-02 1993-12-28 Pierre Badehi Methods and apparatus for producing integrated circuit devices
IL108359A (en) * 1994-01-17 2001-04-30 Shellcase Ltd Method and device for creating integrated circular devices
US5885425A (en) * 1995-06-06 1999-03-23 International Business Machines Corporation Method for selective material deposition on one side of raised or recessed features
EP0856894A1 (en) * 1997-01-31 1998-08-05 Hewlett-Packard Company Coating deposition on a semiconductor optical device
US6289030B1 (en) 1997-01-31 2001-09-11 Hewlett-Packard Company Fabrication of semiconductor devices
JP3587081B2 (ja) 1999-05-10 2004-11-10 豊田合成株式会社 Ｉｉｉ族窒化物半導体の製造方法及びｉｉｉ族窒化物半導体発光素子
JP3555500B2 (ja) * 1999-05-21 2004-08-18 豊田合成株式会社 Ｉｉｉ族窒化物半導体及びその製造方法
US6580098B1 (en) * 1999-07-27 2003-06-17 Toyoda Gosei Co., Ltd. Method for manufacturing gallium nitride compound semiconductor
JP4432180B2 (ja) * 1999-12-24 2010-03-17 豊田合成株式会社 Ｉｉｉ族窒化物系化合物半導体の製造方法、ｉｉｉ族窒化物系化合物半導体素子及びｉｉｉ族窒化物系化合物半導体
JP2001185493A (ja) * 1999-12-24 2001-07-06 Toyoda Gosei Co Ltd Ｉｉｉ族窒化物系化合物半導体の製造方法及びｉｉｉ族窒化物系化合物半導体素子
US6596557B1 (en) * 2000-03-02 2003-07-22 Orchid Lightwave Communications, Inc. Integrated optical devices and methods of making such devices
US7141444B2 (en) * 2000-03-14 2006-11-28 Toyoda Gosei Co., Ltd. Production method of III nitride compound semiconductor and III nitride compound semiconductor element
JP2001267242A (ja) * 2000-03-14 2001-09-28 Toyoda Gosei Co Ltd Ｉｉｉ族窒化物系化合物半導体及びその製造方法
TW518767B (en) * 2000-03-31 2003-01-21 Toyoda Gosei Kk Production method of III nitride compound semiconductor and III nitride compound semiconductor element
JP2001313259A (ja) * 2000-04-28 2001-11-09 Toyoda Gosei Co Ltd Ｉｉｉ族窒化物系化合物半導体基板の製造方法及び半導体素子
JP3864670B2 (ja) * 2000-05-23 2007-01-10 豊田合成株式会社 Ｉｉｉ族窒化物系化合物半導体発光素子の製造方法
US7619261B2 (en) * 2000-08-07 2009-11-17 Toyoda Gosei Co., Ltd. Method for manufacturing gallium nitride compound semiconductor
KR20030074824A (ko) * 2001-02-14 2003-09-19 도요다 고세이 가부시키가이샤 반도체 결정의 제조 방법 및 반도체 발광 소자
JP2002280314A (ja) * 2001-03-22 2002-09-27 Toyoda Gosei Co Ltd Ｉｉｉ族窒化物系化合物半導体の製造方法、及びそれに基づくｉｉｉ族窒化物系化合物半導体素子
JP3690326B2 (ja) * 2001-10-12 2005-08-31 豊田合成株式会社 Ｉｉｉ族窒化物系化合物半導体の製造方法
GB0127690D0 (en) * 2001-11-19 2002-01-09 Denselight Semiconductors Pte Coating of optical device facets at the wafer-level
US20040187092A1 (en) * 2003-03-20 2004-09-23 Toshiba Tec Kabushiki Kaisha Apparatus and method for performing the management of devices
JP4529372B2 (ja) * 2003-04-23 2010-08-25 日亜化学工業株式会社 半導体レーザ素子
JP2005327783A (ja) 2004-05-12 2005-11-24 Sony Corp 半導体レーザ
EP1886388B1 (en) * 2005-06-01 2015-03-18 Binoptics Corporation Spatial filters
JP4967283B2 (ja) * 2005-09-12 2012-07-04 株式会社デンソー 半導体光学装置
JP4241764B2 (ja) * 2006-06-07 2009-03-18 豊田合成株式会社 Ｉｉｉ族窒化物系化合物半導体発光素子
KR101053111B1 (ko) 2011-02-28 2011-08-01 박건 실리콘 기판을 이용한 질화물계 발광소자 및 그 제조 방법
DE102011054954A1 (de) 2011-10-31 2013-05-02 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils und optoelektronischer Halbleiterlaser
DE102012106943B4 (de) * 2012-07-30 2019-06-27 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer Halbleiterlaserdiode und Halbleiterlaserdiode
DE102012215265B4 (de) * 2012-08-28 2022-09-22 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zum herstellen einer laserdiode, halterung und laserdiode
JP6257361B2 (ja) * 2014-02-04 2018-01-10 三菱電機株式会社 半導体レーザアレイ
CN106795649B (zh) * 2015-04-17 2019-12-17 富士电机株式会社 半导体的制造方法以及SiC基板
DE102017117135A1 (de) 2017-07-28 2019-01-31 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer Mehrzahl von Laserdioden und Laserdiode
DE102017117136B4 (de) 2017-07-28 2022-09-22 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung einer Mehrzahl von Laserdioden und Laserdiode
US20200135464A1 (en) * 2018-10-30 2020-04-30 Applied Materials, Inc. Methods and apparatus for patterning substrates using asymmetric physical vapor deposition
DE102021125119A1 (de) * 2021-09-28 2023-03-30 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Kantenemittierende halbleiterlaserdioden und verfahren zur herstellung einer vielzahl kantenemittierender halbleiterlaserdioden

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3851379A (en) * 1973-05-16 1974-12-03 Westinghouse Electric Corp Solid state components
JPS52147063A (en) * 1976-06-02 1977-12-07 Toshiba Corp Semiconductor electrode forming method
GB2182168B (en) * 1985-10-25 1989-10-25 Hitachi Ltd Phased-array semiconductor laser apparatus
JPS62147790A (ja) * 1985-12-23 1987-07-01 Hitachi Ltd フエ−ズロツクアレ−半導体レ−ザ
JPS6298320A (ja) * 1985-10-25 1987-05-07 Hitachi Ltd フエ−ズドアレ−半導体レ−ザ光学系
DE3611167A1 (de) * 1986-04-03 1987-10-08 Siemens Ag Array mit verkoppelten optischen wellenleitern
DE68915763T2 (de) * 1989-09-07 1994-12-08 Ibm Verfahren zur Spiegelpassivierung bei Halbleiterlaserdioden.

Also Published As

Publication number Publication date
JP2768988B2 (ja) 1998-06-25
US5185290A (en) 1993-02-09
JPH0376189A (ja) 1991-04-02
DE4025144A1 (de) 1991-02-28

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)