DE3854540D1 - Behandlungsapparat und Verfahren. - Google Patents

Behandlungsapparat und Verfahren.

Info

Publication number
DE3854540D1
DE3854540D1 DE3854540T DE3854540T DE3854540D1 DE 3854540 D1 DE3854540 D1 DE 3854540D1 DE 3854540 T DE3854540 T DE 3854540T DE 3854540 T DE3854540 T DE 3854540T DE 3854540 D1 DE3854540 D1 DE 3854540D1
Authority
DE
Germany
Prior art keywords
procedure
treatment apparatus
treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE3854540T
Other languages
English (en)
Other versions
DE3854540T2 (de
Inventor
Cecil J Davis
Lee M Loewenstein
Robert T Matthews
John I Jones
Rhett B Jucha
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of DE3854540D1 publication Critical patent/DE3854540D1/de
Publication of DE3854540T2 publication Critical patent/DE3854540T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/48Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
    • C23C16/482Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation using incoherent light, UV to IR, e.g. lamps
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/517Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using a combination of discharges covered by two or more of groups C23C16/503 - C23C16/515
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54Apparatus specially adapted for continuous coating
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Environmental & Geological Engineering (AREA)
  • Toxicology (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE3854540T 1987-07-17 1988-06-23 Behandlungsapparat und Verfahren. Expired - Lifetime DE3854540T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/075,016 US4842686A (en) 1987-07-17 1987-07-17 Wafer processing apparatus and method

Publications (2)

Publication Number Publication Date
DE3854540D1 true DE3854540D1 (de) 1995-11-09
DE3854540T2 DE3854540T2 (de) 1996-03-07

Family

ID=22123018

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3854540T Expired - Lifetime DE3854540T2 (de) 1987-07-17 1988-06-23 Behandlungsapparat und Verfahren.

Country Status (5)

Country Link
US (1) US4842686A (de)
EP (1) EP0300217B1 (de)
JP (1) JPH02146744A (de)
KR (1) KR970000202B1 (de)
DE (1) DE3854540T2 (de)

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US6105435A (en) 1997-10-24 2000-08-22 Cypress Semiconductor Corp. Circuit and apparatus for verifying a chamber seal, and method of depositing a material onto a substrate using the same
US6079353A (en) * 1998-03-28 2000-06-27 Quester Technology, Inc. Chamber for reducing contamination during chemical vapor deposition
US6265033B1 (en) 1998-09-11 2001-07-24 Donald Bennett Hilliard Method for optically coupled vapor deposition
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EP1717355B1 (de) * 2004-02-02 2013-11-20 Shin-Etsu Handotai Co., Ltd. Herstellungsvorrichtung und herstellungsverfahren für siliciumeinkristall und siliciumwafer
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JP2006114848A (ja) * 2004-10-18 2006-04-27 Apex Corp 紫外線照射処理装置、紫外線照射処理方法及び半導体製造装置
US7531426B2 (en) * 2005-08-19 2009-05-12 Honeywell International Inc. Approach to high temperature wafer processing
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KR102118769B1 (ko) 2013-04-15 2020-06-03 에이비 엘렉트로룩스 로봇 진공 청소기
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CN105849660B (zh) 2013-12-19 2020-05-08 伊莱克斯公司 机器人清扫装置
US10617271B2 (en) 2013-12-19 2020-04-14 Aktiebolaget Electrolux Robotic cleaning device and method for landmark recognition
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KR102116596B1 (ko) 2013-12-19 2020-05-28 에이비 엘렉트로룩스 나선형 패턴으로 이동하는 사이드 브러시를 구비한 로봇 진공 청소기
CN105793790B (zh) 2013-12-19 2022-03-04 伊莱克斯公司 优先化清洁区域
WO2015090439A1 (en) 2013-12-20 2015-06-25 Aktiebolaget Electrolux Dust container
JP6513709B2 (ja) 2014-07-10 2019-05-15 アクチエボラゲット エレクトロルックス ロボット型清掃装置における計測誤差を検出する方法、ロボット型清掃装置、コンピュータプログラムおよびコンピュータプログラムプロダクト
US10729297B2 (en) 2014-09-08 2020-08-04 Aktiebolaget Electrolux Robotic vacuum cleaner
KR102271785B1 (ko) 2014-09-08 2021-06-30 에이비 엘렉트로룩스 로봇 진공 청소기
WO2016091291A1 (en) 2014-12-10 2016-06-16 Aktiebolaget Electrolux Using laser sensor for floor type detection
US10874271B2 (en) 2014-12-12 2020-12-29 Aktiebolaget Electrolux Side brush and robotic cleaner
JP6532530B2 (ja) 2014-12-16 2019-06-19 アクチエボラゲット エレクトロルックス ロボット掃除機の掃除方法
KR102339531B1 (ko) 2014-12-16 2021-12-16 에이비 엘렉트로룩스 로봇 청소 장치를 위한 경험-기반의 로드맵
EP3282912B1 (de) 2015-04-17 2020-06-10 Aktiebolaget Electrolux Reinigungsroboter und ein verfahren zur steuerung des reinigungsroboters
WO2017036532A1 (en) 2015-09-03 2017-03-09 Aktiebolaget Electrolux System of robotic cleaning devices
WO2017157421A1 (en) 2016-03-15 2017-09-21 Aktiebolaget Electrolux Robotic cleaning device and a method at the robotic cleaning device of performing cliff detection
US11122953B2 (en) 2016-05-11 2021-09-21 Aktiebolaget Electrolux Robotic cleaning device
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Also Published As

Publication number Publication date
EP0300217A2 (de) 1989-01-25
DE3854540T2 (de) 1996-03-07
EP0300217B1 (de) 1995-10-04
US4842686A (en) 1989-06-27
KR970000202B1 (ko) 1997-01-06
KR890002976A (ko) 1989-04-12
JPH02146744A (ja) 1990-06-05
EP0300217A3 (en) 1989-04-12

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